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MSP430F2121IDGV

Texas Instruments

MSP430F2121IDGV by Texas Instruments

MSP430F2121IDGV by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and PWM functionality. With 16 timers and peripherals like BOD, Comparator(8), Timer(16), WDT, it offers versatile control capabilities in a compact package style.

Median Price

$2.354

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 53,260 parts In-Stock

1+ parts

$2.354

100+ parts

$1.944

1k+ parts

$1.051

10k+ parts

-

53,260

$2.354

$1.944

$1.051

-

Mouser Electronics

USA . 359 parts In-Stock

1+ parts

$4.190

100+ parts

$2.140

1k+ parts

$1.580

10k+ parts

$1.510

359

$4.190

$2.140

$1.580

$1.510

Rochester

USA . 94 parts In-Stock

1+ parts

-

100+ parts

$1.370

1k+ parts

$1.220

10k+ parts

$1.150

94

-

$1.370

$1.220

$1.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 89 parts In-Stock

1+ parts

$1.060

100+ parts

-

1k+ parts

-

10k+ parts

-

89

$1.060

-

-

-

Digiode

USA . 4,462 parts In-Stock

1+ parts

$1.387

100+ parts

-

1k+ parts

-

10k+ parts

-

4,462

$1.387

-

-

-

Vyrian

USA . 7,023 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,023

-

-

-

-

Euro-Tech

UK . 358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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358

-

-

-

-

A&K Electronics

USA . 41 parts In-Stock

1+ parts

-

100+ parts

-

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41

-

-

-

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Rotakorn

Sweden . 41 parts In-Stock

1+ parts

-

100+ parts

-

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41

-

-

-

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Bristol Electronics

USA . 41 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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41

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,684 parts In-Stock

1+ parts

$1.314

100+ parts

-

1k+ parts

-

10k+ parts

-

2,684

$1.314

-

-

-

Parana Technologies

USA . 1,391 parts In-Stock

1+ parts

$52.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,391

$52.800

-

-

-

ChromeModa Solutions

Germany . 3,316 parts In-Stock

1+ parts

$59.326

100+ parts

$48.647

1k+ parts

-

10k+ parts

-

3,316

$59.326

$48.647

-

-

IDEA Electronic Components Group

UK . 1,730 parts In-Stock

1+ parts

$59.326

100+ parts

$56.360

1k+ parts

$53.393

10k+ parts

-

1,730

$59.326

$56.360

$53.393

-

Authorized Procurement Solutions

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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12,000

-

-

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Perfect Parts

USA . 6,983 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,983

-

-

-

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DigiPath Technology Company

USA . 1,142 parts In-Stock

1+ parts

-

100+ parts

$53.488

1k+ parts

-

10k+ parts

-

1,142

-

$53.488

-

-

Overview

Unlock the power of innovation with the MSP430F2121IDGV microcontroller by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products that are reliable and efficient. Ideal for a wide range of applications, this microcontroller offers customers unparalleled value with its low power consumption, high performance, and versatile features. Whether you are working on IoT devices, consumer electronics, or industrial automation, the MSP430F2121IDGV is the perfect solution to bring your ideas to life. Experience the difference today and elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and cost-effective.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for more power to be delivered to the microcontroller, enabling better performance.

CPU Family: MSP430

Being part of the MSP430 family means the microcontroller benefits from low power consumption and high performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and high-speed operation of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller reliable and energy-efficient.

Maximum Clock Frequency: 16 MHz

High clock frequency allows the microcontroller to process data at a faster rate, improving overall performance.

Technical Specifications

Microcontrollers MSP430F2121IDGV attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2121IDGV Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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