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MSP430F2419TPNR

Texas Instruments

MSP430F2419TPNR by Texas Instruments

MSP430F2419TPNR by Texas Instruments is a 16-bit microcontroller with 122880 ROM words and 4 RAM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like ADC channels, PWM channels, and multiple connectivity options, it offers versatile solutions in embedded systems design.

Median Price

$13.738

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,399 parts In-Stock

1+ parts

$9.296

100+ parts

$8.120

1k+ parts

$5.600

10k+ parts

-

6,399

$9.296

$8.120

$5.600

-

Mouser Electronics

USA . 23 parts In-Stock

1+ parts

$18.180

100+ parts

$11.670

1k+ parts

$10.100

10k+ parts

-

23

$18.180

$11.670

$10.100

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 568 parts In-Stock

1+ parts

$8.831

100+ parts

-

1k+ parts

-

10k+ parts

-

568

$8.831

-

-

-

Vyrian

USA . 4,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,071

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 486 parts In-Stock

1+ parts

$8.366

100+ parts

-

1k+ parts

-

10k+ parts

-

486

$8.366

-

-

-

Component Stockers USA

USA . 70 parts In-Stock

1+ parts

$11.530

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$11.530

-

-

-

Parana Technologies

USA . 2,350 parts In-Stock

1+ parts

$35.635

100+ parts

-

1k+ parts

-

10k+ parts

-

2,350

$35.635

-

-

-

DigiPath Technology Company

USA . 1,758 parts In-Stock

1+ parts

$39.238

100+ parts

$36.099

1k+ parts

-

10k+ parts

-

1,758

$39.238

$36.099

-

-

ChromeModa Solutions

Germany . 1,990 parts In-Stock

1+ parts

$40.039

100+ parts

$32.832

1k+ parts

-

10k+ parts

-

1,990

$40.039

$32.832

-

-

IDEA Electronic Components Group

UK . 825 parts In-Stock

1+ parts

$40.039

100+ parts

$38.037

1k+ parts

$36.035

10k+ parts

-

825

$40.039

$38.037

$36.035

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QUARKTWIN TECHNOLOGY LTD

USA . 11,952 parts In-Stock

1+ parts

-

100+ parts

-

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11,952

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Perfect Parts

USA . 504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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504

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Overview

Elevate your projects with the Texas Instruments MSP430F2419TPNR microcontroller, a high-quality device that combines reliability and innovation. With a powerful CPU family and a wide range of peripherals including BOD, comparator, timers, and more, this product offers unmatched versatility for industrial applications. Benefit from its low power mode and advanced connectivity options like I2C, SPI, and UART, maximizing efficiency without compromising on performance. Embrace the future of technology with Texas Instruments' cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and low cost, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options, making the product versatile for different power requirements.

Bit Size: 16

16-bit architecture allows for efficient processing of data and calculations, making the product ideal for applications that require moderate computational power.

ADC Channels: YES

Analog to Digital Converters allow for interfacing with analog sensors and signals, enhancing the product's ability to monitor and control the environment.

ROM Words: 122880

Large ROM capacity provides ample space for storing program instructions, making the product suitable for complex applications that require extensive programming.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient processing of instructions, leading to faster execution times and overall improved performance.

No. of Timers: 10

Multiple timers allow for precise timing and scheduling of tasks, making the product suitable for applications that require accurate timekeeping and event triggering.

RAM Bytes: 4096

Adequate RAM size enables efficient storage and retrieval of data during operation, enhancing the product's ability to handle complex computational tasks.

Technical Specifications

Microcontrollers MSP430F2419TPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

64

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

10

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)"

Peripherals:

BOD, COMPARATOR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F2419TPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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