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MSP430F2131TDW

Texas Instruments

MSP430F2131TDW by Texas Instruments

MSP430F2131TDW by Texas Instruments is a 16-bit microcontroller with 8192 ROM words and 256 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like 16 timers, PWM channels, and ADC capabilities, it offers versatile functionality in compact dimensions.

Median Price

$3.054

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 275 parts In-Stock

1+ parts

$3.054

100+ parts

$2.676

1k+ parts

$1.512

10k+ parts

-

275

$3.054

$2.676

$1.512

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,487 parts In-Stock

1+ parts

$2.901

100+ parts

-

1k+ parts

-

10k+ parts

-

1,487

$2.901

-

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Vyrian

USA . 7,811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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7,811

-

-

-

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 20 parts In-Stock

1+ parts

-

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-

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20

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,548 parts In-Stock

1+ parts

$2.749

100+ parts

-

1k+ parts

-

10k+ parts

-

2,548

$2.749

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-

-

AZTECH Wire

Italy . 105 parts In-Stock

1+ parts

$17.590

100+ parts

-

1k+ parts

-

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105

$17.590

-

-

-

Microchip USA

USA . 2,608 parts In-Stock

1+ parts

$19.360

100+ parts

$19.240

1k+ parts

$19.180

10k+ parts

$19.120

2,608

$19.360

$19.240

$19.180

$19.120

Parana Technologies

USA . 706 parts In-Stock

1+ parts

$62.746

100+ parts

-

1k+ parts

-

10k+ parts

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706

$62.746

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-

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DigiPath Technology Company

USA . 584 parts In-Stock

1+ parts

$69.091

100+ parts

$63.564

1k+ parts

-

10k+ parts

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584

$69.091

$63.564

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ChromeModa Solutions

Germany . 5,616 parts In-Stock

1+ parts

$70.501

100+ parts

$57.811

1k+ parts

-

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5,616

$70.501

$57.811

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IDEA Electronic Components Group

UK . 1,367 parts In-Stock

1+ parts

$70.501

100+ parts

$66.976

1k+ parts

$63.451

10k+ parts

-

1,367

$70.501

$66.976

$63.451

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Glotronic Ltd.

UK . 9,000 parts In-Stock

1+ parts

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9,000

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Perfect Parts

USA . 140 parts In-Stock

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140

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Overview

Discover the Texas Instruments MSP430F2131TDW microcontroller, a cutting-edge solution for your electronic projects. Designed with precision and expertise, Texas Instruments delivers quality you can trust. This versatile microcontroller offers a wide range of applications in various industries, providing value and performance like no other. With its advanced features and functionality, the MSP430F2131TDW ensures seamless operation and optimal efficiency for all your projects. Trust in Texas Instruments for innovative solutions that push boundaries and exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, making it suitable for a variety of environments and applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a range of voltage inputs for the microcontroller to operate efficiently.

Bit Size: 16

The 16-bit architecture allows for faster processing and more complex operations, making this microcontroller suitable for high-performance applications.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and inputs, expanding its capabilities in data acquisition and processing.

Maximum Clock Frequency: 16 MHz

A high maximum clock frequency of 16 MHz provides fast processing speed, making the microcontroller suitable for tasks requiring real-time data processing or high-speed operations.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller's peripheral IC type allows for efficient and streamlined execution of instructions, enhancing overall performance and responsiveness.

RAM Bytes: 256

With 256 bytes of RAM, the microcontroller can efficiently store and access data during program execution, facilitating smooth operation and data manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for long-term use.

Low Power Mode: YES

The low power mode feature allows the microcontroller to reduce power consumption during idle or low-demand periods, extending battery life and enhancing energy efficiency.

Technical Specifications

Microcontrollers MSP430F2131TDW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2131TDW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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