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MSP430F2131TDGV

Texas Instruments

MSP430F2131TDGV by Texas Instruments

MSP430F2131TDGV by Texas Instruments is a 16-bit microcontroller with a max clock frequency of 16 MHz. It features 256 bytes of RAM and flash ROM programmability, making it ideal for industrial applications requiring low power consumption. With peripherals like BOD, comparator(8), timer(16), and WDT, this CMOS technology-based microcontroller offers high performance in a small outline package.

Median Price

$3.054

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,250 parts In-Stock

1+ parts

$3.054

100+ parts

$2.676

1k+ parts

$1.512

10k+ parts

-

4,250

$3.054

$2.676

$1.512

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,652 parts In-Stock

1+ parts

$2.901

100+ parts

-

1k+ parts

-

10k+ parts

-

1,652

$2.901

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Vyrian

USA . 4,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,077

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,600 parts In-Stock

1+ parts

$2.749

100+ parts

-

1k+ parts

-

10k+ parts

-

4,600

$2.749

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-

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AZTECH Wire

Italy . 594 parts In-Stock

1+ parts

$18.090

100+ parts

-

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594

$18.090

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Microchip USA

USA . 2,148 parts In-Stock

1+ parts

$19.360

100+ parts

$19.240

1k+ parts

$19.180

10k+ parts

$19.120

2,148

$19.360

$19.240

$19.180

$19.120

Parana Technologies

USA . 180 parts In-Stock

1+ parts

$62.194

100+ parts

-

1k+ parts

-

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180

$62.194

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-

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DigiPath Technology Company

USA . 864 parts In-Stock

1+ parts

$68.483

100+ parts

-

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864

$68.483

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ChromeModa Solutions

Germany . 6,254 parts In-Stock

1+ parts

$69.881

100+ parts

$57.302

1k+ parts

-

10k+ parts

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6,254

$69.881

$57.302

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IDEA Electronic Components Group

UK . 1,722 parts In-Stock

1+ parts

$69.881

100+ parts

$66.387

1k+ parts

$62.893

10k+ parts

-

1,722

$69.881

$66.387

$62.893

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2131TDGV microcontroller. Designed with cutting-edge technology and precision engineering, this device offers unparalleled performance and reliability for a wide range of applications. With features like low power consumption, high-speed processing, and versatile peripherals, this microcontroller is perfect for projects in industrial automation, consumer electronics, and more. Trust in Texas Instruments for quality and value, and take your designs to the next level with the MSP430F2131TDGV.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for the package body.

Surface Mount: YES

Easier and more efficient assembly onto PCBs.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

On Chip Data RAM Width: 8

Sufficient RAM capacity for storage and processing.

No. of Terminals: 20

Sufficient number of terminals for connectivity.

Maximum Operating Temperature: 105 °C

High operating temperature range for industrial applications.

CPU Family: MSP430

Reliable and established CPU family for performance.

ADC Channels: YES

Built-in ADC for analog signal processing.

Maximum Clock Frequency: 16 MHz

High clock speed for fast processing tasks.

Technology: CMOS

CMOS technology for low power consumption.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing.

ROM Programmability: FLASH

Flash ROM for easy reprogramming.

Low Power Mode: YES

Energy-efficient low power mode for power savings.

Technical Specifications

Microcontrollers MSP430F2131TDGV attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2131TDGV Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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