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MSP430F4270IDL

Texas Instruments

MSP430F4270IDL by Texas Instruments

MSP430F4270IDL by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 256 bytes of RAM, and 32768 ROM words. It operates at a max clock frequency of 8 MHz and features peripherals like BOR, LCD, TIMER(4), WDT. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$8.508

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,645 parts In-Stock

1+ parts

$9.412

100+ parts

$7.673

1k+ parts

$5.115

10k+ parts

-

10,645

$9.412

$7.673

$5.115

-

Rochester

USA . 548 parts In-Stock

1+ parts

-

100+ parts

$6.630

1k+ parts

$5.930

10k+ parts

$5.580

548

-

$6.630

$5.930

$5.580

DigiKey

USA . 548 parts In-Stock

1+ parts

-

100+ parts

$8.730

1k+ parts

-

10k+ parts

-

548

-

$8.730

-

-

Verical

USA . 548 parts In-Stock

1+ parts

-

100+ parts

$8.287

1k+ parts

$7.412

10k+ parts

$6.975

548

-

$8.287

$7.412

$6.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 15 parts In-Stock

1+ parts

$6.430

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$6.430

-

-

-

Digiode

USA . 273 parts In-Stock

1+ parts

$6.745

100+ parts

-

1k+ parts

-

10k+ parts

-

273

$6.745

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.602

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$7.602

-

-

-

Vyrian

USA . 2,394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,394

-

-

-

-

DigiKey Marketplace

USA . 548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

548

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,582 parts In-Stock

1+ parts

$6.030

100+ parts

$5.879

1k+ parts

$5.849

10k+ parts

-

3,582

$6.030

$5.879

$5.849

-

Ampacity Inc.

Singapore . 3,488 parts In-Stock

1+ parts

$6.030

100+ parts

-

1k+ parts

-

10k+ parts

-

3,488

$6.030

-

-

-

Corphita

USA . 4,226 parts In-Stock

1+ parts

$6.390

100+ parts

-

1k+ parts

-

10k+ parts

-

4,226

$6.390

-

-

-

Continental Prestige Electronics

USA . 1,159 parts In-Stock

1+ parts

$7.602

100+ parts

-

1k+ parts

-

10k+ parts

$7.450

1,159

$7.602

-

-

$7.450

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.602

100+ parts

-

1k+ parts

$7.222

10k+ parts

$7.070

1,000

$7.602

-

$7.222

$7.070

Corohmni

South Africa . 1,030 parts In-Stock

1+ parts

$38.383

100+ parts

-

1k+ parts

-

10k+ parts

-

1,030

$38.383

-

-

-

Parana Technologies

USA . 1,429 parts In-Stock

1+ parts

$76.538

100+ parts

-

1k+ parts

-

10k+ parts

-

1,429

$76.538

-

-

-

DigiPath Technology Company

USA . 2,078 parts In-Stock

1+ parts

$84.278

100+ parts

$77.536

1k+ parts

-

10k+ parts

-

2,078

$84.278

$77.536

-

-

ChromeModa Solutions

Germany . 3,377 parts In-Stock

1+ parts

$85.998

100+ parts

$70.518

1k+ parts

-

10k+ parts

-

3,377

$85.998

$70.518

-

-

IDEA Electronic Components Group

UK . 2,196 parts In-Stock

1+ parts

$85.998

100+ parts

$81.698

1k+ parts

$77.398

10k+ parts

-

2,196

$85.998

$81.698

$77.398

-

Argo Parts USA

USA . 3,989 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,989

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Overview

Unlock unparalleled performance and efficiency with the Texas Instruments MSP430F4270IDL microcontroller. Designed with cutting-edge technology and a commitment to excellence, this device is ideal for a wide range of applications in various industries. Experience seamless integration and reliable operation with this high-quality product, offering unmatched value and benefits to customers looking for top-tier performance. Trust Texas Instruments to deliver exceptional solutions that empower your projects and streamline your operations. Elevate your work with the MSP430F4270IDL and discover the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, making it suitable for various applications in different environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto circuit boards, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, the microcontroller can operate reliably within this range and can be compatible with a wide range of power supply units.

On Chip Data RAM Width: 8

Having an 8-bit width for on-chip data RAM allows for efficient data processing and storage capabilities for the microcontroller.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration into various electronic designs and assemblies.

Bit Size: 16

A 16-bit architecture enables the microcontroller to handle and process data in larger chunks, improving overall performance and efficiency.

DAC Channels: YES

Digital-to-Analog Converter (DAC) channels enable the microcontroller to generate analog outputs, making it suitable for applications requiring precise control and signal conversion.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) provides flexibility in design and compatibility with various power sources and components.

No. of Terminals: 48

Having 48 terminals allows for connectivity to a wide range of external devices and peripherals, enhancing the microcontroller's versatility and functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style contributes to a compact and space-saving design, ideal for applications with limited PCB real estate.

Technical Specifications

Microcontrollers MSP430F4270IDL attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

0

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

2.79 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.52 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.49 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOR, LCD, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

MSP430F4270IDL Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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