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MSP430F2618TZQWR

Texas Instruments

MSP430F2618TZQWR by Texas Instruments

MSP430F2618TZQWR by Texas Instruments is a 16-bit microcontroller with 4096 RAM words and 118784 ROM words. It features 2-Ch 12-Bit DAC channels, 8-Ch 12-Bit ADC channels, and peripherals like BOD, COMPARATOR, DMA(3), TIMER(2), WDT. Ideal for industrial applications requiring low power consumption and high-speed processing up to 16 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,479 parts In-Stock

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Digiode

USA . 4,852 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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One Stop Electronics

USA . 530 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 812 parts In-Stock

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$7.975

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Ampacity Inc.

Singapore . 326 parts In-Stock

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$21.000

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Corohmni

South Africa . 733 parts In-Stock

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$38.347

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Parana Technologies

USA . 99 parts In-Stock

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$56.269

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IDEA Electronic Components Group

UK . 1,328 parts In-Stock

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$63.224

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$60.063

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$56.902

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ChromeModa Solutions

Germany . 100 parts In-Stock

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$63.224

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$51.844

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Perfect Parts

USA . 18,825 parts In-Stock

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Argo Parts USA

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Corphita

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DigiPath Technology Company

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Continental Prestige Electronics

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Microchip USA

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Bastille Electronics

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Assy Fe

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Overview

Unlock the power of innovation with the MSP430F2618TZQWR microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology in a compact package, perfect for a wide range of applications. Experience seamless connectivity and high-performance functionality with this versatile microcontroller. Whether you're working on IoT devices or industrial automation systems, the MSP430F2618TZQWR offers unmatched value, efficiency, and reliability. Elevate your projects to new heights with Texas Instruments at the helm.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material makes the package durable and resistant to external factors, ensuring the safety of the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for a higher power supply voltage, providing flexibility in power input options.

ADC Channels: YES

Ability to interface with analog sensors and devices, expanding the range of applications for the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and fast processing, making the microcontroller suitable for real-time applications.

No. of Serial I/Os: 2

Multiple serial I/O interfaces allow for versatile communication with other devices or systems.

Technical Specifications

Microcontrollers MSP430F2618TZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

64

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

4096

ROM Words:

118784

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2618TZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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