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MSP430F2619TPMR

Texas Instruments

MSP430F2619TPMR by Texas Instruments

MSP430F2619TPMR by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 122880 ROM words, and 8-Ch 12-Bit ADC channels. Ideal for industrial applications due to its -40 to 105°C operating temperature range, it features low power mode and peripherals like BOD, DMA(3), TIMER(2).

Median Price

$10.800

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18,244 parts In-Stock

1+ parts

$9.064

100+ parts

$7.917

1k+ parts

$5.460

10k+ parts

-

18,244

$9.064

$7.917

$5.460

-

Mouser Electronics

USA . 1,557 parts In-Stock

1+ parts

$15.040

100+ parts

$11.110

1k+ parts

$9.570

10k+ parts

-

1,557

$15.040

$11.110

$9.570

-

Rochester

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$8.640

1k+ parts

$7.730

10k+ parts

$7.270

180

-

$8.640

$7.730

$7.270

DigiKey

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$11.360

1k+ parts

-

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180

-

$11.360

-

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Verical

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$10.800

1k+ parts

$9.662

10k+ parts

$9.088

180

-

$10.800

$9.662

$9.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 31 parts In-Stock

1+ parts

$7.200

100+ parts

-

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-

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31

$7.200

-

-

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Digiode

USA . 2,325 parts In-Stock

1+ parts

$7.201

100+ parts

-

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-

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2,325

$7.201

-

-

-

Forefront Electronics and Design

USA . 3 parts In-Stock

1+ parts

$49.000

100+ parts

-

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-

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3

$49.000

-

-

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Vyrian

USA . 5,684 parts In-Stock

1+ parts

-

100+ parts

-

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-

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5,684

-

-

-

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Sensible Micro Corp

USA . 629 parts In-Stock

1+ parts

-

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629

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Elcom Components

USA . 5 parts In-Stock

1+ parts

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5

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,302 parts In-Stock

1+ parts

$6.440

100+ parts

-

1k+ parts

-

10k+ parts

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3,302

$6.440

-

-

-

Corphita

USA . 2,697 parts In-Stock

1+ parts

$6.822

100+ parts

-

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-

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2,697

$6.822

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$7.200

100+ parts

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2,000

$7.200

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Microchip USA

USA . 3,420 parts In-Stock

1+ parts

$21.403

100+ parts

-

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3,420

$21.403

-

-

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Parana Technologies

USA . 131 parts In-Stock

1+ parts

$53.759

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-

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131

$53.759

-

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DigiPath Technology Company

USA . 874 parts In-Stock

1+ parts

$59.195

100+ parts

$54.459

1k+ parts

-

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874

$59.195

$54.459

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ChromeModa Solutions

Germany . 1,481 parts In-Stock

1+ parts

$60.403

100+ parts

$49.530

1k+ parts

-

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1,481

$60.403

$49.530

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IDEA Electronic Components Group

UK . 526 parts In-Stock

1+ parts

$60.403

100+ parts

$57.383

1k+ parts

$54.363

10k+ parts

-

526

$60.403

$57.383

$54.363

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Advanced Electronics

New Zealand . 22 parts In-Stock

1+ parts

$63.911

100+ parts

$58.159

1k+ parts

$52.407

10k+ parts

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22

$63.911

$58.159

$52.407

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S.R.D Solutions

India . 5,000 parts In-Stock

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Lixinc

USA . 4,406 parts In-Stock

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4,406

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Perfect Parts

USA . 3,152 parts In-Stock

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3,152

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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A-Z Elektronik GmbH

Germany . 1,000 parts In-Stock

1+ parts

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1,000

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iodParts Technologies Inc.

India . 162 parts In-Stock

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162

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F2619TPMR microcontroller. Backed by a trusted manufacturer, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller provides exceptional value with its low power consumption and high performance capabilities. Whether you're designing IoT devices, wearables, or industrial automation systems, the MSP430F2619TPMR delivers the efficiency and power you need to bring your projects to life. Elevate your designs with this innovative microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring reliable performance in various conditions.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into circuit boards.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

Square package shape makes it easier to handle and place the microcontroller on the PCB.

Bit Size: 16

16-bit processing ensures efficient data processing and handling of complex tasks.

DAC Channels: YES

Digital-to-Analog Converter channels provide the ability to interface with analog components and sensors.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages enhances compatibility with different systems and applications.

No. of Terminals: 64

Higher number of terminals offer more connectivity options and peripheral integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style enables a compact form factor and efficient PCB layout.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage helps in reducing power consumption and operating costs.

Technical Specifications

Microcontrollers MSP430F2619TPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

10

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)"

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2619TPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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