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MSP430F2619TZCA

Texas Instruments

MSP430F2619TZCA by Texas Instruments

MSP430F2619TZCA by Texas Instruments is a 16-bit microcontroller with 122880 ROM words, 4096 RAM bytes, and 48 I/O lines. It features 2-Ch 12-Bit DAC channels and 8-Ch 12-Bit ADC channels, making it ideal for industrial applications requiring low power consumption and high-speed processing up to 16 MHz. With peripherals like BOD, DMA(3), TIMER(2), and WDT, this microcontroller offers versatile connectivity options including I2C(2), SPI(2), UART(2), and more.

Median Price

$24.160

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,490 parts In-Stock

1+ parts

$14.593

100+ parts

$12.747

1k+ parts

$8.791

10k+ parts

-

1,490

$14.593

$12.747

$8.791

-

Mouser Electronics

USA . 260 parts In-Stock

1+ parts

$24.160

100+ parts

$16.870

1k+ parts

$16.260

10k+ parts

-

260

$24.160

$16.870

$16.260

-

DigiKey

USA . 185 parts In-Stock

1+ parts

$24.160

100+ parts

$16.867

1k+ parts

$15.844

10k+ parts

-

185

$24.160

$16.867

$15.844

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,295 parts In-Stock

1+ parts

$13.863

100+ parts

-

1k+ parts

-

10k+ parts

-

1,295

$13.863

-

-

-

Vyrian

USA . 8,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,567

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,707 parts In-Stock

1+ parts

$13.134

100+ parts

-

1k+ parts

-

10k+ parts

-

2,707

$13.134

-

-

-

Microchip USA

USA . 2,965 parts In-Stock

1+ parts

$52.220

100+ parts

$51.470

1k+ parts

$51.100

10k+ parts

$50.730

2,965

$52.220

$51.470

$51.100

$50.730

Parana Technologies

USA . 1,717 parts In-Stock

1+ parts

$62.077

100+ parts

$5,764.755

1k+ parts

$55.869

10k+ parts

-

1,717

$62.077

$5,764.755

$55.869

-

DigiPath Technology Company

USA . 275 parts In-Stock

1+ parts

$68.354

100+ parts

-

1k+ parts

-

10k+ parts

-

275

$68.354

-

-

-

ChromeModa Solutions

Germany . 1,727 parts In-Stock

1+ parts

$69.749

100+ parts

$57.194

1k+ parts

-

10k+ parts

-

1,727

$69.749

$57.194

-

-

IDEA Electronic Components Group

UK . 1,459 parts In-Stock

1+ parts

$69.749

100+ parts

$66.262

1k+ parts

$62.774

10k+ parts

-

1,459

$69.749

$66.262

$62.774

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,000

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 3,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,580

-

-

-

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A-Z Elektronik GmbH

Germany . 588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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588

-

-

-

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F2619TZCA microcontroller! Designed with precision and quality in mind, this device offers a wide range of applications in various industries. From its cutting-edge technology to its reliable performance, customers can trust in the value and benefits this product brings to their projects. With features like low power mode, numerous peripherals, and high-speed connectivity options, the MSP430F2619TZCA is the ideal choice for those seeking top-tier performance and efficiency. Elevate your designs with this exceptional microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for a wide range of environments.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage which can provide more flexibility in power supply options.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle more complex calculations and data processing efficiently.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to convert digital signals into analog outputs, expanding its usability.

No. of Terminals: 113

Having a higher number of terminals allows for more connectivity options and interface possibilities.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications where higher temperatures may be encountered, ensuring reliable performance in demanding environments.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it an excellent choice for energy-efficient applications.

Analog To Digital Convertors: 8-Ch 12-Bit

With 8-channel 12-bit ADCs, the microcontroller can efficiently convert analog signals to digital data with high resolution and accuracy.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

A wide range of connectivity options ensures compatibility with various communication protocols and devices, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers MSP430F2619TZCA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

2

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2619TZCA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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