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MSP430F423IPMR

Texas Instruments

MSP430F423IPMR by Texas Instruments

MSP430F423IPMR by Texas Instruments is a 16-bit microcontroller with 256B RAM, 3 ADC channels, and 4 timers. Ideal for industrial applications, it operates b/w -40 to 85°C with low power mode and USART connectivity. With a max clock frequency of 8MHz, it features flash ROM programmability and boundary scan capability.

Median Price

$2.590

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,922 parts In-Stock

1+ parts

$2.590

100+ parts

$2.540

1k+ parts

$2.490

10k+ parts

-

4,922

$2.590

$2.540

$2.490

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,338

-

-

-

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Digiode

USA . 3,573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,573

-

-

-

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 792 parts In-Stock

1+ parts

$9.294

100+ parts

-

1k+ parts

-

10k+ parts

-

792

$9.294

-

-

-

Microchip USA

USA . 297 parts In-Stock

1+ parts

$25.610

100+ parts

$25.530

1k+ parts

$25.530

10k+ parts

$25.450

297

$25.610

$25.530

$25.530

$25.450

One Stop Electronics

USA . 1,573 parts In-Stock

1+ parts

$27.000

100+ parts

-

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-

10k+ parts

-

1,573

$27.000

-

-

-

Parana Technologies

USA . 1,845 parts In-Stock

1+ parts

$77.165

100+ parts

$7,165.920

1k+ parts

$69.448

10k+ parts

-

1,845

$77.165

$7,165.920

$69.448

-

DigiPath Technology Company

USA . 932 parts In-Stock

1+ parts

$84.968

100+ parts

$78.171

1k+ parts

-

10k+ parts

-

932

$84.968

$78.171

-

-

IDEA Electronic Components Group

UK . 1,171 parts In-Stock

1+ parts

$86.702

100+ parts

$82.367

1k+ parts

$78.032

10k+ parts

-

1,171

$86.702

$82.367

$78.032

-

ChromeModa Solutions

Germany . 1,088 parts In-Stock

1+ parts

$86.702

100+ parts

$71.096

1k+ parts

-

10k+ parts

-

1,088

$86.702

$71.096

-

-

A-Z Elektronik GmbH

Germany . 6,327 parts In-Stock

1+ parts

-

100+ parts

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6,327

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

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Corphita

USA . 1,320 parts In-Stock

1+ parts

-

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1,320

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Infinite Electronics LLP (Excess)

. 18 parts In-Stock

1+ parts

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18

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Overview

Unlock the power of innovation with the MSP430F423IPMR microcontroller by Texas Instruments. Designed with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, the MSP430F423IPMR delivers exceptional value and efficiency. Experience seamless connectivity, low power consumption, and advanced features that will elevate your projects to new heights. Trust in Texas Instruments to provide cutting-edge solutions that exceed expectations. Elevate your designs with the MSP430F423IPMR and revolutionize the way you create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, extending its lifespan.

Maximum Supply Voltage: 3.6 V

Provides a wide range of voltage supply options for flexibility in different applications.

ROM Words: 8192

Large ROM capacity allows for storing more program instructions, enabling complex functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and high performance for the microcontroller.

Analog To Digital Convertors: 3-Ch 16-Bit

Multiple ADC channels with high resolution enable accurate analog signal conversion for sensor interfacing.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control of outputs such as motor speed or LED brightness.

Connectivity: USART

USART interface provides versatile communication capabilities for connecting to other devices or systems.

Speed: 8 rpm

Operates at a moderate speed suitable for various applications without compromising performance.

Technical Specifications

Microcontrollers MSP430F423IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

14

No. of Serial I/Os:

1

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USART

Peripherals:

BOR, LCD, TIMER(4), WDT

Analog To Digital Convertors:

3-Ch 16-Bit

Trade Compliance

MSP430F423IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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