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MSP430F4260IRGZR

Texas Instruments

MSP430F4260IRGZR by Texas Instruments

MSP430F4260IRGZR by Texas Instruments is a 16-bit microcontroller with 48 terminals, operating at up to 8 MHz. It features 5-Ch 12-Bit ADCs and DACs, suitable for industrial applications requiring low power consumption and high-speed processing. The chip carrier package style with a very thin profile makes it ideal for compact designs in various electronic devices.

Median Price

$5.345

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,768 parts In-Stock

1+ parts

$5.345

100+ parts

$4.358

1k+ parts

$2.905

10k+ parts

-

6,768

$5.345

$4.358

$2.905

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Distributors (In-Stock)

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Digiode

USA . 317 parts In-Stock

1+ parts

$5.078

100+ parts

-

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317

$5.078

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Vyrian

USA . 8,371 parts In-Stock

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8,371

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Corphita

USA . 3,023 parts In-Stock

1+ parts

$4.810

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-

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3,023

$4.810

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AZTECH Wire

Italy . 930 parts In-Stock

1+ parts

$15.850

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930

$15.850

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Parana Technologies

USA . 2,164 parts In-Stock

1+ parts

$23.493

100+ parts

-

1k+ parts

$24.121

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2,164

$23.493

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$24.121

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ChromeModa Solutions

Germany . 2,564 parts In-Stock

1+ parts

$26.397

100+ parts

$21.646

1k+ parts

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2,564

$26.397

$21.646

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IDEA Electronic Components Group

UK . 318 parts In-Stock

1+ parts

$26.397

100+ parts

$25.077

1k+ parts

$23.757

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318

$26.397

$25.077

$23.757

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Component Stockers USA

USA . 3,602 parts In-Stock

1+ parts

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3,602

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DigiPath Technology Company

USA . 2,307 parts In-Stock

1+ parts

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100+ parts

$23.800

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2,307

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$23.800

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Kepictronics

USA . 256 parts In-Stock

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256

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Overview

Unlock the power of innovation with the MSP430F4260IRGZR by Texas Instruments, a cutting-edge microcontroller that sets new standards in performance and reliability. Crafted by an industry-leading manufacturer, this versatile chip offers unparalleled value and benefits for a wide range of applications. From industrial automation to consumer electronics, the MSP430F4260IRGZR delivers exceptional efficiency and precision, making it the ideal choice for your next project. Experience seamless integration, robust features, and unbeatable quality with this top-of-the-line microcontroller. Elevate your designs and exceed expectations with Texas Instruments' MSP430F4260IRGZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material provides durability and reliability for the microcontroller, making it a suitable choice for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration of the microcontroller onto PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V allows for flexibility in power supply options and compatibility with a wide range of systems and components.

On Chip Data RAM Width: 8

8-bit data RAM width provides sufficient memory capacity for storing and accessing data efficiently during operation.

Package Shape: SQUARE

Square package shape offers a compact form factor and efficient use of space on the PCB, ideal for designs with size constraints.

Bit Size: 16

16-bit architecture enables higher performance and processing capabilities compared to lower bit sizes, making the microcontroller suitable for demanding tasks.

DAC Channels: YES

Digital-to-Analog Converter (DAC) channels allow for analog signal generation, enabling the microcontroller to interface with analog components and systems.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) enhances compatibility with various power sources and simplifies system design considerations.

No. of Terminals: 48

48 terminals provide ample I/O connectivity options, facilitating interface with external devices and peripherals to expand the microcontroller's functionality.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier package style with a thin profile offers space-saving benefits and compatibility with modern manufacturing processes, making it a preferred choice for compact designs.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8V ensures compatibility with low-power operation and energy-efficient designs, reducing power consumption and extending battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85°C provides reliability and robustness in harsh environmental conditions, making the microcontroller suitable for industrial applications.

CPU Family: MSP430

Belonging to the MSP430 CPU family indicates compatibility with a proven and reliable microcontroller architecture, ensuring stable performance and long-term support for the product.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance of -40°C enables reliable operation in cold environments, expanding the range of applications where the microcontroller can be used.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers excellent corrosion resistance and reliable electrical connectivity, ensuring long-term performance and durability of the microcontroller.

ADC Channels: YES

Analog-to-Digital Converter (ADC) channels enable the microcontroller to convert external analog signals into digital data, supporting sensor integration and analog input processing.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection on the PCB, enhancing durability and reliability in various operating conditions.

ROM Words: 24576

Ample ROM words (24,576) offer sufficient memory capacity for storing program instructions and data, allowing for versatile and complex applications to be implemented.

Maximum Seated Height: 1 mm

Low maximum seated height of 1mm ensures compatibility with compact designs and low-profile enclosures, making the microcontroller suitable for space-constrained applications.

Digital To Analog Convertors: 1-Ch 12-Bit

Single-channel 12-bit Digital-to-Analog Converter (DAC) capability provides high-resolution analog signal output, supporting precision control and interfacing requirements.

RAM Words: 0.25

Adequate RAM words (0.25) offer temporary memory storage for efficient data processing and computation during operation, enhancing the microcontroller's performance.

Width: 7 mm

Compact width of 7mm enables space-efficient integration on the PCB, allowing for dense component layouts and optimized board designs.

Boundary Scan: YES

Boundary Scan capability facilitates testing and debugging processes during manufacturing and maintenance, improving reliability and reducing time-to-market for products using the microcontroller.

Peripherals: BOR, LCD, TIMER(4), WDT

Built-in peripherals such as Brown-Out Reset (BOR), LCD controller, 4 Timers, and Watchdog Timer (WDT) enhance the microcontroller's functionality and versatility for diverse applications.

Maximum Clock Frequency: 8 MHz

Support for a maximum clock frequency of 8 MHz enables fast processing and high-speed operation, making the microcontroller suitable for time-critical applications and tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time allowance of 30 seconds at peak reflow temperature (260°C) enhances the microcontroller's durability and reliability during soldering processes, ensuring proper assembly and functionality.

Length: 7 mm

Compact length of 7mm enables space-efficient placement on the PCB, contributing to streamlined designs and optimized board layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding environments with wide temperature fluctuations, making the microcontroller suitable for robust industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller architecture with Reduced Instruction Set Computing (RISC) design offers high efficiency and optimized performance for embedded systems and microcontroller applications.

No. of Timers: 4

Presence of 4 timers provides versatile timing and control options for various functions and tasks, enhancing the microcontroller's capability and flexibility in diverse applications.

RAM Bytes: 256

256 bytes of RAM offer ample temporary storage for data manipulation and processing, enabling efficient operation and resource management within the microcontroller.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology ensures low power consumption, high noise immunity, and reliable operation, making the microcontroller energy-efficient and robust for different applications.

Terminal Form: NO LEAD

No-lead terminal form enhances solder joint reliability and thermal performance, reducing assembly defects and ensuring long-term connectivity and functionality of the microcontroller.

Analog To Digital Convertors: 5-Ch 12-Bit

Five-channel 12-bit Analog-to-Digital Converter (ADC) capability enables multiple analog signal inputs to be converted into digital data, improving sensor interfacing and signal processing capabilities.

Maximum Supply Current: 0.52 mA

Low maximum supply current of 0.52 mA supports energy-efficient operation and extends battery life in power-constrained applications, making the microcontroller suitable for portable and low-power devices.

Nominal Supply Voltage: 2.2 V

Nominal supply voltage of 2.2V provides a stable operating voltage for the microcontroller, ensuring consistent performance and reliability in various operating conditions.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog signals and motor speed regulation, expanding the microcontroller's application range in areas such as robotics, automation, and motor control.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility for updating firmware and software applications, enabling easy maintenance and customization of the microcontroller's functionality over its lifespan.

Terminal Pitch: 0.5 mm

Terminal pitch of 0.5mm provides fine pitch connections for stable and secure mounting on the PCB, ensuring reliable electrical connectivity and mechanical integrity of the microcontroller.

Technical Specifications

Microcontrollers MSP430F4260IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

0

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.52 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOR, LCD, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

MSP430F4260IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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