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MSP430F2132IRTVT

Texas Instruments

MSP430F2132IRTVT by Texas Instruments

MSP430F2132IRTVT by Texas Instruments is a 16-bit microcontroller with 8KB ROM and 512B RAM. Operating at max 16MHz, it offers 8 ADC channels, PWM support, and connectivity options like I2C and UART. Ideal for industrial applications requiring low power consumption and high-speed processing in compact designs.

Median Price

$3.620

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,177 parts In-Stock

1+ parts

$3.620

100+ parts

$3.172

1k+ parts

$1.792

10k+ parts

-

1,177

$3.620

$3.172

$1.792

-

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$6.750

100+ parts

$4.060

1k+ parts

$2.930

10k+ parts

-

250

$6.750

$4.060

$2.930

-

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.954

10k+ parts

-

500

-

-

$2.954

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,783 parts In-Stock

1+ parts

$3.439

100+ parts

-

1k+ parts

-

10k+ parts

-

4,783

$3.439

-

-

-

Vyrian

USA . 7,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,393

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,589 parts In-Stock

1+ parts

$3.258

100+ parts

-

1k+ parts

-

10k+ parts

-

3,589

$3.258

-

-

-

Component Stockers USA

USA . 2,209 parts In-Stock

1+ parts

$4.640

100+ parts

$3.410

1k+ parts

$1.910

10k+ parts

-

2,209

$4.640

$3.410

$1.910

-

Microchip USA

USA . 2,677 parts In-Stock

1+ parts

$21.760

100+ parts

$21.630

1k+ parts

$21.560

10k+ parts

$21.500

2,677

$21.760

$21.630

$21.560

$21.500

Advanced Electronics

New Zealand . 19 parts In-Stock

1+ parts

$62.795

100+ parts

$57.143

1k+ parts

$51.492

10k+ parts

-

19

$62.795

$57.143

$51.492

-

Parana Technologies

USA . 195 parts In-Stock

1+ parts

$76.746

100+ parts

$7,126.992

1k+ parts

$69.071

10k+ parts

-

195

$76.746

$7,126.992

$69.071

-

DigiPath Technology Company

USA . 917 parts In-Stock

1+ parts

$84.506

100+ parts

$77.746

1k+ parts

-

10k+ parts

-

917

$84.506

$77.746

-

-

ChromeModa Solutions

Germany . 3,230 parts In-Stock

1+ parts

$86.231

100+ parts

$70.709

1k+ parts

-

10k+ parts

-

3,230

$86.231

$70.709

-

-

IDEA Electronic Components Group

UK . 1,436 parts In-Stock

1+ parts

$86.231

100+ parts

$81.919

1k+ parts

$77.608

10k+ parts

-

1,436

$86.231

$81.919

$77.608

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Enhance your electronic designs with the Texas Instruments MSP430F2132IRTVT microcontroller, a high-quality product that offers unparalleled performance and reliability. Crafted by a trusted manufacturer, this device is perfect for a wide range of applications in industries such as automotive, industrial, and consumer electronics. With its advanced features and low power consumption, the MSP430F2132IRTVT provides exceptional value and benefits to customers, ensuring seamless operation and innovative solutions. Upgrade your projects today with this cutting-edge microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications while keeping the overall product weight low.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power requirements, making this microcontroller suitable for a wide range of applications.

On Chip Data RAM Width: 8

Having a wide data RAM width allows for faster data processing and storage, improving overall performance of the microcontroller.

Package Shape: SQUARE

The square package shape makes it easier to mount the microcontroller onto PCBs, ensuring proper alignment and efficient use of space.

Bit Size: 16

The 16-bit architecture of the microcontroller allows for processing larger chunks of data at a time, increasing efficiency and performance.

Power Supplies (V): 1.8/3.6

Support for multiple power supply voltages gives designers flexibility in designing power-efficient systems using this microcontroller.

No. of Terminals: 32

Having a high number of terminals allows for more connections and peripherals to be integrated with the microcontroller, enhancing its versatility.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even in low-power scenarios, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and operate reliably in a wide range of temperature settings.

CPU Family: MSP430

The MSP430 family of CPUs is known for its low power consumption and high performance, making this microcontroller suitable for power-efficient applications.

Minimum Operating Temperature: -40 °C

The microcontroller can operate effectively in extremely cold temperatures, making it suitable for outdoor and industrial applications where temperature variations are common.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the microcontroller.

ADC Channels: YES

The presence of analog-to-digital converter channels allows the microcontroller to interface with analog sensors and signals, making it versatile for a wide range of applications.

Terminal Position: QUAD

Having a quad terminal position makes it easier to solder the microcontroller onto PCBs and ensures stable connections for reliable operation.

ROM Words: 8192

With a large ROM capacity, the microcontroller can store and execute complex programs, making it suitable for applications that require extensive code storage.

Maximum Seated Height: 0.8 mm

The low seated height of the microcontroller allows for compact design and integration into slim devices, saving space and improving aesthetics.

RAM Words: 0.5

Although small, the RAM capacity allows for temporary data storage during processing, enhancing the microcontroller's performance in handling dynamic data.

Width: 5 mm

The compact width of the microcontroller makes it suitable for space-constrained applications where size is a critical factor.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microcontroller during manufacturing and system integration, ensuring reliability and quality.

Peripherals: BOD, COMPARATOR, POR, TIMER(2), WDT

The presence of various peripherals enhances the microcontroller's capabilities and flexibility in interfacing with external devices and sensors for diverse applications.

Maximum Clock Frequency: 16 MHz

The high clock frequency allows for fast processing and execution of instructions, improving overall performance and throughput of the microcontroller.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures that the microcontroller can withstand the soldering process during assembly without compromising its functionality or integrity.

Length: 5 mm

The compact length of the microcontroller makes it suitable for applications where space is limited, ensuring easy integration and efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

Being industrial-grade, the microcontroller can operate reliably in harsh environments with temperature fluctuations, making it suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller enables efficient and fast execution of instructions, improving overall performance and power efficiency.

No. of Timers: 2

Having multiple timers allows the microcontroller to perform timing and scheduling tasks efficiently, making it suitable for applications that require precise timekeeping and control.

RAM Bytes: 512

Despite the relatively small capacity, the RAM size is sufficient for temporary data storage and processing, enhancing the microcontroller's performance in handling real-time data.

Technology: CMOS

CMOS technology offers high-speed operation, low power consumption, and noise immunity, making the microcontroller reliable and energy-efficient for a wide range of applications.

Terminal Form: NO LEAD

The no-lead terminal form provides better thermal conductivity and reliability in solder joints, ensuring long-term performance and durability of the microcontroller.

Analog To Digital Convertors: 8-Ch 10-Bit

Having multiple analog-to-digital converters with 10-bit resolution allows the microcontroller to accurately process analog signals and sensor data, making it versatile for many applications.

PWM Channels: YES

The presence of pulse-width modulation channels enables the microcontroller to control analog devices and motors with precision, making it suitable for motor control and power management applications.

Connectivity: I2C, IRDA, SPI(2), UART

Support for various communication protocols allows the microcontroller to easily interface with external devices and sensors, enhancing its connectivity and versatility for different applications.

ROM Programmability: FLASH

The programmable flash ROM allows for easy firmware updates and customization of the microcontroller's functionality, making it adaptable to changing application requirements.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting of the microcontroller on PCBs, saving space and enabling compact designs in electronic devices.

Format: FIXED POINT

The fixed-point format simplifies mathematical operations and improves computational efficiency, making the microcontroller suitable for applications requiring precise calculations.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level indicates the level of protection against moisture-related damage, ensuring the microcontroller's reliability and longevity in humid environments.

Speed: 16 rpm

The high speed of 16 rpm allows the microcontroller to execute tasks quickly and efficiently, making it suitable for applications that require fast response times and real-time processing.

Low Power Mode: YES

The low power mode feature allows the microcontroller to conserve energy during periods of inactivity, extending battery life and making it ideal for battery-powered devices.

On Chip Program ROM Width: 8

Having a wide program ROM width enables the microcontroller to store and execute complex programs efficiently, enhancing its performance and functionality in diverse applications.

No. of I/O Lines: 24

With a high number of input/output lines, the microcontroller can interface with a wide range of external devices and sensors, making it versatile for diverse application requirements.

Technical Specifications

Microcontrollers MSP430F2132IRTVT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART"

Peripherals:

"BOD, COMPARATOR, POR, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F2132IRTVT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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