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MSP430F417TDE2

Texas Instruments

MSP430F417TDE2 by Texas Instruments

MSP430F417TDE2 by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating b/w 1.8V to 3.6V. It features peripherals like BOD, Comparator, LCD, and Timer(2), suitable for applications requiring low power consumption and fixed-point format programming in CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,324 parts In-Stock

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7,324

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Digiode

USA . 3,567 parts In-Stock

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3,567

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 377 parts In-Stock

1+ parts

$5.214

100+ parts

-

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377

$5.214

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Parana Technologies

USA . 1,087 parts In-Stock

1+ parts

$13.763

100+ parts

-

1k+ parts

$14.251

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1,087

$13.763

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$14.251

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DigiPath Technology Company

USA . 338 parts In-Stock

1+ parts

$15.155

100+ parts

$13.942

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338

$15.155

$13.942

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ChromeModa Solutions

Germany . 1,917 parts In-Stock

1+ parts

$15.464

100+ parts

$12.680

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1,917

$15.464

$12.680

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IDEA Electronic Components Group

UK . 204 parts In-Stock

1+ parts

$15.464

100+ parts

$14.691

1k+ parts

$13.918

10k+ parts

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204

$15.464

$14.691

$13.918

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One Stop Electronics

USA . 774 parts In-Stock

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$28.000

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774

$28.000

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$40.024

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$36.422

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$32.820

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100

$40.024

$36.422

$32.820

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Microchip USA

USA . 1,208 parts In-Stock

1+ parts

$66.200

100+ parts

$65.050

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$64.470

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$63.900

1,208

$66.200

$65.050

$64.470

$63.900

Corphita

USA . 944 parts In-Stock

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944

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F417TDE2 microcontroller. Designed with superior quality and reliability, this product offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers cutting-edge technology with ease of use and flexibility. Enhance your designs with the value, benefits, and advantages that only Texas Instruments can provide. Trust in the MSP430 family to take your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto a PCB, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, increasing its versatility.

Package Shape: RECTANGULAR

The rectangular package shape simplifies the design and placement of the microcontroller on a PCB, improving manufacturability.

Bit Size: 16

The 16-bit architecture provides higher processing power and precision compared to 8-bit microcontrollers, making it suitable for complex applications.

No. of Terminals: 64

Having 64 terminals allows for more input/output connections and peripherals to be connected, increasing the functionality of the microcontroller.

Package Style (Meter): UNCASED CHIP

The chip-style package saves space and allows for direct mounting onto a PCB, reducing overall system size and complexity.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures compatibility with a wide range of power sources while still providing reliable performance.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making this microcontroller a cost-effective and efficient choice.

Terminal Position: UPPER

The upper terminal position simplifies PCB layout and routing of connections, enhancing ease of assembly and reducing design complexity.

Peripherals: BOD, COMPARATOR, LCD, TIMER(2)

The inclusion of various peripherals like Brown-out detection, comparator, LCD support, and timer modules enhances the functionality and versatility of the microcontroller for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient and streamlined processing capabilities, making it suitable for real-time applications and processing-intensive tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller ideal for battery-operated or noise-sensitive applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process during PCB assembly, reducing the chances of errors and improving overall reliability.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V strikes a balance between power consumption and performance, making this microcontroller suitable for a wide range of applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and reprogramming, increasing the flexibility and longevity of the microcontroller in various applications.

Format: FIXED POINT

The fixed-point format simplifies mathematical calculations and improves computational efficiency, making this microcontroller suitable for applications that require precise arithmetic operations.

No. of I/O Lines: 48

With 48 I/O lines, this microcontroller can interface with a wide array of sensors, actuators, and external devices, expanding its capabilities for diverse applications.

Technical Specifications

Microcontrollers MSP430F417TDE2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

R-XUUC-N64

No. of DMA Channels:

0

No. of I/O Lines:

48

No. of Terminals:

64

PWM Channels:

NO

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

BOD, COMPARATOR, LCD, TIMER(2)

Trade Compliance

MSP430F417TDE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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