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MSP430F2617TZQWR

Texas Instruments

MSP430F2617TZQWR by Texas Instruments

MSP430F2617TZQWR by Texas Instruments is a 16-bit microcontroller with 8KB RAM and 94,208 ROM words. It operates at a max frequency of 16MHz, has 2 DAC channels, and offers low power mode. Ideal for industrial applications requiring high-speed processing and multiple connectivity options like I2C, SPI, UART.

Median Price

$6.630

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

$6.630

100+ parts

$6.500

1k+ parts

$6.360

10k+ parts

-

2,500

$6.630

$6.500

$6.360

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,810 parts In-Stock

1+ parts

-

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-

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7,810

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Digiode

USA . 74 parts In-Stock

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-

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74

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Distributors (Availability)

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AZTECH Wire

Italy . 541 parts In-Stock

1+ parts

$6.064

100+ parts

-

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541

$6.064

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Parana Technologies

USA . 926 parts In-Stock

1+ parts

$25.458

100+ parts

-

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$26.088

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926

$25.458

-

$26.088

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DigiPath Technology Company

USA . 2,321 parts In-Stock

1+ parts

$28.033

100+ parts

$25.790

1k+ parts

-

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2,321

$28.033

$25.790

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ChromeModa Solutions

Germany . 3,666 parts In-Stock

1+ parts

$28.605

100+ parts

$23.456

1k+ parts

-

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3,666

$28.605

$23.456

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IDEA Electronic Components Group

UK . 2,056 parts In-Stock

1+ parts

$28.605

100+ parts

$27.175

1k+ parts

$25.744

10k+ parts

-

2,056

$28.605

$27.175

$25.744

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One Stop Electronics

USA . 884 parts In-Stock

1+ parts

$33.000

100+ parts

-

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884

$33.000

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 1,071 parts In-Stock

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1,071

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Microchip USA

USA . 282 parts In-Stock

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282

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2617TZQWR microcontroller. Designed with precision and quality in mind, this device offers a wide range of applications in various industries. From IoT to industrial automation, this microcontroller provides unmatched value, efficiency, and reliability. Trust in Texas Instruments' renowned expertise to deliver cutting-edge technology that exceeds expectations. Experience seamless connectivity, low power consumption, and high-performance capabilities with the MSP430F2617TZQWR - the ultimate solution for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between cost-effectiveness and durability, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input, providing flexibility in power source options for the product.

ADC Channels: YES

The presence of Analog to Digital Converters allows for precise monitoring and control of analog signals, making the product suitable for applications that require accurate analog input processing.

DMA Channels: YES

Direct Memory Access channels help improve data transfer efficiency and reduce CPU workload, enhancing the overall performance of the product.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller enhances processing speed and efficiency, making it a reliable choice for applications that require fast execution of instructions.

Technical Specifications

Microcontrollers MSP430F2617TZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

64

No. of Terminals:

113

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2617TZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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