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MSP430F2619TZQW

Texas Instruments

MSP430F2619TZQW by Texas Instruments

MSP430F2619TZQW by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, featuring 8-Ch 12-Bit ADC and 2-Ch 12-Bit DAC channels. Ideal for industrial applications, it offers low power mode, operates b/w -40 to 105°C, and includes peripherals like BOD, DMA(3), TIMER(2).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,367 parts In-Stock

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Digiode

USA . 519 parts In-Stock

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519

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One Stop Electronics

USA . 326 parts In-Stock

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$3.000

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326

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AZTECH Wire

Italy . 322 parts In-Stock

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$8.442

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Parana Technologies

USA . 1,306 parts In-Stock

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$19.620

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$19.616

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DigiPath Technology Company

USA . 1,167 parts In-Stock

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$21.604

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$19.876

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$21.604

$19.876

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ChromeModa Solutions

Germany . 2,186 parts In-Stock

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$22.045

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$18.077

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2,186

$22.045

$18.077

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IDEA Electronic Components Group

UK . 1,042 parts In-Stock

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$22.045

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$20.943

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$19.840

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1,042

$22.045

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Corphita

USA . 4,956 parts In-Stock

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Microchip USA

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Benley Electronics

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Overview

Unlock the potential of your electronic projects with the Texas Instruments MSP430F2619TZQW microcontroller. Manufactured by a trusted industry leader, this versatile device offers a wide range of applications in various industries. With its cutting-edge technology and high-quality components, this microcontroller provides unmatched performance and reliability. Experience the value and benefits of seamless connectivity, low power consumption, and advanced features that the MSP430F2619TZQW delivers. Take your projects to the next level with this top-of-the-line microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the microcontroller, making it durable and reliable.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 16

Provides sufficient processing power for a variety of applications.

DAC Channels: YES

Enables the microcontroller to generate analog output signals, enhancing its functionality.

ADC Channels: YES

Allows the microcontroller to convert analog signals into digital data, expanding its sensing capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient and fast processing of instructions.

ROM Programmability: FLASH

Allows for flexible reprogramming of the microcontroller's read-only memory, enabling quick updates and changes.

No. of I/O Lines: 64

Provides ample connectivity options for interfacing with various external devices and components.

Technical Specifications

Microcontrollers MSP430F2619TZQW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

64

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

10

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)"

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2619TZQW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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