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MSP430F2350IYFFR

Texas Instruments

MSP430F2350IYFFR by Texas Instruments

MSP430F2350IYFFR by Texas Instruments is a 16-bit microcontroller with 2048 bytes of RAM and 16640 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, LIN, SCI(2), SPI(2), UART interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,918 parts In-Stock

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Digiode

USA . 3,794 parts In-Stock

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3,794

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

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AZTECH Wire

Italy . 221 parts In-Stock

1+ parts

$9.454

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221

$9.454

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Ampacity Inc.

Singapore . 1,635 parts In-Stock

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$33.000

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$33.000

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One Stop Electronics

USA . 931 parts In-Stock

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$33.000

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931

$33.000

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Parana Technologies

USA . 2,049 parts In-Stock

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$70.744

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2,049

$70.744

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DigiPath Technology Company

USA . 2,368 parts In-Stock

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$77.898

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$71.666

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2,368

$77.898

$71.666

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ChromeModa Solutions

Germany . 3,068 parts In-Stock

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$79.488

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$65.180

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3,068

$79.488

$65.180

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IDEA Electronic Components Group

UK . 1,480 parts In-Stock

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$79.488

100+ parts

$75.514

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$71.539

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1,480

$79.488

$75.514

$71.539

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Continental Prestige Electronics

USA . 4,368 parts In-Stock

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Corphita

USA . 3,676 parts In-Stock

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Argo Parts USA

USA . 1,426 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Microchip USA

USA . 233 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F2350IYFFR microcontroller. Designed with precision and quality in mind, this device offers unparalleled performance across a wide range of applications. With cutting-edge technology and versatile connectivity options, this microcontroller delivers value and efficiency to customers seeking top-of-the-line solutions. Experience the advantages of the MSP430 family and elevate your projects to new heights with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and helps in protecting the microcontroller from external elements, ensuring longevity.

Surface Mount: YES

Surface mount technology allows for easy assembly on PCBs, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various voltage sources.

Bit Size: 16

The 16-bit architecture enables efficient data processing and execution of complex algorithms, making the microcontroller suitable for a wide range of applications.

No. of Terminals: 49

Having a higher number of terminals provides more connectivity options and allows for interfacing with multiple external devices, enhancing the versatility of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures high performance and power efficiency, making it an ideal choice for applications where speed and energy consumption are critical factors.

ROM Programmability: FLASH

The flash programmable memory allows for easy reprogramming of the microcontroller, facilitating firmware updates and customization without the need for specialized equipment.

Connectivity: I2C, IRDA, LIN, SCI(2), SPI(2), UART

Support for multiple communication interfaces enables seamless integration with various peripherals and devices, expanding the connectivity options of the microcontroller.

Technical Specifications

Microcontrollers MSP430F2350IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Length:

3.202 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

32

No. of Terminals:

49

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16640

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.202 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SCI(2), SPI(2), UART

Peripherals:

BOD, COMPARATOR, TIMER(2), WDT

Trade Compliance

MSP430F2350IYFFR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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