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MSP430F47193IPZR

Texas Instruments

MSP430F47193IPZR by Texas Instruments

MSP430F47193IPZR by Texas Instruments is a 16-bit microcontroller with 122880 ROM words and 4 RAM words. It features 3 ADC channels, 3 DMA channels, and 7 timers suitable for industrial applications requiring low power consumption. With a max clock frequency of 16 MHz, it offers various connectivity options like I2C, SPI, and UART for versatile system integration.

Median Price

$11.928

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,500 parts In-Stock

1+ parts

$8.587

100+ parts

$7.501

1k+ parts

$5.173

10k+ parts

-

11,500

$8.587

$7.501

$5.173

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Mouser Electronics

USA . 114 parts In-Stock

1+ parts

$15.270

100+ parts

$9.800

1k+ parts

$8.100

10k+ parts

-

114

$15.270

$9.800

$8.100

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,206 parts In-Stock

1+ parts

$8.158

100+ parts

-

1k+ parts

-

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4,206

$8.158

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Vyrian

USA . 3,495 parts In-Stock

1+ parts

$8.587

100+ parts

-

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-

10k+ parts

-

3,495

$8.587

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,635 parts In-Stock

1+ parts

$7.728

100+ parts

-

1k+ parts

-

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-

3,635

$7.728

-

-

-

Parana Technologies

USA . 416 parts In-Stock

1+ parts

$47.679

100+ parts

-

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-

10k+ parts

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416

$47.679

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-

-

ChromeModa Solutions

Germany . 2,989 parts In-Stock

1+ parts

$53.572

100+ parts

$43.929

1k+ parts

-

10k+ parts

-

2,989

$53.572

$43.929

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-

IDEA Electronic Components Group

UK . 264 parts In-Stock

1+ parts

$53.572

100+ parts

$50.893

1k+ parts

$48.215

10k+ parts

-

264

$53.572

$50.893

$48.215

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$55.372

100+ parts

$54.818

1k+ parts

$52.603

10k+ parts

-

300

$55.372

$54.818

$52.603

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DigiPath Technology Company

USA . 1,139 parts In-Stock

1+ parts

-

100+ parts

$48.301

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-

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1,139

-

$48.301

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Futuretech Components

Singapore . 830 parts In-Stock

1+ parts

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830

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Perfect Parts

USA . 674 parts In-Stock

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674

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Overview

Enhance your product designs with the Texas Instruments MSP430F47193IPZR microcontroller, a top-quality solution for various applications. With its cutting-edge technology and reliable performance, this device offers customers unparalleled value and benefits. From industrial automation to consumer electronics, this microcontroller provides efficient connectivity, low power consumption, and advanced features like PWM channels and multiple timers. Trust Texas Instruments for superior quality and innovation in microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective construction material for the package, ensuring long-term reliability and affordability.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in power supply options.

On Chip Data RAM Width: 8

Wide data RAM width allows for efficient data processing and storage on the chip.

Bit Size: 16

16-bit architecture provides higher computational power and precision for applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and streamlined processing of instructions, enhancing performance.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory, improving overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and streamlined processing of instructions, enhancing performance.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture levels, suitable for a wide range of operating environments.

Technical Specifications

Microcontrollers MSP430F47193IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 4.15MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)"

Peripherals:

"BOD, COMPARATOR(2), DMA(3), RTC, TIMER(7), WDT"

Analog To Digital Convertors:

3-Ch 12-Bit

Trade Compliance

MSP430F47193IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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