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MSP430F2418TPNR

Texas Instruments

MSP430F2418TPNR by Texas Instruments

MSP430F2418TPNR by Texas Instruments is a 16-bit microcontroller with 80 terminals, 8192 bytes of RAM, and 118784 ROM words. It operates at a max clock frequency of 16 MHz and features peripherals like BOD, Comparator, Timer(2), WDT. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$8.825

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 37,285 parts In-Stock

1+ parts

$8.825

100+ parts

$7.708

1k+ parts

$5.316

10k+ parts

-

37,285

$8.825

$7.708

$5.316

-

Mouser Electronics

USA . 430 parts In-Stock

1+ parts

$18.980

100+ parts

$12.180

1k+ parts

$9.770

10k+ parts

-

430

$18.980

$12.180

$9.770

-

Future Electronics

Canada . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.060

10k+ parts

-

2,000

-

-

$5.060

-

Distributors (In-Stock)

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Digiode

USA . 3,523 parts In-Stock

1+ parts

$8.384

100+ parts

-

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3,523

$8.384

-

-

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Vyrian

USA . 7,574 parts In-Stock

1+ parts

-

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7,574

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Nova Conductors

Japan . 18 parts In-Stock

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-

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12,455 parts In-Stock

1+ parts

$7.500

100+ parts

-

1k+ parts

-

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12,455

$7.500

-

-

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Corphita

USA . 2,606 parts In-Stock

1+ parts

$7.942

100+ parts

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2,606

$7.942

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Parana Technologies

USA . 1,402 parts In-Stock

1+ parts

$49.595

100+ parts

-

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1,402

$49.595

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DigiPath Technology Company

USA . 1,611 parts In-Stock

1+ parts

$54.610

100+ parts

$50.242

1k+ parts

-

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1,611

$54.610

$50.242

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ChromeModa Solutions

Germany . 5,317 parts In-Stock

1+ parts

$55.725

100+ parts

$45.694

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-

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5,317

$55.725

$45.694

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IDEA Electronic Components Group

UK . 723 parts In-Stock

1+ parts

$55.725

100+ parts

$52.939

1k+ parts

$50.152

10k+ parts

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723

$55.725

$52.939

$50.152

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Corohmni

South Africa . 132 parts In-Stock

1+ parts

$72.448

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132

$72.448

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Lixinc

USA . 17,658 parts In-Stock

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17,658

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QUARKTWIN TECHNOLOGY LTD

USA . 16,782 parts In-Stock

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16,782

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Argo Parts USA

USA . 1,380 parts In-Stock

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1,380

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A-Z Elektronik GmbH

Germany . 1,000 parts In-Stock

1+ parts

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1,000

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-

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Continental Prestige Electronics

USA . 647 parts In-Stock

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647

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Metaverse IC Inc.

Canada . 148 parts In-Stock

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148

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Experience the cutting-edge technology of the MSP430F2418TPNR microcontroller by Texas Instruments, a leader in innovative electronics. This versatile device is perfect for a wide range of applications, offering high performance and reliability. Unlock endless possibilities with its low power consumption, advanced peripherals, and seamless connectivity options. Trust in Texas Instruments to deliver top-notch quality and value in every product, making the MSP430F2418TPNR an essential component for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable helps in easy and efficient PCB assembly, reducing production time and costs.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power supply options, making the product suitable for various applications.

On Chip Data RAM Width: 8

Having a wider data RAM width enables faster data processing and storage capabilities.

Package Shape: SQUARE

The square package shape makes it easier to integrate the microcontroller into different electronic designs efficiently.

Bit Size: 16

With a larger bit size, the microcontroller can handle more complex computational tasks and data processing operations.

Power Supplies (V): 2/3.3

The availability of multiple power supply options allows for greater compatibility with different power sources.

No. of Terminals: 80

Having a higher number of terminals provides more connectivity options and flexibility in interfacing with external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package style offers space-saving benefits and improved thermal performance.

Minimum Supply Voltage: 3.3 V

The minimum supply voltage ensures stable operation even under low power conditions.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions without compromising performance.

CPU Family: MSP430

Being part of the MSP430 family indicates reliability, efficiency, and compatibility with other MSP430-based products.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function optimally in cold environments without any issues.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Having a terminal finish of nickel/palladium/gold ensures reliable electrical connections and resistance to corrosion.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, essential for interfacing with analog sensors and signals.

Terminal Position: QUAD

The quad terminal position facilitates secure mounting on the PCB and efficient signal routing for optimal performance.

ROM Words: 118784

With a large ROM capacity, the microcontroller can store a significant amount of program instructions and data.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a compact and slim design, ideal for space-constrained applications.

Width: 12 mm

The compact width of 12 mm enables easy integration into different electronic devices without occupying too much space.

Peripherals: BOD, COMPARATOR, TIMER(2), WDT

The inclusion of various peripherals like BOD, comparator, timers, and WDT enhances the functionality and versatility of the microcontroller.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz allows for speedy execution of instructions and efficient operation.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures reliable soldering during the PCB assembly process.

Length: 12 mm

The 12 mm length provides a balanced form factor, making it suitable for a wide range of applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges indicates durability and reliability for use in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers high performance, power efficiency, and fast execution of instructions.

No. of Timers: 10

Having 10 timers allows for precise timing functions and event scheduling, essential for many applications.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller can efficiently handle data storage and manipulation during operation.

Technology: CMOS

The CMOS technology used in the microcontroller ensures low power consumption, high noise immunity, and reliable operation.

Terminal Form: GULL WING

The gull wing terminal form provides a robust mechanical connection and facilitates automated assembly processes.

Analog To Digital Convertors: 8-Ch 12-Bit

The presence of 8-channel 12-bit ADCs enables accurate conversion of analog signals to digital, crucial for sensor interfacing.

Maximum Supply Current: 0.595 mA

The low maximum supply current of 0.595 mA helps in reducing power consumption, making it suitable for low-power applications.

PWM Channels: YES

Having PWM channels allows for precise control of digital signals, essential for applications like motor control and LED dimming.

Connectivity: I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

The multiple connectivity options like I2C, IRDA, LIN, SPI, UART, and USCI enable seamless communication with other devices and peripherals.

ROM Programmability: FLASH

The use of flash ROM for programmability allows for easy and fast code updates and modifications without the need for external programming equipment.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting on the PCB, saving space and allowing for more components on the board.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations and ensures accurate calculations in embedded systems applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling.

Speed: 16 rpm

With a speed of 16 RPM, the microcontroller can process instructions and data quickly, enhancing overall system performance.

Low Power Mode: YES

The presence of a low power mode allows the microcontroller to operate in a power-efficient state, ideal for battery-powered and energy-saving applications.

On Chip Program ROM Width: 8

With an 8-bit wide on-chip program ROM, the microcontroller can store a large number of program instructions for execution.

No. of I/O Lines: 64

Having 64 I/O lines provides ample interfacing options for connecting to external devices, sensors, and peripherals, enhancing the product's versatility.

Technical Specifications

Microcontrollers MSP430F2418TPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

80

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

118784

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(2), UART(2), USCI(4)

Peripherals:

BOD, COMPARATOR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F2418TPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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