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MSP430F2101TPWR

Texas Instruments

MSP430F2101TPWR by Texas Instruments

MSP430F2101TPWR by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. Operating at up to 16 MHz, it features 16 timers, PWM channels, and ADC channels. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$1.458

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,883 parts In-Stock

1+ parts

$1.458

100+ parts

$1.204

1k+ parts

$0.651

10k+ parts

-

10,883

$1.458

$1.204

$0.651

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,931 parts In-Stock

1+ parts

$1.385

100+ parts

-

1k+ parts

-

10k+ parts

-

3,931

$1.385

-

-

-

Vyrian

USA . 4,304 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,304

-

-

-

-

Schukat

Germany . 1,995 parts In-Stock

1+ parts

-

100+ parts

$0.810

1k+ parts

$0.780

10k+ parts

-

1,995

-

$0.810

$0.780

-

Bristol Electronics

USA . 552 parts In-Stock

1+ parts

-

100+ parts

$1.204

1k+ parts

$0.674

10k+ parts

-

552

-

$1.204

$0.674

-

Dan-Mar Components

USA . 552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

552

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,275 parts In-Stock

1+ parts

$1.312

100+ parts

-

1k+ parts

-

10k+ parts

-

4,275

$1.312

-

-

-

Microchip USA

USA . 1,740 parts In-Stock

1+ parts

$5.770

100+ parts

-

1k+ parts

-

10k+ parts

-

1,740

$5.770

-

-

-

AZTECH Wire

Italy . 531 parts In-Stock

1+ parts

$16.640

100+ parts

-

1k+ parts

-

10k+ parts

-

531

$16.640

-

-

-

Parana Technologies

USA . 109 parts In-Stock

1+ parts

$71.787

100+ parts

-

1k+ parts

-

10k+ parts

-

109

$71.787

-

-

-

DigiPath Technology Company

USA . 355 parts In-Stock

1+ parts

$79.046

100+ parts

$72.722

1k+ parts

-

10k+ parts

-

355

$79.046

$72.722

-

-

IDEA Electronic Components Group

UK . 1,606 parts In-Stock

1+ parts

$80.659

100+ parts

$76.626

1k+ parts

$72.593

10k+ parts

-

1,606

$80.659

$76.626

$72.593

-

ChromeModa Solutions

Germany . 850 parts In-Stock

1+ parts

$80.659

100+ parts

$66.140

1k+ parts

-

10k+ parts

-

850

$80.659

$66.140

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430F2101TPWR microcontroller! Designed to push boundaries and deliver cutting-edge performance, this device offers unparalleled quality and reliability. With a wide range of applications in various industries, this microcontroller provides customers with value, efficiency, and innovation. Say hello to seamless integration, enhanced productivity, and unmatched versatility with the MSP430F2101TPWR by Texas Instruments. Elevate your projects to new heights with this top-of-the-line microcontroller solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy is a durable and cost-effective material for packaging microcontrollers, ensuring the product is reliable and long-lasting.

Bit Size: 16

The 16-bit architecture allows for more efficient processing and handling of data, making this microcontroller suitable for a wide range of applications.

Power Supplies (V): 2/3.3

The availability of multiple power supply options (2V and 3.3V) makes this microcontroller versatile and compatible with different voltage systems.

ADC Channels: YES

Having analog-to-digital converter channels enables the microcontroller to interface with analog sensors and signals, expanding its functionality in embedded systems.

ROM Programmability: FLASH

The FLASH programmable ROM allows for flexible and easy firmware updates, enhancing the usability and adaptability of the microcontroller in various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable for battery-operated devices.

Technical Specifications

Microcontrollers MSP430F2101TPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2101TPWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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