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MSP430F2619S64KGD1

Texas Instruments

MSP430F2619S64KGD1 by Texas Instruments

MSP430F2619S64KGD1 by Texas Instruments is a 16-bit microcontroller with 122880 ROM words, 4 RAM words, and 2-Ch 12-Bit DAC channels. Ideal for military-grade applications requiring low power consumption and high-speed processing up to 16 MHz. Features include boundary scan, DMA support, and multiple connectivity options like I2C, SPI, and UART.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 4,921 parts In-Stock

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Vyrian

USA . 3,975 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 574 parts In-Stock

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$5.771

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$5.771

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Semicontronic

India . 574 parts In-Stock

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$14.000

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$13.650

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$13.580

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574

$14.000

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$13.580

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One Stop Electronics

USA . 1,432 parts In-Stock

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$17.000

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Parana Technologies

USA . 206 parts In-Stock

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$63.249

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DigiPath Technology Company

USA . 608 parts In-Stock

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$69.645

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$64.073

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$64.073

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ChromeModa Solutions

Germany . 5,297 parts In-Stock

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$71.066

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$58.274

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IDEA Electronic Components Group

UK . 1,681 parts In-Stock

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$71.066

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$67.513

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$63.959

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Microchip USA

USA . 2,344 parts In-Stock

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Corphita

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Overview

Unlock the potential of your electronic projects with the MSP430F2619S64KGD1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that offer advanced features and reliable performance. Ideal for a variety of applications, this microcontroller provides customers with value, benefits, and advantages that are unmatched. With its high-speed operation, low power mode, and numerous peripherals, the MSP430F2619S64KGD1 is the perfect choice for your next project. Experience innovation at its finest with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for smaller form factor designs and easier integration onto PCBs, making this product suitable for compact applications.

Maximum Supply Voltage: 3.6 V

Supports a higher voltage range, providing flexibility in power supply options for the device.

On Chip Data RAM Width: 8

Wide data RAM width allows for efficient data processing and storage on the chip, enhancing performance.

Bit Size: 16

16-bit architecture provides higher processing capabilities and precision compared to lower bit sizes, making this product suitable for complex tasks.

DAC Channels: YES

Integrated DAC channels enable analog output capabilities, allowing for interfacing with external analog devices seamlessly.

No. of Terminals: 64

Ample number of terminals provide extensive connectivity options for peripheral devices, increasing the product's versatility.

Package Style (Meter): UNCASED CHIP

Uncased chip design simplifies integration onto custom PCBs, ideal for applications requiring a compact footprint.

Minimum Supply Voltage: 3.3 V

Supports a low minimum supply voltage, ensuring efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance enables reliable performance in harsh environmental conditions, enhancing product durability.

CPU Family: MSP430

Belonging to the MSP430 CPU family ensures compatibility with existing software and development tools, streamlining the product's implementation.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature rating allows for operation in extreme cold environments, expanding the product's applicability.

ADC Channels: YES

Incorporated ADC channels facilitate analog signal input, enhancing the product's capabilities for sensor interfacing and data acquisition.

DMA Channels: YES

Availability of DMA channels enables efficient data transfer and processing, reducing CPU workload and improving overall system performance.

Terminal Position: UPPER

Upper terminal position simplifies PCB layout and routing, contributing to a more organized and space-efficient design.

ROM Words: 122880

Large ROM storage capacity supports extensive program storage and flexibility in firmware upgrades, accommodating complex applications.

Digital To Analog Convertors: 2-Ch 12-Bit

2-channel 12-bit DAC configuration provides high-resolution analog output options for precise control and interfacing requirements.

RAM Words: 4

Although limited, the on-chip RAM storage can be utilized for temporary data storage and processing, enhancing system performance.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the product during production, ensuring product quality and reliability.

Peripherals: BOD, COMPARATOR(8), DMA(3), POR, TIMER(2), WDT

Rich set of peripherals, including comparators, timers, and watchdog timers, offer additional functionality and versatility for diverse application requirements.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency enables fast data processing and system operation, making the product suitable for real-time and high-speed applications.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in extreme temperature conditions and harsh environments, making the product suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient computational performance while consuming minimal power, ideal for battery-operated applications.

No. of Timers: 2

Multiple timers offer precise timing control for various functions and tasks, enhancing the product's capabilities for time-sensitive operations.

RAM Bytes: 4096

On-chip RAM storage of 4096 bytes provides sufficient memory for data processing and temporary storage, supporting efficient system operation.

Technology: CMOS

CMOS technology ensures low power consumption, minimal static power loss, and high noise immunity, contributing to the product's energy efficiency and reliability.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and standards, promoting sustainability and eco-friendliness of the product.

Analog To Digital Convertors: 8-Ch 12-Bit

8-channel 12-bit ADC configuration allows for precise analog signal conversion and data acquisition from multiple sensors or sources.

Maximum Supply Current: 1 mA

Low maximum supply current requirement minimizes power consumption, extending battery life in portable or energy-efficient applications.

No. of DMA Channels: 3

Multiple DMA channels provide efficient data transfer capabilities, reducing CPU overhead and enhancing overall system performance.

No. of Serial I/Os: 4

Multiple serial I/O interfaces enable communication with external devices and peripherals, expanding connectivity options for the product.

PWM Channels: YES

Support for PWM channels allows for precise control of analog signals and motor speed regulation, enhancing the product's capabilities in control applications.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2)

Diverse connectivity options, including I2C, IRDA, SPI, and UART interfaces, broaden the product's compatibility with external devices and communication protocols.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and reprogramming, facilitating product customization and flexibility in application development.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances numerical accuracy, suiting the product for applications requiring precise calculations and data processing.

Speed: 16 rpm

Operating at a speed of 16 rpm, the product is suitable for applications requiring precise rotational control or synchronization.

Low Power Mode: YES

Support for low power mode enables energy-efficient operation and extended battery life, making the product ideal for power-sensitive applications.

On Chip Program ROM Width: 8

Narrow on-chip program ROM width simplifies program storage and access, enhancing overall system efficiency and performance.

No. of I/O Lines: 48

A high number of I/O lines offer ample interface connections for external devices and peripherals, enhancing the product's versatility and functionality.

Technical Specifications

Microcontrollers MSP430F2619S64KGD1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 4.15 MHZ AT 1.8V

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

X-XUUC-N64

Low Power Mode:

YES

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Speed:

16 rpm

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

BOD, COMPARATOR(8), DMA(3), POR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2619S64KGD1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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