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MSP430F2272TRHARQ1

Texas Instruments

MSP430F2272TRHARQ1 by Texas Instruments

MSP430F2272TRHARQ1 by Texas Instruments is a 16-bit microcontroller with 32768 ROM words, 1024 RAM bytes, and 12-Ch 10-Bit ADC channels. Ideal for industrial applications due to its low power mode, it offers connectivity through I2C, IRDA, SPI(2), UART interfaces. With a max clock frequency of 16 MHz and integrated cache, it ensures efficient performance in various embedded systems.

Median Price

$4.815

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,444 parts In-Stock

1+ parts

$4.815

100+ parts

$3.926

1k+ parts

$2.617

10k+ parts

-

11,444

$4.815

$3.926

$2.617

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,042 parts In-Stock

1+ parts

$4.574

100+ parts

-

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-

10k+ parts

-

3,042

$4.574

-

-

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Vyrian

USA . 4,541 parts In-Stock

1+ parts

-

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-

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4,541

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

1+ parts

-

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1k+ parts

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2,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,937 parts In-Stock

1+ parts

$4.334

100+ parts

-

1k+ parts

-

10k+ parts

-

2,937

$4.334

-

-

-

AZTECH Wire

Italy . 781 parts In-Stock

1+ parts

$14.460

100+ parts

-

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-

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781

$14.460

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-

-

Parana Technologies

USA . 964 parts In-Stock

1+ parts

$47.053

100+ parts

-

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964

$47.053

-

-

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DigiPath Technology Company

USA . 333 parts In-Stock

1+ parts

$51.811

100+ parts

-

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-

10k+ parts

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333

$51.811

-

-

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ChromeModa Solutions

Germany . 2,141 parts In-Stock

1+ parts

$52.868

100+ parts

$43.352

1k+ parts

-

10k+ parts

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2,141

$52.868

$43.352

-

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IDEA Electronic Components Group

UK . 896 parts In-Stock

1+ parts

$52.868

100+ parts

$50.225

1k+ parts

$47.581

10k+ parts

-

896

$52.868

$50.225

$47.581

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Perfect Parts

USA . 25,200 parts In-Stock

1+ parts

-

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25,200

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QUARKTWIN TECHNOLOGY LTD

USA . 24,286 parts In-Stock

1+ parts

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24,286

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Lixinc

USA . 4,555 parts In-Stock

1+ parts

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4,555

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A-Z Elektronik GmbH

Germany . 4,500 parts In-Stock

1+ parts

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4,500

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GreenTree Electronics

Israel . 2,500 parts In-Stock

1+ parts

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2,500

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Metaverse IC Inc.

Canada . 220 parts In-Stock

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220

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Overview

Enhance your next project with the MSP430F2272TRHARQ1 by Texas Instruments, a high-quality microcontroller perfect for a wide range of applications. With its integrated cache, low power mode, and connectivity options such as I2C, IRDA, SPI, and UART, this versatile chip offers unmatched value and benefits to customers. Trust in Texas Instruments' reputation for excellence in manufacturing to deliver a reliable solution for your design needs. Upgrade your technology today with the MSP430F2272TRHARQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it provides good insulation and protection for the components inside the package.

Integrated Cache: YES

Having an integrated cache can improve the processing speed and efficiency of the microcontroller, making it a good choice for high-performance applications.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for more flexibility in power supply options for the microcontroller.

RAM Bytes: 1024

Having a larger RAM capacity allows the microcontroller to handle more data and perform complex tasks, making it suitable for a wide range of applications.

ADC Channels: YES

Having analog to digital converter channels allows the microcontroller to interface with analog sensors and signals, expanding its versatility in applications that require analog input/output.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller architecture means that it can execute instructions at a faster rate, making it efficient for real-time processing and control applications.

Connectivity: I2C, IRDA, SPI(2), UART

Support for multiple communication interfaces allows the microcontroller to easily interface with other devices, sensors, and peripherals, making it suitable for IoT and embedded applications.

Technical Specifications

Microcontrollers MSP430F2272TRHARQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 4.15MHZ AT 1.8V MIN SUPPLY, FLASH OPERATIONS REQUIRES 2.2V MIN SUPPLY, HAVING 256B FLASH

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

40

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

BOD, TIMER(2), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2272TRHARQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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