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MSP430F2252TRHARQ1

Texas Instruments

MSP430F2252TRHARQ1 by Texas Instruments

MSP430F2252TRHARQ1 by Texas Instruments is a 16-bit microcontroller with 512 bytes of RAM and 32 I/O lines. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Featuring ADC channels, PWM support, and connectivity options like I2C and UART, it's ideal for embedded systems design.

Median Price

$4.694

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,997 parts In-Stock

1+ parts

$4.694

100+ parts

$3.827

1k+ parts

$2.551

10k+ parts

-

6,997

$4.694

$3.827

$2.551

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,963 parts In-Stock

1+ parts

$4.459

100+ parts

-

1k+ parts

-

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3,963

$4.459

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-

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Vyrian

USA . 8,042 parts In-Stock

1+ parts

-

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-

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-

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8,042

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,980 parts In-Stock

1+ parts

$3.990

100+ parts

-

1k+ parts

-

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6,980

$3.990

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-

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Semicontronic

India . 6,928 parts In-Stock

1+ parts

$3.990

100+ parts

$3.890

1k+ parts

$3.870

10k+ parts

-

6,928

$3.990

$3.890

$3.870

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Corphita

USA . 3,070 parts In-Stock

1+ parts

$4.225

100+ parts

-

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-

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3,070

$4.225

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Corohmni

South Africa . 450 parts In-Stock

1+ parts

$4.694

100+ parts

-

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450

$4.694

-

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AZTECH Wire

Italy . 329 parts In-Stock

1+ parts

$12.730

100+ parts

-

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10k+ parts

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329

$12.730

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Microchip USA

USA . 1,922 parts In-Stock

1+ parts

$21.770

100+ parts

$21.640

1k+ parts

$21.570

10k+ parts

$21.500

1,922

$21.770

$21.640

$21.570

$21.500

Parana Technologies

USA . 42 parts In-Stock

1+ parts

$72.353

100+ parts

-

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42

$72.353

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ChromeModa Solutions

Germany . 4,361 parts In-Stock

1+ parts

$81.296

100+ parts

$66.663

1k+ parts

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10k+ parts

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4,361

$81.296

$66.663

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IDEA Electronic Components Group

UK . 1,411 parts In-Stock

1+ parts

$81.296

100+ parts

$77.231

1k+ parts

$73.166

10k+ parts

-

1,411

$81.296

$77.231

$73.166

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A-Z Elektronik GmbH

Germany . 4,788 parts In-Stock

1+ parts

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4,788

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DigiPath Technology Company

USA . 2,357 parts In-Stock

1+ parts

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100+ parts

$73.296

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2,357

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$73.296

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Overview

Enhance your electronic projects with the Texas Instruments MSP430F2252TRHARQ1 microcontroller, known for its high-quality design and reliable performance. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology that meets the demands of various applications. This microcontroller offers value by providing integrated cache, low power mode, and multiple peripherals such as ADC channels and PWM channels. With a wide temperature range and small form factor, the MSP430F2252TRHARQ1 is perfect for industrial-grade projects where reliability is key. Experience the benefits of this versatile microcontroller and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications while keeping the overall weight of the device low.

Integrated Cache: YES

Having an integrated cache helps improve the overall performance of the microcontroller by storing frequently accessed data for quicker access, enhancing the speed of operations.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for compatibility with a wider range of power sources, offering flexibility in design and usage.

On Chip Data RAM Width: 8

The wider data RAM width allows for faster data processing and manipulation, increasing the efficiency of the microcontroller in handling tasks.

Screening Level: AEC-Q100

This screening level ensures that the microcontroller meets automotive-grade standards, making it suitable for use in automotive applications where reliability and ruggedness are crucial.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller, it is optimized for efficient and fast processing, making it a good choice for applications requiring quick response times.

Technical Specifications

Microcontrollers MSP430F2252TRHARQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 4.15MHZ AT 1.8V MIN SUPPLY, FLASH OPERATIONS REQUIRES 2.2V MIN SUPPLY, HAVING 256B FLASH

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

40

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

512

ROM Words:

0

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

BOD, TIMER(2), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2252TRHARQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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