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MSP430F2616TPM

Texas Instruments

MSP430F2616TPM by Texas Instruments

MSP430F2616TPM by Texas Instruments is a 16-bit microcontroller with 4096 bytes of RAM and 94208 ROM words. It features 2 DAC channels, 8 ADC channels, and operates at a max clock frequency of 16 MHz. Ideal for industrial applications requiring low power consumption and multiple connectivity options like I2C, SPI, and UART.

Median Price

$10.653

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,151 parts In-Stock

1+ parts

$10.231

100+ parts

$8.936

1k+ parts

$6.163

10k+ parts

-

6,151

$10.231

$8.936

$6.163

-

DigiKey

USA . 310 parts In-Stock

1+ parts

$15.390

100+ parts

$11.379

1k+ parts

$10.268

10k+ parts

-

310

$15.390

$11.379

$10.268

-

Mouser Electronics

USA . 161 parts In-Stock

1+ parts

$15.390

100+ parts

$10.270

1k+ parts

$10.110

10k+ parts

-

161

$15.390

$10.270

$10.110

-

Chip1Stop

Japan . 320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.365

10k+ parts

-

320

-

-

$7.365

-

Rochester

USA . 78 parts In-Stock

1+ parts

-

100+ parts

$8.860

1k+ parts

$7.930

10k+ parts

$7.460

78

-

$8.860

$7.930

$7.460

Verical

USA . 78 parts In-Stock

1+ parts

-

100+ parts

$11.075

1k+ parts

$9.912

10k+ parts

$9.325

78

-

$11.075

$9.912

$9.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,261 parts In-Stock

1+ parts

$8.132

100+ parts

-

1k+ parts

-

10k+ parts

-

4,261

$8.132

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$81.814

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$81.814

-

-

-

Vyrian

USA . 5,242 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,242

-

-

-

-

Sunrise Surplus Inc.

USA . 35 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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35

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 16 parts In-Stock

1+ parts

$6.290

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$6.290

-

-

-

Corphita

USA . 1,802 parts In-Stock

1+ parts

$7.704

100+ parts

-

1k+ parts

-

10k+ parts

-

1,802

$7.704

-

-

-

Parana Technologies

USA . 1,255 parts In-Stock

1+ parts

$27.009

100+ parts

-

1k+ parts

$31.167

10k+ parts

-

1,255

$27.009

-

$31.167

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DigiPath Technology Company

USA . 1,454 parts In-Stock

1+ parts

$29.740

100+ parts

$27.361

1k+ parts

-

10k+ parts

-

1,454

$29.740

$27.361

-

-

IDEA Electronic Components Group

UK . 1,746 parts In-Stock

1+ parts

$30.347

100+ parts

$28.830

1k+ parts

$27.312

10k+ parts

-

1,746

$30.347

$28.830

$27.312

-

ChromeModa Solutions

Germany . 85 parts In-Stock

1+ parts

$30.347

100+ parts

$24.885

1k+ parts

-

10k+ parts

-

85

$30.347

$24.885

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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-

10k+ parts

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3,000

-

-

-

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Kepictronics

USA . 44 parts In-Stock

1+ parts

-

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44

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-

Overview

Unlock endless possibilities with the Texas Instruments MSP430F2616TPM microcontroller. Designed with cutting-edge technology and top-notch quality, this product offers unmatched performance and reliability. Whether you're working on IoT devices, consumer electronics, or industrial applications, this versatile microcontroller will exceed your expectations. Experience the convenience of multiple ADC and DAC channels, low power mode, and a wide range of connectivity options. Transform your projects with the MSP430F2616TPM and elevate your innovation to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it provides good protection and insulation for the components inside the package.

Surface Mount: YES

Surface mount technology allows for compact and efficient assembly of electronic components, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can operate within a wide voltage range, making it versatile for various applications.

On Chip Data RAM Width: 8

Having a data RAM width of 8 bits allows for efficient data processing and storage within the microcontroller.

Package Shape: SQUARE

The square package shape provides a balanced layout for the components inside, optimizing space and connectivity.

Technical Specifications

Microcontrollers MSP430F2616TPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

48

No. of Terminals:

64

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, DMA(3), TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F2616TPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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