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MSP430F47196IPZR

Texas Instruments

MSP430F47196IPZR by Texas Instruments

MSP430F47196IPZR by Texas Instruments is a 16-bit microcontroller with 122880 ROM words and 4 RAM words. It features 6-Ch 12-Bit ADC channels, 3 DMA channels, and operates at a max clock frequency of 16 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$7.332

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,600 parts In-Stock

1+ parts

$7.332

100+ parts

$5.978

1k+ parts

$3.985

10k+ parts

-

2,600

$7.332

$5.978

$3.985

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,668 parts In-Stock

1+ parts

$6.965

100+ parts

-

1k+ parts

-

10k+ parts

-

4,668

$6.965

-

-

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Vyrian

USA . 6,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

6,071

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 924 parts In-Stock

1+ parts

$6.599

100+ parts

-

1k+ parts

-

10k+ parts

-

924

$6.599

-

-

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AZTECH Wire

Italy . 603 parts In-Stock

1+ parts

$15.080

100+ parts

-

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-

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603

$15.080

-

-

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Microchip USA

USA . 2,176 parts In-Stock

1+ parts

$15.210

100+ parts

$15.000

1k+ parts

$14.890

10k+ parts

$14.780

2,176

$15.210

$15.000

$14.890

$14.780

Parana Technologies

USA . 208 parts In-Stock

1+ parts

$31.675

100+ parts

-

1k+ parts

$86.634

10k+ parts

-

208

$31.675

-

$86.634

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ChromeModa Solutions

Germany . 2,556 parts In-Stock

1+ parts

$35.590

100+ parts

$29.184

1k+ parts

-

10k+ parts

-

2,556

$35.590

$29.184

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IDEA Electronic Components Group

UK . 119 parts In-Stock

1+ parts

$35.590

100+ parts

$33.810

1k+ parts

$32.031

10k+ parts

-

119

$35.590

$33.810

$32.031

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Perfect Parts

USA . 1,523 parts In-Stock

1+ parts

-

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1,523

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DigiPath Technology Company

USA . 609 parts In-Stock

1+ parts

-

100+ parts

$32.088

1k+ parts

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609

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$32.088

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F47196IPZR microcontroller! Built by a trusted manufacturer, this product offers unparalleled quality and reliability. Ideal for a variety of applications, this microcontroller provides low power consumption, high performance, and versatile connectivity options. With features like multiple ADC channels, DMA channels, and PWM channels, this product delivers exceptional value to customers looking to create cutting-edge electronic designs. Experience the difference with the MSP430F47196IPZR and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating different voltage requirements.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components and peripherals.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller allows for efficient and fast processing of instructions.

ROM Programmability: FLASH

Flash ROM allows for easy and quick reprogramming of the microcontroller, enabling flexibility in application development.

Connectivity: "I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)

Offers a wide range of communication interfaces, making it versatile and compatible with various devices and protocols.

Technical Specifications

Microcontrollers MSP430F47196IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 4.15MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

68

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)"

Peripherals:

"BOD, COMPARATOR(2), DMA(3), RTC, TIMER(7), WDT"

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

MSP430F47196IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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