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MSP430F2274IYFFT

Texas Instruments

MSP430F2274IYFFT by Texas Instruments

MSP430F2274IYFFT by Texas Instruments is a 16-bit microcontroller with 32768 ROM words, 1024 RAM bytes, and 12-Ch 10-Bit ADC channels. It operates at a max clock frequency of 16 MHz and features low power mode for industrial applications requiring high-speed processing and connectivity via I2C, IRDA, LIN, SPI(2), UART, USCI(2).

Median Price

$4.950

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$5.371

100+ parts

$4.379

1k+ parts

$2.919

10k+ parts

-

1,500

$5.371

$4.379

$2.919

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.529

10k+ parts

-

250

-

-

$4.529

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,711 parts In-Stock

1+ parts

$5.102

100+ parts

-

1k+ parts

-

10k+ parts

-

4,711

$5.102

-

-

-

Vyrian

USA . 6,492 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,492

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 563 parts In-Stock

1+ parts

$4.834

100+ parts

-

1k+ parts

-

10k+ parts

-

563

$4.834

-

-

-

Component Stockers USA

USA . 361 parts In-Stock

1+ parts

$6.920

100+ parts

$5.180

1k+ parts

-

10k+ parts

-

361

$6.920

$5.180

-

-

Microchip USA

USA . 2,470 parts In-Stock

1+ parts

$14.030

100+ parts

$13.830

1k+ parts

$13.730

10k+ parts

$13.630

2,470

$14.030

$13.830

$13.730

$13.630

Parana Technologies

USA . 2,327 parts In-Stock

1+ parts

$51.714

100+ parts

-

1k+ parts

-

10k+ parts

-

2,327

$51.714

-

-

-

DigiPath Technology Company

USA . 421 parts In-Stock

1+ parts

$56.944

100+ parts

$52.388

1k+ parts

-

10k+ parts

-

421

$56.944

$52.388

-

-

ChromeModa Solutions

Germany . 3,322 parts In-Stock

1+ parts

$58.106

100+ parts

$47.647

1k+ parts

-

10k+ parts

-

3,322

$58.106

$47.647

-

-

IDEA Electronic Components Group

UK . 887 parts In-Stock

1+ parts

$58.106

100+ parts

$55.201

1k+ parts

$52.295

10k+ parts

-

887

$58.106

$55.201

$52.295

-

QUARKTWIN TECHNOLOGY LTD

USA . 2,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,442

-

-

-

-

Overview

Elevate your projects with the Texas Instruments MSP430F2274IYFFT microcontroller - a top-tier solution in the world of electronics. Crafted with precision and reliability by a renowned manufacturer, this device offers unparalleled performance in a compact package. Ideal for a wide range of applications, from IoT devices to industrial automation, this microcontroller delivers exceptional value with its low power consumption, advanced peripherals, and high-speed processing capabilities. Trust in Texas Instruments to bring innovation to your designs with the MSP430F2274IYFFT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protection for the microcontroller, making it suitable for various environmental conditions.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

Bit Size: 16

16-bit architecture enables the microcontroller to process data and instructions with higher precision and efficiency.

No. of Terminals: 49

Large number of terminals provide ample connectivity options for interfacing with external devices and components.

ADC Channels: YES

Analog to Digital Converters enable the microcontroller to interface with analog sensors and inputs, expanding its functionality.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control over analog outputs, making the microcontroller suitable for motor control and power regulation applications.

Connectivity: "I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Multiple connectivity options ensure compatibility with a wide range of communication protocols, facilitating integration into diverse systems.

Low Power Mode: YES

Low power mode capability enhances energy efficiency, prolonging battery life and reducing overall power consumption.

Technical Specifications

Microcontrollers MSP430F2274IYFFT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

49

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2274IYFFT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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