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MSP430F423IPM

Texas Instruments

MSP430F423IPM by Texas Instruments

MSP430F423IPM by Texas Instruments is a 16-bit microcontroller with 256B RAM, 3 ADC channels, and 4 timers. Ideal for industrial applications, it operates b/w -40 to 85°C with low power consumption at max. supply current of 0.5mA. Features include USART connectivity, PWM channels, and on-chip flash ROM programmability.

Median Price

$4.770

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 79 parts In-Stock

1+ parts

$0.942

100+ parts

-

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79

$0.942

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Chip1Stop

Japan . 79 parts In-Stock

1+ parts

$4.840

100+ parts

-

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79

$4.840

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Verical

USA . 79 parts In-Stock

1+ parts

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79

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Rochester

USA . 61 parts In-Stock

1+ parts

-

100+ parts

$4.700

1k+ parts

$4.210

10k+ parts

$3.960

61

-

$4.700

$4.210

$3.960

DigiKey

USA . 61 parts In-Stock

1+ parts

-

100+ parts

$6.190

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61

-

$6.190

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,682 parts In-Stock

1+ parts

$2.649

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4,682

$2.649

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TME

Poland . 159 parts In-Stock

1+ parts

$3.580

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159

$3.580

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Vyrian

USA . 7,372 parts In-Stock

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7,372

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DigiKey Marketplace

USA . 573 parts In-Stock

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573

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ComSIT Distribution GmbH

Germany . 58 parts In-Stock

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58

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LWI Electronics Inc

India . 3 parts In-Stock

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3

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Distributors (Availability)

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Corphita

USA . 1,226 parts In-Stock

1+ parts

$2.509

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-

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1,226

$2.509

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Component Stockers USA

USA . 546 parts In-Stock

1+ parts

$4.330

100+ parts

$4.010

1k+ parts

-

10k+ parts

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546

$4.330

$4.010

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Microchip USA

USA . 372 parts In-Stock

1+ parts

$30.680

100+ parts

$30.490

1k+ parts

$30.400

10k+ parts

$30.300

372

$30.680

$30.490

$30.400

$30.300

Parana Technologies

USA . 91 parts In-Stock

1+ parts

$66.422

100+ parts

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91

$66.422

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DigiPath Technology Company

USA . 2,279 parts In-Stock

1+ parts

$73.138

100+ parts

$67.287

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-

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2,279

$73.138

$67.287

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ChromeModa Solutions

Germany . 3,501 parts In-Stock

1+ parts

$74.631

100+ parts

$61.197

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-

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3,501

$74.631

$61.197

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IDEA Electronic Components Group

UK . 1,681 parts In-Stock

1+ parts

$74.631

100+ parts

$70.899

1k+ parts

$67.168

10k+ parts

-

1,681

$74.631

$70.899

$67.168

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F423IPM microcontroller. Renowned for its top-quality design and cutting-edge technology, Texas Instruments delivers unparalleled performance in the world of microcontrollers. Ideal for a wide range of applications, this versatile device offers unmatched value and benefits to customers looking to elevate their projects to new heights. Experience the advantage of seamless connectivity, low power consumption, and superior performance with the MSP430F423IPM. Elevate your designs with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for flexible voltage input, making it compatible with a wide range of power sources.

CPU Family: MSP430

Known for its low power consumption and high performance, making it ideal for energy-efficient applications.

ADC Channels: YES

Integrated analog to digital converters provide accurate conversion of analog signals, enhancing the versatility of the microcontroller.

Peripherals: BOR, LCD, TIMER(4), WDT

Offers a range of useful peripherals such as LCD support, timers, and watchdog timer for enhanced functionality.

Analog To Digital Convertors: 3-Ch 16-Bit

High-resolution ADCs allow for precise conversion of analog signals, suitable for applications requiring accurate data acquisition.

ROM Programmability: FLASH

Flash ROM programmability enables easy updating of firmware, providing flexibility and ease of maintenance for the microcontroller.

Low Power Mode: YES

Ability to operate in low power mode helps in energy efficiency, extending battery life in portable or battery-powered devices.

Technical Specifications

Microcontrollers MSP430F423IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

14

No. of Serial I/Os:

1

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USART

Peripherals:

BOR, LCD, TIMER(4), WDT

Analog To Digital Convertors:

3-Ch 16-Bit

Trade Compliance

MSP430F423IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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