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MSP430F4491IPZ

Texas Instruments

MSP430F4491IPZ by Texas Instruments

MSP430F4491IPZ by Texas Instruments is a 16-bit microcontroller with 48 I/O lines, 8 MHz clock frequency, and 2/3.3 V power supplies. Ideal for industrial applications requiring low power consumption, it features peripherals like comparator, LCD, and timers for efficient performance in various embedded systems.

Median Price

$11.844

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,060 parts In-Stock

1+ parts

$11.844

100+ parts

$9.656

1k+ parts

$6.437

10k+ parts

-

5,060

$11.844

$9.656

$6.437

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 925 parts In-Stock

1+ parts

$11.252

100+ parts

-

1k+ parts

-

10k+ parts

-

925

$11.252

-

-

-

Vyrian

USA . 2,199 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,199

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,067 parts In-Stock

1+ parts

$10.660

100+ parts

-

1k+ parts

-

10k+ parts

-

1,067

$10.660

-

-

-

AZTECH Wire

Italy . 110 parts In-Stock

1+ parts

$10.690

100+ parts

-

1k+ parts

-

10k+ parts

-

110

$10.690

-

-

-

Microchip USA

USA . 2,213 parts In-Stock

1+ parts

$29.670

100+ parts

$29.250

1k+ parts

$29.040

10k+ parts

$28.820

2,213

$29.670

$29.250

$29.040

$28.820

Parana Technologies

USA . 1,160 parts In-Stock

1+ parts

$74.637

100+ parts

-

1k+ parts

-

10k+ parts

-

1,160

$74.637

-

-

-

DigiPath Technology Company

USA . 529 parts In-Stock

1+ parts

$82.185

100+ parts

$75.610

1k+ parts

-

10k+ parts

-

529

$82.185

$75.610

-

-

ChromeModa Solutions

Germany . 2,084 parts In-Stock

1+ parts

$83.862

100+ parts

$68.767

1k+ parts

-

10k+ parts

-

2,084

$83.862

$68.767

-

-

IDEA Electronic Components Group

UK . 1,470 parts In-Stock

1+ parts

$83.862

100+ parts

$79.669

1k+ parts

$75.476

10k+ parts

-

1,470

$83.862

$79.669

$75.476

-

Overview

Unlock the power of cutting-edge technology with the MSP430F4491IPZ by Texas Instruments. As a leader in microcontroller innovation, Texas Instruments delivers top-quality products that set the industry standard. Ideal for a wide range of applications, this microcontroller offers unmatched performance and reliability. Experience seamless connectivity, efficient power management, and advanced features that will elevate your projects to new heights. Trust Texas Instruments for superior quality and unmatched value. Elevate your designs with the MSP430F4491IPZ today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation and compact design, suitable for various applications.

Maximum Supply Voltage: 3.6 V

Supports a wide range of operating voltages, enhancing compatibility with different systems.

On Chip Data RAM Width: 8

Provides sufficient memory capacity for data processing and storage.

Package Shape: SQUARE

Optimal shape for space-efficient packaging and placement on circuit boards.

Bit Size: 16

Offers high processing power and efficiency for handling complex tasks.

Power Supplies (V): 2/3.3

Compatibility with 2 different voltage supplies offers flexibility in power management.

No. of Terminals: 100

Sufficient terminals for connecting various components and peripherals to the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables easy integration into compact electronic devices with precise connections.

Minimum Supply Voltage: 2.7 V

Ensures stable operation at low supply voltages, conserving power usage.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with varying temperature environments.

CPU Family: MSP430

Reliable and widely used microcontroller family known for its efficiency and performance.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, expanding its usability.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and reliable electrical connections for long-term use.

ADC Channels: YES

Allows for analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

Terminal Position: QUAD

Facilitates easier PCB layout and soldering during assembly.

ROM Words: 61440

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design suitable for compact electronic devices with height restrictions.

RAM Words: 2

Basic RAM capacity for temporary data storage and operations.

Width: 14 mm

Compact width for space-efficient placement on PCBs.

Boundary Scan: YES

Allows for efficient testing and debugging of the microcontroller during manufacturing.

Peripherals: "COMPARATOR, LCD, POR, TIMER(7), WDT

Includes essential peripherals for versatile functionality in different applications.

Maximum Clock Frequency: 8 MHz

High clock frequency enables fast processing speeds for time-critical tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during manufacturing without damaging the microcontroller.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly processes.

Length: 14 mm

Compact length for space-efficient integration into electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and optimized performance in processing tasks.

No. of Timers: 7

Sufficient timer channels for time-sensitive operations and scheduling.

RAM Bytes: 2048

Adequate RAM capacity for storing and processing data during operation.

Technology: CMOS

Low power consumption and high noise immunity characteristics for efficient operation.

Terminal Form: GULL WING

Easy soldering and robust electrical connections with gull wing terminal form.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple ADC channels with high precision for accurate analog signal conversion.

Maximum Supply Current: 0.56 mA

Low supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 3 V

Stable and common supply voltage for reliable operation in most applications.

No. of Serial I/Os: 2

Sufficient serial communication channels for interfacing with other devices.

PWM Channels: YES

Support for Pulse Width Modulation for precise control over analog signals.

Connectivity: "SPI, TWI, UART, USART

Versatile connectivity options for interfacing with various peripherals and devices.

ROM Programmability: FLASH

Allows for easy reprogramming of the ROM for firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections and compact PCB layout.

Format: FIXED POINT

Fixed point format for efficient numerical calculations and data processing.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level appropriate for typical manufacturing environments.

Speed: 8 rpm

Operates at a speed suitable for various real-time applications.

Low Power Mode: YES

Supports low power modes for energy-efficient operation and longer battery life.

On Chip Program ROM Width: 8

Sufficient ROM width for storing program instructions on the chip.

No. of I/O Lines: 48

Ample I/O lines for interfacing with external components and peripherals.

Technical Specifications

Microcontrollers MSP430F4491IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, TWI, UART, USART"

Peripherals:

"COMPARATOR, LCD, POR, TIMER(7), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F4491IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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