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MSP430F2013IN

Texas Instruments

MSP430F2013IN by Texas Instruments

MSP430F2013IN by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Features include ADC channels, PWM channels, and connectivity options like I2C, SPI, and USI.

Median Price

$2.926

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 31,197 parts In-Stock

1+ parts

$2.464

100+ parts

$2.159

1k+ parts

$1.220

10k+ parts

-

31,197

$2.464

$2.159

$1.220

-

RS (Exports)

UK . 2 parts In-Stock

1+ parts

$3.389

100+ parts

$3.127

1k+ parts

$3.048

10k+ parts

-

2

$3.389

$3.127

$3.048

-

DigiKey

USA . 394 parts In-Stock

1+ parts

$3.880

100+ parts

$2.431

1k+ parts

$2.169

10k+ parts

$2.104

394

$3.880

$2.431

$2.169

$2.104

Mouser Electronics

USA . 384 parts In-Stock

1+ parts

$3.880

100+ parts

$2.430

1k+ parts

$2.100

10k+ parts

-

384

$3.880

$2.430

$2.100

-

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$2.150

1k+ parts

$1.588

10k+ parts

$1.450

1,000

-

$2.150

$1.588

$1.450

Rochester

USA . 89 parts In-Stock

1+ parts

-

100+ parts

$1.930

1k+ parts

$1.730

10k+ parts

$1.620

89

-

$1.930

$1.730

$1.620

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,232 parts In-Stock

1+ parts

$1.767

100+ parts

-

1k+ parts

-

10k+ parts

-

1,232

$1.767

-

-

-

TME

Poland . 9 parts In-Stock

1+ parts

$2.220

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$2.220

-

-

-

Vyrian

USA . 3,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,034

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,951 parts In-Stock

1+ parts

$1.674

100+ parts

-

1k+ parts

-

10k+ parts

-

4,951

$1.674

-

-

-

Advanced Electronics

New Zealand . 27 parts In-Stock

1+ parts

$38.636

100+ parts

$35.159

1k+ parts

$31.682

10k+ parts

-

27

$38.636

$35.159

$31.682

-

Parana Technologies

USA . 1,804 parts In-Stock

1+ parts

$57.528

100+ parts

-

1k+ parts

-

10k+ parts

-

1,804

$57.528

-

-

-

DigiPath Technology Company

USA . 833 parts In-Stock

1+ parts

$63.345

100+ parts

-

1k+ parts

-

10k+ parts

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833

$63.345

-

-

-

ChromeModa Solutions

Germany . 2,124 parts In-Stock

1+ parts

$64.638

100+ parts

$53.003

1k+ parts

-

10k+ parts

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2,124

$64.638

$53.003

-

-

IDEA Electronic Components Group

UK . 2,012 parts In-Stock

1+ parts

$64.638

100+ parts

$61.406

1k+ parts

$58.174

10k+ parts

-

2,012

$64.638

$61.406

$58.174

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A-Z Elektronik GmbH

Germany . 6,845 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,845

-

-

-

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Perfect Parts

USA . 1,802 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,802

-

-

-

-

Overview

Unlock the full potential of your projects with the Texas Instruments MSP430F2013IN microcontroller. Designed by a trusted manufacturer, this powerful device offers reliability and efficiency for a wide range of applications. With features like low power mode, PWM channels, and connectivity options such as I2C, SPI, and USI, this microcontroller provides endless possibilities for your designs. Say goodbye to limitations and hello to innovation with the MSP430F2013IN - the perfect solution for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in powering the microcontroller in different systems.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle complex calculations and processes efficiently.

ADC Channels: YES

The analog to digital converters allow for interfacing with analog sensors or signals, expanding the range of applications for this microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller ensures efficient processing and improved performance in handling data and instructions.

Low Power Mode: YES

The presence of a low power mode helps in conserving energy, making this microcontroller suitable for battery-operated devices or applications where power consumption is critical.

Technical Specifications

Microcontrollers MSP430F2013IN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.305 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, TIMER(2), WDT"

Analog To Digital Convertors:

1-Ch 16-Bit

Trade Compliance

MSP430F2013IN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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