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MSP430F2003TRSAR

Texas Instruments

MSP430F2003TRSAR by Texas Instruments

MSP430F2003TRSAR by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. With peripherals like BOD, TIMER(2), WDT and connectivity options such as I2C, SPI, USI, it offers versatile solutions in a compact chip carrier package.

Median Price

$1.988

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,950 parts In-Stock

1+ parts

$1.988

100+ parts

$1.742

1k+ parts

$0.984

10k+ parts

-

5,950

$1.988

$1.742

$0.984

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,507 parts In-Stock

1+ parts

$1.889

100+ parts

-

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4,507

$1.889

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Vyrian

USA . 4,629 parts In-Stock

1+ parts

-

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4,629

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Distributors (Availability)

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Corphita

USA . 474 parts In-Stock

1+ parts

$1.789

100+ parts

-

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-

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474

$1.789

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-

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Ampacity Inc.

Singapore . 5,708 parts In-Stock

1+ parts

$3.680

100+ parts

-

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5,708

$3.680

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AZTECH Wire

Italy . 1,116 parts In-Stock

1+ parts

$9.200

100+ parts

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1,116

$9.200

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Parana Technologies

USA . 2,185 parts In-Stock

1+ parts

$63.253

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2,185

$63.253

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DigiPath Technology Company

USA . 1,143 parts In-Stock

1+ parts

$69.650

100+ parts

$64.078

1k+ parts

-

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1,143

$69.650

$64.078

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ChromeModa Solutions

Germany . 4,313 parts In-Stock

1+ parts

$71.071

100+ parts

$58.278

1k+ parts

-

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4,313

$71.071

$58.278

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IDEA Electronic Components Group

UK . 1,136 parts In-Stock

1+ parts

$71.071

100+ parts

$67.517

1k+ parts

$63.964

10k+ parts

-

1,136

$71.071

$67.517

$63.964

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QUARKTWIN TECHNOLOGY LTD

USA . 22,195 parts In-Stock

1+ parts

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22,195

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Component Stockers USA

USA . 8,191 parts In-Stock

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8,191

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Microchip USA

USA . 3,305 parts In-Stock

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3,305

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Overview

Revolutionize your projects with the MSP430F2003TRSAR microcontroller from Texas Instruments. Boasting top-tier quality and reliability, this powerful device opens up a world of possibilities in various applications. From IoT devices to consumer electronics, this microcontroller offers unmatched value with its low power consumption and high performance. Say goodbye to limitations and hello to endless innovation with the MSP430F2003TRSAR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protects the internal components of the microcontroller.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltage, making it versatile for various applications.

On Chip Data RAM Width: 8

8-bit data RAM width enhances data processing capabilities.

Package Shape: SQUARE

Square package shape allows for compact and efficient placement on PCBs.

Bit Size: 16

16-bit architecture enhances computational power and processing speed.

Power Supplies (V): 2/3.3

Supports multiple power supply voltages, providing flexibility in design and operation.

No. of Terminals: 16

Provides sufficient I/O options for interfacing with external devices and components.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage enables energy-efficient operation.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance makes it suitable for industrial environments.

CPU Family: MSP430

Part of the MSP430 family which is known for low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environments.

ADC Channels: YES

Built-in ADC channels enable analog signal processing and conversion.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connections on the PCB.

ROM Words: 1024

Ample ROM capacity for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance and efficiency of the microcontroller.

No. of Timers: 2

Multiple timers enable precise timing functions in applications.

RAM Bytes: 128

Sufficient RAM capacity for data storage and manipulation.

Analog To Digital Convertors: 1-Ch 16-Bit

High-resolution ADC supports accurate analog-to-digital conversions.

PWM Channels: YES

PWM channels enable precise control of power output for various applications.

Connectivity: I2C, SPI, USI

Support for popular communication protocols ensures seamless integration with other devices.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware.

Low Power Mode: YES

Low power mode functionality helps save energy and prolong battery life.

Technical Specifications

Microcontrollers MSP430F2003TRSAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, TIMER(2), WDT"

Analog To Digital Convertors:

1-Ch 16-Bit

Trade Compliance

MSP430F2003TRSAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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