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MSP430F2618TGQWTEP

Texas Instruments

MSP430F2618TGQWTEP by Texas Instruments

MSP430F2618TGQWTEP by Texas Instruments is a 16-bit microcontroller with 113 terminals, operating at up to 16 MHz. It features 8KB RAM, 118784 ROM words, and peripherals like BOR, DMA(3), TIMER(10). Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$24.850

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

-

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$24.850

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$22.240

10k+ parts

$20.930

15

-

$24.850

$22.240

$20.930

DigiKey

USA . 15 parts In-Stock

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15

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Bristol Electronics

USA . 292 parts In-Stock

1+ parts

$21.600

100+ parts

$17.496

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$21.600

$17.496

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Digiode

USA . 722 parts In-Stock

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$26.230

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Vyrian

USA . 8,134 parts In-Stock

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Semi Source

USA . 4,321 parts In-Stock

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Quantum Digital Technology

USA . 950 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 250 parts In-Stock

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Dan-Mar Components

USA . 250 parts In-Stock

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Microfarads

USA . 41 parts In-Stock

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DigiKey Marketplace

USA . 40 parts In-Stock

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PC Components Company LLC

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Distributors (Availability)

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Corphita

USA . 3,046 parts In-Stock

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$24.849

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$24.849

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Parana Technologies

USA . 1,023 parts In-Stock

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$39.333

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DigiPath Technology Company

USA . 1,316 parts In-Stock

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$43.310

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$43.310

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ChromeModa Solutions

Germany . 5,380 parts In-Stock

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$44.194

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$36.239

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5,380

$44.194

$36.239

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IDEA Electronic Components Group

UK . 704 parts In-Stock

1+ parts

$44.194

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$41.984

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$39.775

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704

$44.194

$41.984

$39.775

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Microchip USA

USA . 347 parts In-Stock

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Overview

Unlock the power of innovation with the MSP430F2618TGQWTEP microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that meet the highest standards. Ideal for a wide range of applications, this microcontroller offers unparalleled value with its exceptional performance, low power consumption, and seamless connectivity options. Experience the advantages of this cutting-edge technology and take your projects to the next level with the MSP430F2618TGQWTEP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options and compatibility with a variety of external components.

Bit Size: 16

Offers a high level of processing capability for handling complex tasks and calculations.

ADC Channels: YES

Enables the microcontroller to convert analog signals into digital data for processing, expanding its usage in sensor applications.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer between peripherals and memory, improving performance in data-intensive tasks.

ROM Programmability: FLASH

Flash programmability allows for easy and quick reprogramming of the microcontroller, facilitating firmware updates and customization.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient and fast processing of instructions, enhancing overall performance of the microcontroller.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Multiple connectivity options enable seamless communication with various external devices and peripherals, making it versatile in different applications.

Low Power Mode: YES

The ability to operate in low power mode conserves energy and prolongs battery life, ideal for power-sensitive applications.

Technical Specifications

Microcontrollers MSP430F2618TGQWTEP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e0

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

64

No. of Serial I/Os:

4

No. of Terminals:

113

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

118784

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOR, COMPARATOR(8), DMA(3), TIMER(10), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2618TGQWTEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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