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MSP430F2618TZQW

Texas Instruments

MSP430F2618TZQW by Texas Instruments

MSP430F2618TZQW by Texas Instruments is a 16-bit microcontroller with 4096 RAM words and 118784 ROM words. It features 2 DAC channels, 8-Ch 12-Bit ADC, and peripherals like BOD, DMA(3), TIMER(2). Ideal for industrial applications requiring low power consumption and high-speed processing up to 16 MHz.

Median Price

$9.100

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,137 parts In-Stock

1+ parts

$6.950

100+ parts

$6.810

1k+ parts

$6.670

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8,137

$6.950

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$6.670

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Avnet

USA . 58 parts In-Stock

1+ parts

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$11.251

10k+ parts

$10.386

58

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$10.386

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Vyrian

USA . 5,429 parts In-Stock

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Digiode

USA . 2,566 parts In-Stock

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2,566

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Zilex Electronics Inc.

Canada . 20 parts In-Stock

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Prism Electronics

USA . 9 parts In-Stock

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Semi Source

USA . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 625 parts In-Stock

1+ parts

$9.790

100+ parts

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625

$9.790

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One Stop Electronics

USA . 1,015 parts In-Stock

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$15.000

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$15.000

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Parana Technologies

USA . 1,579 parts In-Stock

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$65.118

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DigiPath Technology Company

USA . 2,349 parts In-Stock

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$71.703

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$71.703

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ChromeModa Solutions

Germany . 3,495 parts In-Stock

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$73.166

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$59.996

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3,495

$73.166

$59.996

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IDEA Electronic Components Group

UK . 2,297 parts In-Stock

1+ parts

$73.166

100+ parts

$69.508

1k+ parts

$65.849

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2,297

$73.166

$69.508

$65.849

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Corphita

USA . 774 parts In-Stock

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Microchip USA

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Overview

Experience the cutting-edge technology of Texas Instruments with the MSP430F2618TZQW microcontroller. Perfect for a wide range of applications, this high-quality device offers unparalleled performance and reliability. With features such as low power mode, multiple connectivity options, and a wide range of peripherals, this microcontroller provides exceptional value to customers looking for advanced solutions. Trust in Texas Instruments to deliver top-of-the-line products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount feature allows for easy installation and space-saving design, making it ideal for compact electronic devices.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power requirements.

On Chip Data RAM Width: 16

The 16-bit data RAM width allows for efficient processing and storage of data, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

The square package shape provides uniform distribution of components, making it easier for PCB layout and assembly.

Bit Size: 16

The 16-bit architecture provides higher processing power and precision, making it suitable for handling complex tasks efficiently.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to convert digital signals to analog signals, opening up possibilities for interfacing with analog devices.

Power Supplies (V): 2/3.3

The availability of multiple power supply options (2V/3.3V) offers flexibility in design and compatibility with different power sources.

No. of Terminals: 113

The large number of terminals provides various connectivity options and interfaces for connecting external devices and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch allows for high-density mounting, saving space on the PCB and enabling more functionality in a compact design.

Minimum Supply Voltage: 3.3 V

The minimum supply voltage of 3.3V ensures reliable operation even under low-power conditions, making it suitable for battery-powered devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures stable performance in harsh environmental conditions.

CPU Family: MSP430

Being part of the MSP430 family, this microcontroller offers low power consumption, high performance, and a wide range of peripherals, making it a popular choice for various applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows the microcontroller to function in extreme cold environments without any issues.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term durability.

ADC Channels: YES

The inclusion of ADC channels allows for accurate analog-to-digital conversion, enabling precise measurement and control of external analog signals.

DMA Channels: YES

DMA channels help to offload the CPU from data transfer tasks, improving overall system performance and efficiency.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the microcontroller into the overall system design.

ROM Words: 118784

With a large ROM capacity of 118784 words, the microcontroller can store and execute a significant amount of program data, allowing for complex applications to be run smoothly.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm makes the microcontroller suitable for slim and space-constrained applications where height clearance is limited.

Digital To Analog Convertors: 2-Ch 12-Bit

The dual-channel 12-bit DACs enable precise and flexible control of analog outputs, expanding the range of applications where the microcontroller can be used.

RAM Words: 4096

The 4096-word RAM capacity allows for efficient data storage and manipulation, improving the overall performance and responsiveness of the microcontroller.

Width: 7 mm

The compact width of 7mm makes the microcontroller suitable for small form factor designs and applications where space is a premium.

Boundary Scan: YES

The presence of boundary scan capability aids in testing and debugging of the microcontroller during production, ensuring high quality and reliability of the final product.

Peripherals: BOD, COMPARATOR, DMA(3), TIMER(2), WDT

A rich set of peripherals including BOD, comparator, multiple DMA channels, timers, and WDT enhances the capabilities and versatility of the microcontroller for a wide range of applications.

Maximum Clock Frequency: 16 MHz

The maximum clock frequency of 16 MHz provides high-speed processing capabilities, making the microcontroller suitable for applications that require rapid data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures that the microcontroller can withstand the reflow soldering process without any impact on performance or reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering of the microcontroller onto the PCB, ensuring secure electrical connections and long-term operation.

Length: 7 mm

The compact length of 7mm further enhances the space-saving design of the microcontroller, making it suitable for compact and portable electronic devices.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-based microcontroller, it offers high performance, low power consumption, and efficient instruction execution, making it ideal for a wide range of embedded applications.

No. of Timers: 2

The presence of two timers provides additional timing and control capabilities for various operations and tasks, enhancing the functionality and flexibility of the microcontroller.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller can efficiently store and process data, offering improved performance and responsiveness in multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation speed, making the microcontroller energy-efficient and reliable in various applications.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and easy soldering onto the PCB, ensuring robust and durable assembly of the microcontroller.

Analog To Digital Convertors: 8-Ch 12-Bit

The inclusion of eight 12-bit ADC channels allows for precise and simultaneous conversion of multiple analog signals, enhancing the capabilities and versatility of the microcontroller in data acquisition applications.

Maximum Supply Current: 0.595 mA

The low maximum supply current of 0.595mA ensures energy efficiency and extends the battery life of portable electronic devices powered by the microcontroller.

No. of DMA Channels: 3

Having three DMA channels helps improve data transfer efficiency and offload the CPU from handling data movement tasks, enhancing overall system performance and responsiveness.

No. of Serial I/Os: 2

The two serial I/O interfaces allow for communication with external devices and peripherals, expanding connectivity options and enabling versatile data exchange in the system.

PWM Channels: YES

The presence of PWM channels enables precise control of connected devices such as motors, LEDs, and other components, offering flexible and efficient power management.

Technical Specifications

Microcontrollers MSP430F2618TZQW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

64

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

4096

ROM Words:

118784

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2618TZQW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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