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MSP430F2274IYFFR

Texas Instruments

MSP430F2274IYFFR by Texas Instruments

MSP430F2274IYFFR by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 1024 bytes of RAM, and 32768 ROM words. It operates at a max clock frequency of 16 MHz and features low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$4.160

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 30,750 parts In-Stock

1+ parts

$4.160

100+ parts

$3.392

1k+ parts

$2.261

10k+ parts

-

30,750

$4.160

$3.392

$2.261

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,309 parts In-Stock

1+ parts

$3.952

100+ parts

-

1k+ parts

-

10k+ parts

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4,309

$3.952

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-

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Vyrian

USA . 8,793 parts In-Stock

1+ parts

-

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8,793

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Distributors (Availability)

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Corphita

USA . 4,987 parts In-Stock

1+ parts

$3.744

100+ parts

-

1k+ parts

-

10k+ parts

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4,987

$3.744

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AZTECH Wire

Italy . 924 parts In-Stock

1+ parts

$10.530

100+ parts

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924

$10.530

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Parana Technologies

USA . 1,759 parts In-Stock

1+ parts

$72.434

100+ parts

-

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1,759

$72.434

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ChromeModa Solutions

Germany . 4,831 parts In-Stock

1+ parts

$81.387

100+ parts

$66.737

1k+ parts

-

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4,831

$81.387

$66.737

-

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IDEA Electronic Components Group

UK . 1,104 parts In-Stock

1+ parts

$81.387

100+ parts

$77.318

1k+ parts

$73.248

10k+ parts

-

1,104

$81.387

$77.318

$73.248

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Perfect Parts

USA . 4,493 parts In-Stock

1+ parts

-

100+ parts

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4,493

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DigiPath Technology Company

USA . 487 parts In-Stock

1+ parts

-

100+ parts

$73.379

1k+ parts

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487

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$73.379

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Overview

Unlock endless possibilities with the MSP430F2274IYFFR microcontroller by Texas Instruments. Perfect for a wide range of applications, this powerful device offers exceptional quality and reliability. With advanced features like low power mode and multiple peripherals, this microcontroller provides unmatched value to customers seeking efficiency and innovation. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430F2274IYFFR is the solution you've been looking for. Elevate your projects with Texas Instruments' cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers as it provides good protection and insulation for the components inside the package.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the microcontroller onto a circuit board, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

This higher supply voltage allows for flexibility in powering the microcontroller and the connected peripherals without exceeding the maximum rating.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster and more efficient data processing within the microcontroller.

Package Shape: SQUARE

Square packages are typically easier to handle and place on a circuit board, simplifying the assembly process.

Bit Size: 16

A 16-bit microcontroller can handle larger chunks of data at a time, making it suitable for applications requiring higher precision and processing capabilities.

Power Supplies (V): 2/3.3

Having multiple power supply options allows for compatibility with different systems and voltages, making the microcontroller versatile in various applications.

No. of Terminals: 49

More terminals provide greater flexibility in connecting peripherals and external components, enhancing the functionality of the microcontroller.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a compact footprint, enabling high-density integration on a circuit board while maintaining good electrical connections.

Minimum Supply Voltage: 3.3 V

The minimum supply voltage specification ensures reliable operation within a specified range, preventing potential damage from under-voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and maintain performance in industrial settings.

CPU Family: MSP430

The MSP430 family of microcontrollers is known for its low power consumption and high processing efficiency, making it suitable for battery-operated devices and IoT applications.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature range ensures reliable performance in cold environments, making the microcontroller suitable for outdoor and automotive applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections between the microcontroller and external components over time.

ADC Channels: YES

Having analog-to-digital converter channels allows the microcontroller to interface with analog sensors and signals, enabling a wide range of applications that require analog data processing.

Terminal Position: BOTTOM

The bottom terminal position simplifies the layout and routing of traces on a circuit board, optimizing signal integrity and minimizing electromagnetic interference.

ROM Words: 32768

With a large ROM capacity, this microcontroller can store and execute complex programs and algorithms, making it suitable for applications that require extensive code storage.

Maximum Seated Height: 0.625 mm

The low seated height of the package offers a slim profile, enabling compact and space-efficient designs in portable and handheld devices.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microcontroller and the connected circuit board, simplifying the production and quality control processes.

Peripherals: "BOD, COMPARATOR(8), TIMER(6), WDT

The inclusion of various peripherals enhances the functionality of the microcontroller, enabling a wide range of applications that require analog-to-digital conversion, timing, and watchdog functionality.

Maximum Clock Frequency: 16 MHz

A high clock frequency allows for fast execution of instructions and real-time processing, making the microcontroller suitable for time-critical applications and high-speed data communication.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering and assembly of the microcontroller onto a circuit board, preventing solder joint failures during manufacturing.

Temperature Grade: INDUSTRIAL

The industrial temperature grade of the microcontroller ensures reliable operation in harsh environments with high temperature fluctuations, meeting the requirements of industrial automation and control systems.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and reduced power consumption, making this microcontroller suitable for applications that require efficient data processing and low power consumption.

No. of Timers: 6

Multiple timers enable precise timing control and synchronization of tasks within the microcontroller, allowing for real-time operation and sophisticated automation capabilities.

RAM Bytes: 1024

Having a large RAM capacity allows the microcontroller to buffer and process data efficiently, improving overall system performance and responsiveness in multitasking applications.

Technology: BIPOLAR

Bipolar technology offers high-speed operation and low noise characteristics, making this microcontroller suitable for applications that require fast signal processing and high-frequency operation.

Terminal Form: BALL

Ball terminals provide good solder joint reliability and high-density packaging, enabling compact and reliable assembly of the microcontroller in space-constrained applications.

Analog To Digital Convertors: 12-Ch 10-Bit

With multiple ADC channels and high resolution, this microcontroller can interface with a variety of analog sensors and signals, enabling precise and accurate data acquisition in instrumentation and control systems.

Maximum Supply Current: 0.55 mA

The low maximum supply current ensures energy-efficient operation and prolongs battery life in portable devices, making this microcontroller suitable for power-sensitive applications.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage specification ensures stable and efficient operation of the microcontroller within a specified voltage range, maintaining performance and reliability in various applications.

No. of Serial I/Os: 2

Having multiple serial I/O ports enables communication with external devices and peripherals, enhancing the connectivity and versatility of the microcontroller in networked and sensor-based applications.

PWM Channels: YES

Pulse width modulation (PWM) channels allow for accurate and efficient control of analog signals and motor speed, making this microcontroller suitable for applications that require precise signal modulation and motor control.

Connectivity: "I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Support for multiple communication protocols enables seamless integration with a wide range of devices and systems, enhancing the interoperability and flexibility of the microcontroller in networked applications.

ROM Programmability: FLASH

Flash ROM allows for easy and fast reprogramming of the microcontroller with updated firmware and software, enabling quick prototyping and customization of applications without requiring external programming tools.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for high-density packaging and efficient routing of traces on a circuit board, enabling compact and miniaturized designs in space-constrained applications.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and reduces processing overhead, making this microcontroller suitable for applications that require efficient and accurate numerical calculations.

Speed: 16 rpm

With a high speed rating, this microcontroller can execute instructions quickly and efficienctly, making it suitable for high-performance applications that require rapid data processing and response times.

Low Power Mode: YES

The low power mode feature allows the microcontroller to conserve energy and prolong battery life in portable and energy-sensitive applications, making it an ideal choice for battery-powered devices and wireless sensors.

On Chip Program ROM Width: 8

Having a wide on-chip program ROM width allows the microcontroller to store and execute complex programs and algorithms with ease, enabling versatile and customizable applications.

Technical Specifications

Microcontrollers MSP430F2274IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

49

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2274IYFFR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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