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MSP430F2616TZCAR

Texas Instruments

MSP430F2616TZCAR by Texas Instruments

MSP430F2616TZCAR by Texas Instruments is a 16-bit microcontroller with 4096 bytes of RAM and 94208 ROM words. It features 2-Ch 12-Bit DAC, 8-Ch 12-Bit ADC, and low power mode. Ideal for industrial applications requiring high-speed processing up to 16 MHz in a compact package with various connectivity options like I2C, SPI, UART.

Median Price

$11.255

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,298 parts In-Stock

1+ parts

$11.255

100+ parts

$9.831

1k+ parts

$6.780

10k+ parts

-

6,298

$11.255

$9.831

$6.780

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,661 parts In-Stock

1+ parts

$10.692

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

$10.692

-

-

-

Vyrian

USA . 5,539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,539

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,516 parts In-Stock

1+ parts

$10.130

100+ parts

-

1k+ parts

-

10k+ parts

-

2,516

$10.130

-

-

-

AZTECH Wire

Italy . 365 parts In-Stock

1+ parts

$12.760

100+ parts

-

1k+ parts

-

10k+ parts

-

365

$12.760

-

-

-

Microchip USA

USA . 1,562 parts In-Stock

1+ parts

$24.540

100+ parts

$24.190

1k+ parts

$24.020

10k+ parts

$23.840

1,562

$24.540

$24.190

$24.020

$23.840

Parana Technologies

USA . 413 parts In-Stock

1+ parts

$43.095

100+ parts

-

1k+ parts

-

10k+ parts

-

413

$43.095

-

-

-

DigiPath Technology Company

USA . 932 parts In-Stock

1+ parts

$47.453

100+ parts

$43.656

1k+ parts

-

10k+ parts

-

932

$47.453

$43.656

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-

IDEA Electronic Components Group

UK . 1,683 parts In-Stock

1+ parts

$48.421

100+ parts

$46.000

1k+ parts

$43.579

10k+ parts

-

1,683

$48.421

$46.000

$43.579

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ChromeModa Solutions

Germany . 1,617 parts In-Stock

1+ parts

$48.421

100+ parts

$39.705

1k+ parts

-

10k+ parts

-

1,617

$48.421

$39.705

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-

Overview

Experience the cutting-edge technology of the Texas Instruments MSP430F2616TZCAR Microcontroller, offering unmatched quality and reliability. This powerful device is perfect for a wide range of applications, from industrial automation to consumer electronics. With its low power consumption and high performance capabilities, this microcontroller provides exceptional value and efficiency to customers. Trust in Texas Instruments to deliver top-notch products that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in power requirements.

On Chip Data RAM Width: 8

8-bit data RAM width enables efficient data processing and storage.

Package Shape: SQUARE

Square package shape makes it easy to integrate into compact designs.

Bit Size: 16

16-bit architecture allows for handling larger data sets and complex calculations.

DAC Channels: YES

Presence of DAC channels enables accurate analog signal output.

No. of Terminals: 113

Ample terminals provide versatile connectivity options for external components.

ROM Words: 94208

Large ROM capacity allows for storing a significant amount of program memory.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast processing speeds for real-time applications.

Technical Specifications

Microcontrollers MSP430F2616TZCAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

48

No. of Terminals:

113

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2616TZCAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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