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MSP430F2234TDA

Texas Instruments

MSP430F2234TDA by Texas Instruments

MSP430F2234TDA by Texas Instruments is a 16-bit microcontroller with 8KB ROM, 512B RAM, and 12-Ch 10-Bit ADC. Ideal for industrial applications due to its low power mode, operating temperature range of -40 to 105°C, and connectivity options like I2C, LIN, SPI.

Median Price

$4.002

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,750 parts In-Stock

1+ parts

$4.054

100+ parts

$3.305

1k+ parts

$2.203

10k+ parts

-

1,750

$4.054

$3.305

$2.203

-

Rochester

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$3.160

1k+ parts

$2.830

10k+ parts

$2.660

160

-

$3.160

$2.830

$2.660

DigiKey

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$4.160

1k+ parts

-

10k+ parts

-

160

-

$4.160

-

-

Verical

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$3.950

1k+ parts

$3.538

10k+ parts

$3.325

160

-

$3.950

$3.538

$3.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,418 parts In-Stock

1+ parts

$2.907

100+ parts

-

1k+ parts

-

10k+ parts

-

1,418

$2.907

-

-

-

Vyrian

USA . 4,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,675

-

-

-

-

DigiKey Marketplace

USA . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,497 parts In-Stock

1+ parts

$2.754

100+ parts

-

1k+ parts

-

10k+ parts

-

4,497

$2.754

-

-

-

Microchip USA

USA . 2,704 parts In-Stock

1+ parts

$20.670

100+ parts

$20.540

1k+ parts

$20.480

10k+ parts

$20.420

2,704

$20.670

$20.540

$20.480

$20.420

Parana Technologies

USA . 1,672 parts In-Stock

1+ parts

$66.721

100+ parts

-

1k+ parts

-

10k+ parts

-

1,672

$66.721

-

-

-

DigiPath Technology Company

USA . 1,761 parts In-Stock

1+ parts

$73.468

100+ parts

-

1k+ parts

-

10k+ parts

-

1,761

$73.468

-

-

-

ChromeModa Solutions

Germany . 4,348 parts In-Stock

1+ parts

$74.967

100+ parts

$61.473

1k+ parts

-

10k+ parts

-

4,348

$74.967

$61.473

-

-

IDEA Electronic Components Group

UK . 395 parts In-Stock

1+ parts

$74.967

100+ parts

$71.219

1k+ parts

$67.470

10k+ parts

-

395

$74.967

$71.219

$67.470

-

Overview

Unleash the power of innovation with the MSP430F2234TDA microcontroller by Texas Instruments. Designed with precision and excellence, this product offers unmatched performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this Microcontroller is the perfect solution for your next project. With low power consumption and advanced features like ADC channels, PWM channels, and multiple connectivity options, the MSP430F2234TDA provides exceptional value and flexibility. Elevate your designs with Texas Instruments and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps in protecting the internal components of the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring safe operation.

Power Supplies (V): 2/3.3

Supports both 2V and 3.3V power supplies, making it compatible with a wide range of applications.

ADC Channels: YES

Integrated Analog to Digital Converters enable precise measurement of external signals.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides high performance and efficiency in handling instructions.

Connectivity: "I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Multiple connectivity options allow for seamless integration with other devices and communication protocols.

Low Power Mode: YES

Enables power-efficient operation, extending battery life in portable and IoT applications.

Speed: 16 rpm

With a maximum clock frequency of 16 MHz, this microcontroller can handle tasks swiftly and efficiently.

Technical Specifications

Microcontrollers MSP430F2234TDA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), TIMER(6), WDT"

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F2234TDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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