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MSP430F2121TDGVR

Texas Instruments

MSP430F2121TDGVR by Texas Instruments

MSP430F2121TDGVR by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. Operating at up to 16 MHz, it features 16 timers and PWM channels, suitable for industrial applications requiring low power consumption. With a compact form factor of 5mm x 4.4mm, this CMOS technology-based MCU offers versatile peripherals like BOD, comparator, and timer.

Median Price

$1.682

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,042 parts In-Stock

1+ parts

$1.765

100+ parts

$1.458

1k+ parts

$0.788

10k+ parts

-

13,042

$1.765

$1.458

$0.788

-

Rochester

USA . 679 parts In-Stock

1+ parts

-

100+ parts

$1.540

1k+ parts

$1.280

10k+ parts

$1.140

679

-

$1.540

$1.280

$1.140

DigiKey

USA . 679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.930

10k+ parts

-

679

-

-

$1.930

-

Verical

USA . 679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.600

10k+ parts

$1.425

679

-

-

$1.600

$1.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,514 parts In-Stock

1+ parts

$1.036

100+ parts

-

1k+ parts

-

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-

1,514

$1.036

-

-

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Vyrian

USA . 4,970 parts In-Stock

1+ parts

-

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-

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-

10k+ parts

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4,970

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,403 parts In-Stock

1+ parts

$0.981

100+ parts

-

1k+ parts

-

10k+ parts

-

3,403

$0.981

-

-

-

Microchip USA

USA . 1,090 parts In-Stock

1+ parts

$6.984

100+ parts

-

1k+ parts

-

10k+ parts

-

1,090

$6.984

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$49.801

100+ parts

$45.319

1k+ parts

$40.837

10k+ parts

-

5,000

$49.801

$45.319

$40.837

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Parana Technologies

USA . 885 parts In-Stock

1+ parts

$69.412

100+ parts

-

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-

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885

$69.412

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-

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IDEA Electronic Components Group

UK . 1,511 parts In-Stock

1+ parts

$77.991

100+ parts

$74.091

1k+ parts

$70.192

10k+ parts

-

1,511

$77.991

$74.091

$70.192

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ChromeModa Solutions

Germany . 355 parts In-Stock

1+ parts

$77.991

100+ parts

$63.953

1k+ parts

-

10k+ parts

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355

$77.991

$63.953

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Perfect Parts

USA . 5,840 parts In-Stock

1+ parts

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5,840

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DigiPath Technology Company

USA . 681 parts In-Stock

1+ parts

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100+ parts

$70.317

1k+ parts

-

10k+ parts

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681

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$70.317

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Overview

Elevate your projects with the MSP430F2121TDGVR by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers top-notch quality and reliability. Ideal for a wide range of applications, this product offers unmatched value with its low power consumption, high performance, and versatile peripherals. From industrial automation to consumer electronics, this microcontroller surpasses expectations, providing customers with the advantages they need to bring their innovations to life. Choose the MSP430F2121TDGVR and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to environmental factors, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

Bit Size: 16

16-bit architecture enables processing of larger chunks of data at once, leading to faster operation and efficient performance.

Power Supplies (V): 2/3.3

Support for multiple power supply options allows for versatility in design and operation, catering to different power requirements.

ADC Channels: YES

Presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to interface with analog sensors and input devices, expanding its range of applications.

ROM Programmability: FLASH

Flash ROM allows for programmability and flexibility in updating firmware and software, making it easier to adapt to changing requirements.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments, making it suitable for industrial applications where temperature fluctuations are common.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture in a microcontroller design enables faster execution of instructions and better efficiency in processing data.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption during idle or low processing periods, making the microcontroller suitable for battery-powered devices or energy-efficient applications.

Technical Specifications

Microcontrollers MSP430F2121TDGVR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2121TDGVR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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