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MSP430F2132CY

Texas Instruments

MSP430F2132CY by Texas Instruments

MSP430F2132CY by Texas Instruments is a 16-bit microcontroller with a max clock frequency of 16 MHz. It features flash ROM programmability and PWM channels, making it ideal for applications requiring precise control and low power consumption. With surface mount capability and CMOS technology, this chip is suitable for various embedded systems projects.

Median Price

$6.200

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 410 parts In-Stock

1+ parts

$6.200

100+ parts

$4.005

1k+ parts

$3.816

10k+ parts

-

410

$6.200

$4.005

$3.816

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,892 parts In-Stock

1+ parts

$4.047

100+ parts

-

1k+ parts

-

10k+ parts

-

2,892

$4.047

-

-

-

Vyrian

USA . 5,912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,912

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,670 parts In-Stock

1+ parts

$3.834

100+ parts

-

1k+ parts

-

10k+ parts

-

2,670

$3.834

-

-

-

Ampacity Inc.

Singapore . 165 parts In-Stock

1+ parts

$4.650

100+ parts

-

1k+ parts

-

10k+ parts

-

165

$4.650

-

-

-

Microchip USA

USA . 2,740 parts In-Stock

1+ parts

$16.940

100+ parts

$16.700

1k+ parts

$16.580

10k+ parts

$16.460

2,740

$16.940

$16.700

$16.580

$16.460

Parana Technologies

USA . 2,082 parts In-Stock

1+ parts

$74.800

100+ parts

-

1k+ parts

-

10k+ parts

-

2,082

$74.800

-

-

-

ChromeModa Solutions

Germany . 2,620 parts In-Stock

1+ parts

$84.045

100+ parts

$68.917

1k+ parts

-

10k+ parts

-

2,620

$84.045

$68.917

-

-

IDEA Electronic Components Group

UK . 2,154 parts In-Stock

1+ parts

$84.045

100+ parts

$79.843

1k+ parts

$75.640

10k+ parts

-

2,154

$84.045

$79.843

$75.640

-

DigiPath Technology Company

USA . 268 parts In-Stock

1+ parts

-

100+ parts

$75.775

1k+ parts

-

10k+ parts

-

268

-

$75.775

-

-

Overview

Experience the power and performance of the Texas Instruments MSP430F2132CY microcontroller. With its superior quality and reliability, this microcontroller is perfect for a wide range of applications. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430F2132CY offers unmatched value and benefits. Trust in Texas Instruments to provide you with cutting-edge technology that delivers exceptional results. Unlock endless possibilities with the MSP430F2132CY and take your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing overall production costs.

Maximum Supply Voltage: 3.6 V

Can operate efficiently within a wide range of supply voltages, providing flexibility in different power supply scenarios.

Bit Size: 16

A 16-bit microcontroller can handle larger data types and perform more complex calculations compared to 8-bit microcontrollers, offering enhanced processing capabilities.

Package Style: UNCASED CHIP

The uncased chip package style allows for direct mounting on a PCB without the need for additional housing, saving space and reducing overall product dimensions.

Minimum Supply Voltage: 3.3 V

With a low minimum supply voltage, the microcontroller can still operate reliably even in low power supply conditions.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, making the microcontroller suitable for a wide range of sensor applications.

Terminal Position: UPPER

The upper terminal position facilitates easy connectivity and PCB layout design, improving the overall ease of integration into a system.

Maximum Clock Frequency: 16 MHz

A high maximum clock frequency enables faster processing speeds and better real-time performance in various applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides efficient instruction execution and reduced complexity, improving performance and power efficiency of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered and noise-sensitive applications.

Terminal Form: NO LEAD

The no-lead terminal form factor simplifies PCB design and manufacturing processes, reducing assembly time and potential soldering issues.

PWM Channels: YES

Integrated PWM channels allow for precise control of analog signals, enabling the microcontroller to drive motors, LEDs, and other devices that require pulse-width modulation.

ROM Programmability: FLASH

FLASH ROM allows for easy and fast reprogramming of the microcontroller's memory, enabling firmware updates and customization without the need for external programming tools.

Speed: 16 rpm

With a speed of 16 rotations per minute, this microcontroller is suitable for applications that require precise timing and control over rotational movements.

Technical Specifications

Microcontrollers MSP430F2132CY attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-XUUC-N

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

MSP430F2132CY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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