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MSP430F2417TZQW

Texas Instruments

MSP430F2417TZQW by Texas Instruments

MSP430F2417TZQW by Texas Instruments is a 16-bit microcontroller with 4096 RAM words and 94208 ROM words. It operates at a max frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, SPI, and UART interfaces. With 8-channel ADCs and PWM support, it offers versatile peripheral options for various embedded systems.

Median Price

$6.060

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 248 parts In-Stock

1+ parts

$6.060

100+ parts

$5.940

1k+ parts

$5.820

10k+ parts

-

248

$6.060

$5.940

$5.820

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,428 parts In-Stock

1+ parts

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7,428

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Digiode

USA . 4,916 parts In-Stock

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4,916

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Distributors (Availability)

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One Stop Electronics

USA . 184 parts In-Stock

1+ parts

$3.000

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-

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184

$3.000

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AZTECH Wire

Italy . 190 parts In-Stock

1+ parts

$18.152

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190

$18.152

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Parana Technologies

USA . 185 parts In-Stock

1+ parts

$76.747

100+ parts

-

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185

$76.747

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DigiPath Technology Company

USA . 56 parts In-Stock

1+ parts

$84.508

100+ parts

$77.748

1k+ parts

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56

$84.508

$77.748

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ChromeModa Solutions

Germany . 6,693 parts In-Stock

1+ parts

$86.233

100+ parts

$70.711

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6,693

$86.233

$70.711

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IDEA Electronic Components Group

UK . 85 parts In-Stock

1+ parts

$86.233

100+ parts

$81.921

1k+ parts

$77.610

10k+ parts

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85

$86.233

$81.921

$77.610

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Corphita

USA . 1,081 parts In-Stock

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1,081

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Microchip USA

USA . 448 parts In-Stock

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448

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Overview

Unlock limitless possibilities with the Texas Instruments MSP430F2417TZQW Microcontroller. Manufactured by industry leader TI, this powerful device offers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller provides customers with exceptional value, benefits, and advantages. Whether you're looking to power your next project or enhance existing systems, the MSP430F2417TZQW delivers cutting-edge performance and innovation that will take your designs to the next level. Elevate your electronics with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the microcontroller from external damages.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various systems.

CPU Family: MSP430

Known for low power consumption, making it suitable for battery-operated devices.

ADC Channels: YES

Allows for analog to digital conversion, enabling the microcontroller to interface with sensors and other analog devices.

Connectivity: I2C(2), SPI(4), UART(2)

Multiple connectivity options enable easy communication with other devices and peripherals.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and quick updates to the program code.

Low Power Mode: YES

Enables power-saving features, extending the battery life of devices using this microcontroller.

Technical Specifications

Microcontrollers MSP430F2417TZQW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

4096

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.595 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(4), UART(2)

Peripherals:

BROWN-OUT DETECT, COMPARATOR, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F2417TZQW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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