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MSP430F2252TDAR

Texas Instruments

MSP430F2252TDAR by Texas Instruments

MSP430F2252TDAR by Texas Instruments is a 16-bit microcontroller with 16384 ROM words and 512 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, LIN, SPI, UART interfaces.

Median Price

$3.732

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 24,584 parts In-Stock

1+ parts

$3.732

100+ parts

$3.042

1k+ parts

$2.028

10k+ parts

-

24,584

$3.732

$3.042

$2.028

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,053 parts In-Stock

1+ parts

$3.545

100+ parts

-

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4,053

$3.545

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Vyrian

USA . 2,744 parts In-Stock

1+ parts

-

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2,744

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Chip Stock

USA . 260 parts In-Stock

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260

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,498 parts In-Stock

1+ parts

$3.359

100+ parts

-

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-

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2,498

$3.359

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AZTECH Wire

Italy . 598 parts In-Stock

1+ parts

$19.490

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598

$19.490

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Parana Technologies

USA . 128 parts In-Stock

1+ parts

$22.413

100+ parts

-

1k+ parts

$23.088

10k+ parts

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128

$22.413

-

$23.088

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ChromeModa Solutions

Germany . 4,831 parts In-Stock

1+ parts

$25.183

100+ parts

$20.650

1k+ parts

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4,831

$25.183

$20.650

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IDEA Electronic Components Group

UK . 244 parts In-Stock

1+ parts

$25.183

100+ parts

$23.924

1k+ parts

$22.665

10k+ parts

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244

$25.183

$23.924

$22.665

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QUARKTWIN TECHNOLOGY LTD

USA . 23,651 parts In-Stock

1+ parts

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23,651

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Metaverse IC Inc.

Canada . 2,900 parts In-Stock

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2,900

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Kepictronics

USA . 2,715 parts In-Stock

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2,715

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DigiPath Technology Company

USA . 1,724 parts In-Stock

1+ parts

-

100+ parts

$22.705

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1,724

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$22.705

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Lixinc

USA . 360 parts In-Stock

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360

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F2252TDAR microcontroller. Crafted with precision and expertise, this device offers unparalleled quality and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers unmatched performance and efficiency. Embrace the future of technology with the MSP430F2252TDAR and experience the seamless integration of cutting-edge features and advanced capabilities. Elevate your projects to new heights with this versatile and dynamic solution from Texas Instruments.

Feature Benefit Bullets

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

Bit Size: 16

Provides a good balance between processing power and memory efficiency for various tasks.

No. of Terminals: 38

Sufficient number of terminals for connectivity and interfacing with external components.

Minimum Operating Temperature: -40 °C

Can operate reliably in harsh environmental conditions with low temperatures.

ADC Channels: YES

Ability to interface with analog sensors and signals for a wider range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses RISC architecture for efficient processing and control of peripherals.

Technology: BIPOLAR

Reliable and robust bipolar technology for improved performance and stability.

Connectivity: "I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Offers a variety of communication interfaces for enhanced connectivity options.

Low Power Mode: YES

Enables power-efficient operation, making it suitable for battery-powered devices.

Technical Specifications

Microcontrollers MSP430F2252TDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2252TDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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