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MSP430F47173IPZ

Texas Instruments

MSP430F47173IPZ by Texas Instruments

MSP430F47173IPZ by Texas Instruments is a 16-bit microcontroller with 8KB RAM, 3 ADC channels, and 7 timers. Ideal for industrial applications due to its low power mode, operating temperature range of -40 to 85°C, and connectivity options like I2C and SPI. Package style: flatpack with a max clock frequency of 16MHz.

Median Price

$7.598

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 40 parts In-Stock

1+ parts

$4.200

100+ parts

-

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40

$4.200

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Arrow

USA . 40 parts In-Stock

1+ parts

$7.598

100+ parts

-

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-

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40

$7.598

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Verical

USA . 40 parts In-Stock

1+ parts

$7.598

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40

$7.598

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Texas Instruments

USA . 1,525 parts In-Stock

1+ parts

$11.235

100+ parts

$9.159

1k+ parts

$6.106

10k+ parts

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1,525

$11.235

$9.159

$6.106

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,568 parts In-Stock

1+ parts

$3.000

100+ parts

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3,568

$3.000

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Vyrian

USA . 5,352 parts In-Stock

1+ parts

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5,352

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 514 parts In-Stock

1+ parts

$2.842

100+ parts

-

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514

$2.842

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AZTECH Wire

Italy . 805 parts In-Stock

1+ parts

$11.350

100+ parts

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805

$11.350

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Parana Technologies

USA . 1,845 parts In-Stock

1+ parts

$25.854

100+ parts

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1k+ parts

$26.451

10k+ parts

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1,845

$25.854

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$26.451

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Microchip USA

USA . 1,652 parts In-Stock

1+ parts

$28.150

100+ parts

$27.740

1k+ parts

$27.540

10k+ parts

$27.340

1,652

$28.150

$27.740

$27.540

$27.340

DigiPath Technology Company

USA . 1,201 parts In-Stock

1+ parts

$28.468

100+ parts

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1,201

$28.468

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ChromeModa Solutions

Germany . 5,777 parts In-Stock

1+ parts

$29.049

100+ parts

$23.820

1k+ parts

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5,777

$29.049

$23.820

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IDEA Electronic Components Group

UK . 2,194 parts In-Stock

1+ parts

$29.049

100+ parts

$27.597

1k+ parts

$26.144

10k+ parts

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2,194

$29.049

$27.597

$26.144

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Overview

Elevate your projects with the Texas Instruments MSP430F47173IPZ microcontroller. With cutting-edge technology and a reputation for excellence, Texas Instruments delivers top-notch quality in the microcontroller category. This versatile device offers a wide range of applications, from IoT devices to industrial automation. Experience seamless integration, superior performance, and unmatched reliability with the MSP430F47173IPZ. Trust Texas Instruments to provide the value, benefits, and advantages that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Maximum Supply Voltage: 3.6 V

Allows for flexible power supply options.

CPU Family: MSP430

MSP430 family is known for its low power consumption and high performance, making it a reliable choice for energy-efficient applications.

ROM Words: 94208

Features a large memory capacity, allowing for storing a significant amount of data and program instructions.

ADC Channels: YES

Integration of analog-to-digital converters simplifies interfacing with sensors and other analog components.

Maximum Clock Frequency: 16 MHz

Provides high-speed processing capabilities for executing tasks efficiently.

Connectivity: "I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)

Supports a wide range of communication protocols, enabling easy integration with various peripherals and devices.

Low Power Mode: YES

Enables power-efficient operation, extending battery life and reducing overall energy consumption.

Technical Specifications

Microcontrollers MSP430F47173IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 4.15MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), LIN(2), SCI(4), SPI(4), UART(2)"

Peripherals:

"BOD, COMPARATOR(2), DMA(3), RTC, TIMER(7), WDT"

Analog To Digital Convertors:

3-Ch 12-Bit

Trade Compliance

MSP430F47173IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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