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MSP430F2122IRTVT

Texas Instruments

MSP430F2122IRTVT by Texas Instruments

MSP430F2122IRTVT by Texas Instruments is a 16-bit microcontroller with 512 bytes of RAM and 4096 ROM words. Operating at a max frequency of 16 MHz, it features 24 I/O lines and PWM channels for various industrial applications. With an industrial temperature grade range from -40°C to 85°C, this CMOS technology-based chip carrier is suitable for compact designs requiring low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,435 parts In-Stock

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Digiode

USA . 810 parts In-Stock

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810

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One Stop Electronics

USA . 234 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 527 parts In-Stock

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$12.695

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Parana Technologies

USA . 1,234 parts In-Stock

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$76.455

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DigiPath Technology Company

USA . 1,339 parts In-Stock

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$84.187

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ChromeModa Solutions

Germany . 6,444 parts In-Stock

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$85.905

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$70.442

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IDEA Electronic Components Group

UK . 1,887 parts In-Stock

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$85.905

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$81.610

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$77.314

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Corphita

USA . 2,274 parts In-Stock

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Microchip USA

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Overview

Unleash the power of innovation with the MSP430F2122IRTVT by Texas Instruments. Designed with precision and excellence in mind, this microcontroller offers unmatched performance and reliability for a wide range of applications. Whether you're looking to enhance your IoT devices, power management systems, or sensor networks, this product delivers exceptional value and efficiency. Say goodbye to limitations and hello to endless possibilities with the MSP430F2122IRTVT. Experience the Texas Instruments advantage today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy assembly and integration into electronic devices.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle more complex computations and data processing tasks efficiently.

Power Supplies (V): 1.8/3.6

Supporting a wide range of power supplies makes this microcontroller versatile and adaptable to different power sources.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer flexibility in mounting and cooling options, catering to different design requirements.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this microcontroller can withstand harsh environmental conditions.

CPU Family: MSP430

Being a part of the MSP430 family ensures compatibility and access to a wide range of support resources and tools.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent corrosion resistance and conductivity for reliable connections.

ADC Channels: YES

The presence of ADC channels enables analog to digital conversion, allowing the microcontroller to interface with sensors and other analog devices.

ROM Words: 4096

With 4096 ROM words, this microcontroller has sufficient program memory for storing code and instructions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and efficiency in executing instructions.

RAM Bytes: 512

With 512 bytes of RAM, the microcontroller can store and manipulate data effectively during program execution.

PWM Channels: YES

Supporting PWM channels allows for precise control of analog signals, making the microcontroller suitable for applications requiring accurate voltage modulation.

ROM Programmability: FLASH

Flash programmability enables easy and quick updating of the firmware, facilitating product development and maintenance.

Technical Specifications

Microcontrollers MSP430F2122IRTVT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

MSP430F2122IRTVT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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