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MSP430F2481TRGCT

Texas Instruments

MSP430F2481TRGCT by Texas Instruments

MSP430F2481TRGCT by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 16 MHz. It features 4KB RAM, FLASH ROM programmability, and peripherals like BOD, Comparator, and Timer(6). Ideal for industrial applications requiring low power consumption and connectivity via I2C, LIN, SPI(2), UART.

Median Price

$9.242

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,000 parts In-Stock

1+ parts

$7.684

100+ parts

$6.264

1k+ parts

$4.176

10k+ parts

-

1,000

$7.684

$6.264

$4.176

-

DigiKey

USA . 98 parts In-Stock

1+ parts

$10.800

100+ parts

$7.862

1k+ parts

$6.907

10k+ parts

-

98

$10.800

$7.862

$6.907

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 891 parts In-Stock

1+ parts

$7.300

100+ parts

-

1k+ parts

-

10k+ parts

-

891

$7.300

-

-

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Vyrian

USA . 8,068 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,068

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,847 parts In-Stock

1+ parts

$6.916

100+ parts

-

1k+ parts

-

10k+ parts

-

2,847

$6.916

-

-

-

Parana Technologies

USA . 1,619 parts In-Stock

1+ parts

$33.864

100+ parts

-

1k+ parts

$136.091

10k+ parts

-

1,619

$33.864

-

$136.091

-

DigiPath Technology Company

USA . 1,332 parts In-Stock

1+ parts

$37.289

100+ parts

-

1k+ parts

-

10k+ parts

-

1,332

$37.289

-

-

-

ChromeModa Solutions

Germany . 4,145 parts In-Stock

1+ parts

$38.050

100+ parts

$31.201

1k+ parts

-

10k+ parts

-

4,145

$38.050

$31.201

-

-

IDEA Electronic Components Group

UK . 154 parts In-Stock

1+ parts

$38.050

100+ parts

$36.148

1k+ parts

$34.245

10k+ parts

-

154

$38.050

$36.148

$34.245

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,000

-

-

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Overview

Unlock the power of Texas Instruments with the MSP430F2481TRGCT microcontroller. Designed for industrial-grade applications, this chip offers a sleek square package with very thin profile, making it perfect for space-constrained projects. With features like low power mode and a maximum clock frequency of 16 MHz, this device delivers superior performance and energy efficiency. Whether you're working on IoT devices, sensor networks, or automation systems, the MSP430F2481TRGCT is the reliable solution you need to bring your ideas to life. Trust in Texas Instruments for quality, innovation, and cutting-edge technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy integration onto circuit boards, making it convenient for manufacturing processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of input voltages, providing versatility in different power supply configurations.

On Chip Data RAM Width: 8

Efficient data processing with a wide RAM width for quick access and manipulation of information.

Package Shape: SQUARE

Square shape package design allows for efficient use of space on circuit boards, maximizing component density.

Bit Size: 16

16-bit processing capability enables the microcontroller to handle complex instructions and data with higher precision.

Power Supplies (V): 2/3.3

Supports multiple power supply voltages, offering flexibility in power management and optimization based on application requirements.

No. of Terminals: 64

Abundance of terminals for connecting peripherals and external components, enhancing the overall functionality of the microcontroller.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Thin profile design reduces overall height of the package, ideal for space-constrained applications and compact electronic devices.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

High operating temperature range ensures reliable performance in harsh environmental conditions and industrial applications.

CPU Family: MSP430

Part of the MSP430 family known for low power consumption and high performance, offering a reliable solution for energy-efficient designs.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in extreme cold environments, making it suitable for outdoor and industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish provides corrosion resistance and ensures reliable electrical connections for long-term durability.

Terminal Position: QUAD

Quad terminal layout simplifies the PCB design and allows for easy soldering and assembly, enhancing the manufacturability of the product.

ROM Words: 49152

Large fixed program memory capacity for storing firmware and program data, accommodating complex applications and algorithms.

Maximum Seated Height: 1 mm

Low-profile design with a maximum seated height of 1mm reduces the overall footprint of the device, suitable for compact and space-saving designs.

RAM Words: 4

On-chip RAM storage for temporary data storage and manipulation, enhancing the processing capabilities of the microcontroller.

Width: 9 mm

Compact width dimensions facilitate easy integration into electronic systems with space constraints, optimizing PCB layout and design.

Boundary Scan: YES

Boundary scan feature enables efficient testing and debugging of the microcontroller, ensuring high product quality and reliability during manufacturing.

Peripherals: BOD, COMPARATOR, TIMER(6), WDT

Integrated peripherals enhance the functionality of the microcontroller by providing additional features such as Brown-Out Detection, Comparator, Timers, and Watchdog Timer.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast processing speeds and real-time operation, suitable for high-performance applications requiring rapid computations.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering during manufacturing processes, maintaining electrical connections under extreme heat.

Length: 9 mm

Compact length dimensions allow for easy placement on circuit boards and efficient use of space in electronic designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller design cater to embedded systems with efficient instruction execution and reduced power consumption.

No. of Timers: 6

Multiple timers enable precise timekeeping and scheduling of events, enhancing the functionality and versatility of the microcontroller.

RAM Bytes: 4096

Expanded RAM capacity for data storage and processing, facilitating efficient multitasking and complex algorithms in embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring energy-efficient operation and reliable performance in diverse applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and RoHS standards, promoting sustainability and eco-friendly product design.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent and reliable operation, ensuring proper functionality of the microcontroller in various operating conditions.

No. of Serial I/Os: 4

Multiple serial I/O interfaces for communication with external devices and peripherals, enabling seamless data transfer and connectivity in embedded systems.

PWM Channels: YES

Pulse Width Modulation (PWM) channels for precise control of analog outputs, allowing for adjustable voltage levels and efficient power management.

Connectivity: I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Versatile connectivity options for interfacing with a wide range of communication protocols and devices, enhancing compatibility and interoperability in embedded systems.

ROM Programmability: FLASH

Flash memory technology allows for easy reprogramming and updates of firmware, facilitating firmware upgrades and maintenance in the field.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm for compact and space-saving PCB layouts, providing efficient connectivity and soldering options in electronic designs.

Format: FIXED POINT

Fixed-point format for numerical calculations and data processing, enabling high-speed computation and efficient utilization of resources in embedded applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate reflow sensitivity, ensuring proper handling and storage of the microcontroller during assembly processes.

Speed: 16 rpm

Operating speed of 16 RPM for efficient data processing and control, suitable for real-time applications and precise motor control tasks.

Low Power Mode: YES

Low power mode feature for energy-efficient operation and power-saving capabilities, extending battery life and reducing overall power consumption.

On Chip Program ROM Width: 8

On-chip program ROM with a width of 8 bits for efficient storage and retrieval of program instructions, ensuring smooth operation and reliable performance.

No. of I/O Lines: 48

Abundance of I/O lines for connecting external peripherals and devices, enhancing the flexibility and expandability of the microcontroller in various applications.

Technical Specifications

Microcontrollers MSP430F2481TRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR, TIMER(6), WDT"

Trade Compliance

MSP430F2481TRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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