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MSP430F46181IPZ

Texas Instruments

MSP430F46181IPZ by Texas Instruments

MSP430F46181IPZ by Texas Instruments is a 16-bit microcontroller with 8KB RAM, 118784 ROM words, and 16 ADC channels. Ideal for industrial applications, it offers low power mode, 11 timers, and various peripherals like BOD and DMA for efficient performance at a max clock frequency of 8MHz.

Median Price

$13.076

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,280 parts In-Stock

1+ parts

$13.076

100+ parts

$11.422

1k+ parts

$7.877

10k+ parts

-

1,280

$13.076

$11.422

$7.877

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,371 parts In-Stock

1+ parts

$12.422

100+ parts

-

1k+ parts

-

10k+ parts

-

4,371

$12.422

-

-

-

Vyrian

USA . 3,545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,545

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 235 parts In-Stock

1+ parts

$11.768

100+ parts

-

1k+ parts

-

10k+ parts

-

235

$11.768

-

-

-

AZTECH Wire

Italy . 286 parts In-Stock

1+ parts

$16.520

100+ parts

-

1k+ parts

-

10k+ parts

-

286

$16.520

-

-

-

Microchip USA

USA . 1,735 parts In-Stock

1+ parts

$36.310

100+ parts

$35.790

1k+ parts

$35.530

10k+ parts

$35.270

1,735

$36.310

$35.790

$35.530

$35.270

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$44.910

100+ parts

$40.868

1k+ parts

$36.826

10k+ parts

-

2,000

$44.910

$40.868

$36.826

-

Parana Technologies

USA . 332 parts In-Stock

1+ parts

$64.618

100+ parts

$6,000.803

1k+ parts

$58.157

10k+ parts

-

332

$64.618

$6,000.803

$58.157

-

DigiPath Technology Company

USA . 1,157 parts In-Stock

1+ parts

$71.153

100+ parts

$65.461

1k+ parts

-

10k+ parts

-

1,157

$71.153

$65.461

-

-

IDEA Electronic Components Group

UK . 858 parts In-Stock

1+ parts

$72.605

100+ parts

$68.975

1k+ parts

$65.344

10k+ parts

-

858

$72.605

$68.975

$65.344

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ChromeModa Solutions

Germany . 523 parts In-Stock

1+ parts

$72.605

100+ parts

$59.536

1k+ parts

-

10k+ parts

-

523

$72.605

$59.536

-

-

Overview

Unlock the power of cutting-edge technology with the MSP430F46181IPZ microcontroller by Texas Instruments. Designed with precision and expertise, this high-quality product offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value, efficiency, and innovation. Experience seamless connectivity, low power consumption, and advanced features that will elevate your projects to new heights. Trust Texas Instruments to provide you with the tools you need to succeed in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides durability and reliability to the microcontroller, making it a suitable choice for various applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows for flexibility in power supply options and compatibility with different systems.

CPU Family: MSP430

Being part of the MSP430 family ensures high performance, low power consumption, and a wide range of peripherals, making it a versatile microcontroller for various applications.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the microcontroller's firmware, enabling flexibility and adaptability in system designs.

Analog To Digital Convertors: 16-Ch 12-Bit

Having 16 analog to digital converters with 12-bit resolution provides accurate and reliable conversion of analog signals, making it suitable for applications requiring precise measurements.

Connectivity: I2C, IRDA, SCI(2), SPI(3), UART(3)

Multiple connectivity options such as I2C, IRDA, SCI, SPI, and UART enable easy integration with other devices and systems, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers MSP430F46181IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 3MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

80

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

118784

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.74 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(3), UART(3)"

Peripherals:

"BOD, COMPARATOR, DMA(3), LCD, TIMER(11), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F46181IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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