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MSP430F2101TDGV

Texas Instruments

MSP430F2101TDGV by Texas Instruments

MSP430F2101TDGV by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like 16 timers, PWM channels, and ADC capabilities, it offers versatile functionality in compact dimensions for various embedded systems.

Median Price

$1.754

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,060 parts In-Stock

1+ parts

$1.933

100+ parts

$1.597

1k+ parts

$0.863

10k+ parts

-

5,060

$1.933

$1.597

$0.863

-

DigiKey

USA . 450 parts In-Stock

1+ parts

$2.380

100+ parts

$1.454

1k+ parts

$1.357

10k+ parts

-

450

$2.380

$1.454

$1.357

-

Rochester

USA . 270 parts In-Stock

1+ parts

-

100+ parts

$1.520

1k+ parts

$1.260

10k+ parts

$1.120

270

-

$1.520

$1.260

$1.120

Verical

USA . 270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.575

10k+ parts

$1.400

270

-

-

$1.575

$1.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,338 parts In-Stock

1+ parts

$1.140

100+ parts

-

1k+ parts

-

10k+ parts

-

1,338

$1.140

-

-

-

TME

Poland . 90 parts In-Stock

1+ parts

$1.220

100+ parts

-

1k+ parts

-

10k+ parts

-

90

$1.220

-

-

-

Vyrian

USA . 6,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,129

-

-

-

-

DigiKey Marketplace

USA . 1,080 parts In-Stock

1+ parts

-

100+ parts

$1.250

1k+ parts

-

10k+ parts

-

1,080

-

$1.250

-

-

Bristol Electronics

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$1.026

1k+ parts

-

10k+ parts

-

180

-

$1.026

-

-

Dan-Mar Components

USA . 180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

180

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,578 parts In-Stock

1+ parts

$1.080

100+ parts

-

1k+ parts

-

10k+ parts

-

4,578

$1.080

-

-

-

Microchip USA

USA . 1,560 parts In-Stock

1+ parts

$8.125

100+ parts

-

1k+ parts

-

10k+ parts

-

1,560

$8.125

-

-

-

Parana Technologies

USA . 318 parts In-Stock

1+ parts

$53.056

100+ parts

-

1k+ parts

-

10k+ parts

-

318

$53.056

-

-

-

DigiPath Technology Company

USA . 1,317 parts In-Stock

1+ parts

$58.422

100+ parts

$53.748

1k+ parts

-

10k+ parts

-

1,317

$58.422

$53.748

-

-

ChromeModa Solutions

Germany . 2,645 parts In-Stock

1+ parts

$59.614

100+ parts

$48.883

1k+ parts

-

10k+ parts

-

2,645

$59.614

$48.883

-

-

IDEA Electronic Components Group

UK . 598 parts In-Stock

1+ parts

$59.614

100+ parts

$56.633

1k+ parts

$53.653

10k+ parts

-

598

$59.614

$56.633

$53.653

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430F2101TDGV microcontroller. Designed for high performance and reliability, this compact device offers a wide range of applications in industries such as automotive, healthcare, and consumer electronics. With advanced features like low power mode and on-chip program ROM, this microcontroller provides unparalleled value and efficiency to customers looking to streamline their product development process. Trust in Texas Instruments' reputation for quality and experience the advantages of cutting-edge technology with the MSP430F2101TDGV.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wider range of systems.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities and efficiency for the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller ensures streamlined operation and faster processing speeds, making it a powerful choice for embedded systems.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast execution of instructions and efficient operation of the microcontroller.

ADC Channels: YES

Presence of ADC channels allows for analog input processing, making the microcontroller suitable for applications involving sensor interfacing and data acquisition.

Technical Specifications

Microcontrollers MSP430F2101TDGV attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2101TDGV Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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