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MSP430F233TPM

Texas Instruments

MSP430F233TPM by Texas Instruments

MSP430F233TPM by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 16 MHz, offering low power mode and ADC channels for applications requiring industrial temperature grade performance. The package style is flatpack with a terminal pitch of 0.5 mm, suitable for connectivity via I2C, IRDA, LIN, SPI(2), UART, USCI(2).

Median Price

$4.858

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 47,198 parts In-Stock

1+ parts

$4.858

100+ parts

$3.960

1k+ parts

$2.640

10k+ parts

-

47,198

$4.858

$3.960

$2.640

-

Mouser Electronics

USA . 363 parts In-Stock

1+ parts

$7.130

100+ parts

$4.530

1k+ parts

$4.320

10k+ parts

$4.260

363

$7.130

$4.530

$4.320

$4.260

DigiKey

USA . 265 parts In-Stock

1+ parts

$7.130

100+ parts

$5.093

1k+ parts

$4.528

10k+ parts

-

265

$7.130

$5.093

$4.528

-

Rochester

USA . 167 parts In-Stock

1+ parts

-

100+ parts

$3.800

1k+ parts

$3.400

10k+ parts

$3.200

167

-

$3.800

$3.400

$3.200

Verical

USA . 167 parts In-Stock

1+ parts

-

100+ parts

$4.750

1k+ parts

$4.250

10k+ parts

$4.000

167

-

$4.750

$4.250

$4.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 218 parts In-Stock

1+ parts

$2.168

100+ parts

$2.277

1k+ parts

$2.147

10k+ parts

-

218

$2.168

$2.277

$2.147

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Digiode

USA . 4,845 parts In-Stock

1+ parts

$3.486

100+ parts

-

1k+ parts

-

10k+ parts

-

4,845

$3.486

-

-

-

Bristol Electronics

USA . 86 parts In-Stock

1+ parts

$6.272

100+ parts

$2.927

1k+ parts

-

10k+ parts

-

86

$6.272

$2.927

-

-

Vyrian

USA . 4,065 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,065

-

-

-

-

DigiKey Marketplace

USA . 167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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167

-

-

-

-

Dan-Mar Components

USA . 86 parts In-Stock

1+ parts

-

100+ parts

-

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86

-

-

-

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Semtec, LLC

USA . 35 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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35

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,157 parts In-Stock

1+ parts

$3.303

100+ parts

-

1k+ parts

-

10k+ parts

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3,157

$3.303

-

-

-

Parana Technologies

USA . 243 parts In-Stock

1+ parts

$49.927

100+ parts

-

1k+ parts

-

10k+ parts

-

243

$49.927

-

-

-

ChromeModa Solutions

Germany . 2,151 parts In-Stock

1+ parts

$56.098

100+ parts

$46.000

1k+ parts

-

10k+ parts

-

2,151

$56.098

$46.000

-

-

IDEA Electronic Components Group

UK . 1,484 parts In-Stock

1+ parts

$56.098

100+ parts

$53.293

1k+ parts

$50.488

10k+ parts

-

1,484

$56.098

$53.293

$50.488

-

Lixinc

USA . 10,093 parts In-Stock

1+ parts

-

100+ parts

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10,093

-

-

-

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DigiPath Technology Company

USA . 1,676 parts In-Stock

1+ parts

-

100+ parts

$50.578

1k+ parts

-

10k+ parts

-

1,676

-

$50.578

-

-

Authorized Procurement Solutions

USA . 35 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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35

-

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Overview

Experience next-level performance and efficiency with the Texas Instruments MSP430F233TPM microcontroller. Designed with precision and quality in mind, this device offers unparalleled reliability and versatility for a wide range of applications. From industrial automation to consumer electronics, the MSP430F233TPM provides superior functionality and low power consumption, ensuring optimal performance in any project. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities for innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

No. of Terminals: 64

Provides ample connectivity options for interfacing with other components and peripherals.

ROM Words: 8192

Offers a large amount of storage space for program code and data, allowing for complex applications to be executed efficiently.

Maximum Clock Frequency: 16 MHz

Enables high-speed processing, making the microcontroller suitable for applications that require quick response times.

Analog To Digital Convertors: 8-Ch 12-Bit

Allows for precise and accurate conversion of analog signals to digital data, making the microcontroller ideal for sensor interfacing and data acquisition applications.

Connectivity: "I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Supports a variety of communication protocols, enhancing the microcontroller's compatibility with different devices and systems.

Low Power Mode: YES

Enables power-efficient operation, extending battery life in portable devices and reducing overall power consumption.

Technical Specifications

Microcontrollers MSP430F233TPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR, TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F233TPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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