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MSP430F2491TPM

Texas Instruments

MSP430F2491TPM by Texas Instruments

MSP430F2491TPM by Texas Instruments is a 16-bit microcontroller with 48 I/O lines, 2048 bytes of RAM, and 61440 ROM words. It operates at a max clock frequency of 16 MHz and features peripherals like BOD, Comparator, and Timer(6). Ideal for industrial applications requiring low power consumption and connectivity via I2C, LIN, SPI(2), UART.

Median Price

$10.068

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,150 parts In-Stock

1+ parts

$10.068

100+ parts

$8.208

1k+ parts

$5.472

10k+ parts

-

2,150

$10.068

$8.208

$5.472

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 148 parts In-Stock

1+ parts

$3.660

100+ parts

-

1k+ parts

-

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148

$3.660

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Digiode

USA . 1,741 parts In-Stock

1+ parts

$9.565

100+ parts

-

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10k+ parts

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1,741

$9.565

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Bristol Electronics

USA . 142 parts In-Stock

1+ parts

$9.588

100+ parts

$5.753

1k+ parts

$5.513

10k+ parts

-

142

$9.588

$5.753

$5.513

-

Vyrian

USA . 6,889 parts In-Stock

1+ parts

-

100+ parts

-

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6,889

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ACDS - Activité Composants Distribution Service

France . 142 parts In-Stock

1+ parts

-

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-

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142

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Dan-Mar Components

USA . 142 parts In-Stock

1+ parts

-

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-

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142

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,864 parts In-Stock

1+ parts

$9.061

100+ parts

-

1k+ parts

-

10k+ parts

-

1,864

$9.061

-

-

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AZTECH Wire

Italy . 398 parts In-Stock

1+ parts

$12.990

100+ parts

-

1k+ parts

-

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398

$12.990

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-

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Microchip USA

USA . 1,378 parts In-Stock

1+ parts

$25.220

100+ parts

$24.860

1k+ parts

$24.680

10k+ parts

$24.500

1,378

$25.220

$24.860

$24.680

$24.500

Parana Technologies

USA . 1,280 parts In-Stock

1+ parts

$46.527

100+ parts

-

1k+ parts

-

10k+ parts

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1,280

$46.527

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-

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DigiPath Technology Company

USA . 2,309 parts In-Stock

1+ parts

$51.231

100+ parts

$47.133

1k+ parts

-

10k+ parts

-

2,309

$51.231

$47.133

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ChromeModa Solutions

Germany . 4,354 parts In-Stock

1+ parts

$52.277

100+ parts

$42.867

1k+ parts

-

10k+ parts

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4,354

$52.277

$42.867

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IDEA Electronic Components Group

UK . 298 parts In-Stock

1+ parts

$52.277

100+ parts

$49.663

1k+ parts

$47.049

10k+ parts

-

298

$52.277

$49.663

$47.049

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QUARKTWIN TECHNOLOGY LTD

USA . 25,561 parts In-Stock

1+ parts

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25,561

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Perfect Parts

USA . 179 parts In-Stock

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179

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2491TPM microcontroller. Designed for industrial-grade applications, this versatile device offers customers a reliable and efficient solution for their projects. With a maximum clock frequency of 16 MHz and peripherals including BOD, Comparator, Timer(6), and WDT, this RISC-based microcontroller provides the performance and connectivity needed to bring your ideas to life. Trust in Texas Instruments' reputation for quality and experience the value and benefits that the MSP430F2491TPM brings to your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material is ideal for portable devices.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options for various applications.

No. of Terminals: 64

Sufficient terminals for interfacing with external components and peripherals.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast processing of data and instructions.

Connectivity: I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Wide range of connectivity options for interfacing with other devices and communication protocols.

Technical Specifications

Microcontrollers MSP430F2491TPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR, TIMER(6), WDT"

Trade Compliance

MSP430F2491TPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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