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MSP430F4617IPZ

Texas Instruments

MSP430F4617IPZ by Texas Instruments

MSP430F4617IPZ by Texas Instruments is a 16-bit microcontroller with 8KB RAM, 80 I/O lines, and 16-Ch 12-Bit ADC channels. Ideal for industrial applications due to its low power mode, operating temperature range of -40 to 85°C, and connectivity options like I2C, SPI, UART.

Median Price

$12.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,720 parts In-Stock

1+ parts

$12.550

100+ parts

$10.962

1k+ parts

$7.560

10k+ parts

-

1,720

$12.550

$10.962

$7.560

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,631 parts In-Stock

1+ parts

$11.922

100+ parts

-

1k+ parts

-

10k+ parts

-

2,631

$11.922

-

-

-

Vyrian

USA . 4,535 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,535

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 189 parts In-Stock

1+ parts

$11.295

100+ parts

-

1k+ parts

-

10k+ parts

-

189

$11.295

-

-

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AZTECH Wire

Italy . 894 parts In-Stock

1+ parts

$17.000

100+ parts

-

1k+ parts

-

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-

894

$17.000

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-

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Parana Technologies

USA . 1,125 parts In-Stock

1+ parts

$32.539

100+ parts

-

1k+ parts

$107.215

10k+ parts

-

1,125

$32.539

-

$107.215

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Microchip USA

USA . 2,252 parts In-Stock

1+ parts

$34.850

100+ parts

$34.350

1k+ parts

$34.100

10k+ parts

$33.850

2,252

$34.850

$34.350

$34.100

$33.850

ChromeModa Solutions

Germany . 6,595 parts In-Stock

1+ parts

$36.561

100+ parts

$29.980

1k+ parts

-

10k+ parts

-

6,595

$36.561

$29.980

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-

IDEA Electronic Components Group

UK . 911 parts In-Stock

1+ parts

$36.561

100+ parts

$34.733

1k+ parts

$32.905

10k+ parts

-

911

$36.561

$34.733

$32.905

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DigiPath Technology Company

USA . 1,285 parts In-Stock

1+ parts

-

100+ parts

$32.963

1k+ parts

-

10k+ parts

-

1,285

-

$32.963

-

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F4617IPZ microcontroller. Designed for high-quality performance and reliability, this versatile device offers a wide range of applications in various industries. Packed with features like low power mode, multiple timers, PWM channels, and 16-channel 12-bit ADC, this microcontroller provides unparalleled value to customers looking to create cutting-edge solutions. Trust in Texas Instruments' reputation for excellence and choose the MSP430F4617IPZ for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides good protection for the microcontroller, making it durable and resistant to external elements.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in powering the microcontroller and compatibility with a wide range of applications.

CPU Family: MSP430

Being part of the MSP430 family ensures reliable performance and compatibility with existing MSP430-based systems and tools.

ROM Programmability: FLASH

Flash programmability allows for easy and efficient programming of the microcontroller, making it versatile and adaptable for different applications.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and signals, expanding its range of functionalities.

DMA Channels: YES

DMA channels help to offload data transfer tasks from the CPU, improving efficiency and performance of the microcontroller.

Peripherals: BOD, COMPARATOR, DMA(3), LCD, TIMER(11), WDT

Rich set of peripherals such as comparator, LCD, and multiple timers provide additional features and capabilities for complex applications.

Connectivity: I2C, IRDA, SCI(2), SPI(3), UART(3)

Support for various communication protocols like I2C, SPI, and UART enhances the connectivity options of the microcontroller, enabling seamless integration with other devices.

Speed: 8 rpm

The 8 MHz maximum clock frequency allows for fast processing and response times, making the microcontroller suitable for real-time applications.

Low Power Mode: YES

Low power mode capability helps in reducing power consumption, extending battery life, and making the microcontroller more energy-efficient.

Technical Specifications

Microcontrollers MSP430F4617IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES 3MHZ AT MINI 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

80

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.74 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(3), UART(3)"

Peripherals:

"BOD, COMPARATOR, DMA(3), LCD, TIMER(11), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F4617IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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