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MSP430F2121IDW

Texas Instruments

MSP430F2121IDW by Texas Instruments

MSP430F2121IDW by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. Operating at a max clock frequency of 16 MHz, it features peripherals like BOD, Comparator(8), Timer(16), WDT. Ideal for industrial applications due to its low power mode and wide temperature range (-40 to 85 °C).

Median Price

$1.800

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,700 parts In-Stock

1+ parts

$2.354

100+ parts

$1.944

1k+ parts

$1.051

10k+ parts

-

3,700

$2.354

$1.944

$1.051

-

Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$2.840

100+ parts

$2.450

1k+ parts

$1.790

10k+ parts

$1.740

2

$2.840

$2.450

$1.790

$1.740

Rochester

USA . 877 parts In-Stock

1+ parts

-

100+ parts

$1.370

1k+ parts

$1.220

10k+ parts

$1.150

877

-

$1.370

$1.220

$1.150

DigiKey

USA . 877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.800

10k+ parts

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877

-

-

$1.800

-

Verical

USA . 463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.525

10k+ parts

$1.438

463

-

-

$1.525

$1.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,914 parts In-Stock

1+ parts

$1.387

100+ parts

-

1k+ parts

-

10k+ parts

-

2,914

$1.387

-

-

-

TME

Poland . 41 parts In-Stock

1+ parts

$2.290

100+ parts

$1.580

1k+ parts

-

10k+ parts

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41

$2.290

$1.580

-

-

Chip Stock

USA . 105,010 parts In-Stock

1+ parts

-

100+ parts

-

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105,010

-

-

-

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Vyrian

USA . 5,965 parts In-Stock

1+ parts

-

100+ parts

-

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-

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5,965

-

-

-

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DigiKey Marketplace

USA . 877 parts In-Stock

1+ parts

-

100+ parts

$1.520

1k+ parts

-

10k+ parts

-

877

-

$1.520

-

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Holdelec - ElecDif-Pro

France . 425 parts In-Stock

1+ parts

-

100+ parts

-

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425

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ACDS - Activité Composants Distribution Service

France . 117 parts In-Stock

1+ parts

-

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-

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117

-

-

-

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Bristol Electronics

USA . 117 parts In-Stock

1+ parts

-

100+ parts

$1.228

1k+ parts

$1.146

10k+ parts

-

117

-

$1.228

$1.146

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Dan-Mar Components

USA . 117 parts In-Stock

1+ parts

-

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-

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117

-

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ComSIT Distribution GmbH

Germany . 47 parts In-Stock

1+ parts

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47

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 385 parts In-Stock

1+ parts

$1.314

100+ parts

-

1k+ parts

-

10k+ parts

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385

$1.314

-

-

-

Parana Technologies

USA . 2,254 parts In-Stock

1+ parts

$70.008

100+ parts

$6,501.332

1k+ parts

$63.007

10k+ parts

-

2,254

$70.008

$6,501.332

$63.007

-

DigiPath Technology Company

USA . 282 parts In-Stock

1+ parts

$77.088

100+ parts

$70.921

1k+ parts

-

10k+ parts

-

282

$77.088

$70.921

-

-

ChromeModa Solutions

Germany . 2,437 parts In-Stock

1+ parts

$78.661

100+ parts

$64.502

1k+ parts

-

10k+ parts

-

2,437

$78.661

$64.502

-

-

IDEA Electronic Components Group

UK . 2,232 parts In-Stock

1+ parts

$78.661

100+ parts

$74.728

1k+ parts

$70.795

10k+ parts

-

2,232

$78.661

$74.728

$70.795

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QUARKTWIN TECHNOLOGY LTD

USA . 20,491 parts In-Stock

1+ parts

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20,491

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Microchip USA

USA . 3,911 parts In-Stock

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3,911

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Futuretech Components

Singapore . 833 parts In-Stock

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833

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Kepictronics

USA . 500 parts In-Stock

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500

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2121IDW microcontroller. Designed for reliability and performance, this versatile device is perfect for a wide range of applications. From smart home devices to industrial automation, this microcontroller offers unparalleled value and benefits. With its advanced features and high-quality construction, Texas Instruments continues to set the standard for excellence in the industry. Trust in the MSP430F2121IDW to bring your projects to life with ease and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto PCBs, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems and components.

On Chip Data RAM Width: 8

Having a wider data RAM width enables the microcontroller to handle more data efficiently, improving overall performance.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into different designs and layouts of electronic devices.

Bit Size: 16

A 16-bit architecture provides higher processing power and accuracy compared to lower bit sizes, making it suitable for demanding applications.

Power Supplies (V): 2/3.3

Supporting multiple power supply voltages allows for versatile use of the microcontroller in various systems and environments.

No. of Terminals: 20

Having 20 terminals provides sufficient connectivity options for interfacing with other components and peripherals in a system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices and applications.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and extended operation.

CPU Family: MSP430

Being part of the MSP430 family ensures reliability, compatibility, and support from the manufacturer for further development and optimization.

Technical Specifications

Microcontrollers MSP430F2121IDW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2121IDW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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