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MSP430F2011TRSAR

Texas Instruments

MSP430F2011TRSAR by Texas Instruments

MSP430F2011TRSAR by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 128 RAM bytes. Operating at up to 16 MHz, it features peripherals like BOD, Comparator(8), Timer(2), and WDT. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$1.293

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 158,990 parts In-Stock

1+ parts

$1.568

100+ parts

$1.295

1k+ parts

$0.700

10k+ parts

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158,990

$1.568

$1.295

$0.700

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Arrow

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$1.018

6,000

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-

-

$1.018

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Digiode

USA . 3,836 parts In-Stock

1+ parts

$1.490

100+ parts

-

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10k+ parts

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3,836

$1.490

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

1+ parts

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3,000

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Vyrian

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Distributors (Availability)

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Corphita

USA . 4,364 parts In-Stock

1+ parts

$1.411

100+ parts

-

1k+ parts

-

10k+ parts

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4,364

$1.411

-

-

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Microchip USA

USA . 1,710 parts In-Stock

1+ parts

$6.200

100+ parts

$6.170

1k+ parts

$6.150

10k+ parts

$6.130

1,710

$6.200

$6.170

$6.150

$6.130

AZTECH Wire

Italy . 453 parts In-Stock

1+ parts

$12.900

100+ parts

-

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453

$12.900

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Parana Technologies

USA . 1,300 parts In-Stock

1+ parts

$55.277

100+ parts

$5,133.309

1k+ parts

$49.749

10k+ parts

-

1,300

$55.277

$5,133.309

$49.749

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DigiPath Technology Company

USA . 592 parts In-Stock

1+ parts

$60.867

100+ parts

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592

$60.867

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ChromeModa Solutions

Germany . 5,376 parts In-Stock

1+ parts

$62.109

100+ parts

$50.929

1k+ parts

-

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5,376

$62.109

$50.929

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IDEA Electronic Components Group

UK . 2,147 parts In-Stock

1+ parts

$62.109

100+ parts

$59.004

1k+ parts

$55.898

10k+ parts

-

2,147

$62.109

$59.004

$55.898

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2011TRSAR microcontroller. As a leader in the industry, Texas Instruments delivers top-quality products that are reliable and efficient. Ideal for a wide range of applications, this microcontroller offers unmatched performance and versatility. Experience seamless operation and superior functionality, all while enjoying the peace of mind that comes with choosing a trusted brand like Texas Instruments. Elevate your projects to new heights with the MSP430F2011TRSAR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easier assembly and more compact designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage makes this microcontroller suitable for a wide range of applications.

On Chip Data RAM Width: 8

Having a width of 8 for on-chip data RAM allows for efficient data processing.

Package Shape: SQUARE

The square package shape helps in having a symmetrical layout and efficient use of space on the circuit board.

Bit Size: 16

With a bit size of 16, this microcontroller can handle data in larger chunks, enabling faster processing.

Power Supplies (V): 2/3.3

Having multiple power supply options of 2V and 3.3V adds to the versatility of this microcontroller.

No. of Terminals: 16

With 16 terminals, there are plenty of I/O options for connecting to external devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles provide flexibility in terms of thermal management and overall design requirements.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for efficiency in power consumption.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications where temperature fluctuations occur.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with other MSP430 devices and software.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and strong mechanical support.

ROM Words: 2048

With 2048 ROM words, this microcontroller can store a large amount of program data.

Maximum Seated Height: 1 mm

The low maximum seated height makes this microcontroller suitable for compact designs.

RAM Words: 0.125

Having 0.125 RAM words allows for efficient data storage and retrieval during operation.

Width: 4 mm

The compact width of 4mm makes this microcontroller suitable for space-constrained applications.

Boundary Scan: YES

Having boundary scan capability allows for easier testing and debugging of the microcontroller.

Peripherals: BOD, COMPARATOR(8), TIMER(2), WDT

The integrated peripherals enhance the functionality and versatility of this microcontroller.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16MHz, this microcontroller can process data at high speeds.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during manufacturing.

Length: 4 mm

The short length of 4mm adds to the overall compactness of this microcontroller.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller ensures efficient processing and execution of instructions.

No. of Timers: 2

Having 2 timers allows for precise timing control in various applications.

RAM Bytes: 128

With 128 RAM bytes, this microcontroller can efficiently handle data storage during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing and assembly process.

Maximum Supply Current: 0.37 mA

The low maximum supply current ensures efficient power consumption during operation.

Nominal Supply Voltage: 2.2 V

The nominal supply voltage of 2.2V ensures stable operation of the microcontroller.

PWM Channels: YES

Having PWM channels allows for precise control of analog signals, making this microcontroller suitable for motor control and other applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the program code.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting and compact PCB designs.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances computational efficiency.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that this microcontroller can withstand moderate humidity levels during storage and handling.

Speed: 16 rpm

With a speed of 16 rpm, this microcontroller can execute instructions quickly and efficiently.

Low Power Mode: YES

The low power mode allows for energy-efficient operation, making this microcontroller suitable for battery-powered applications.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM allows for efficient storage and retrieval of program instructions.

No. of I/O Lines: 10

Having 10 I/O lines provides sufficient connectivity for interfacing with external devices and sensors.

Technical Specifications

Microcontrollers MSP430F2011TRSAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(2), WDT"

Trade Compliance

MSP430F2011TRSAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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