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MSP430F2002TRSAR

Texas Instruments

MSP430F2002TRSAR by Texas Instruments

MSP430F2002TRSAR by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Featuring ADC channels, PWM channels, and connectivity options like I2C and SPI, it offers versatile peripheral support for various embedded systems.

Median Price

$1.347

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 66,000 parts In-Stock

1+ parts

$1.743

100+ parts

$1.439

1k+ parts

$0.778

10k+ parts

-

66,000

$1.743

$1.439

$0.778

-

Arrow

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.951

9,000

-

-

-

$0.951

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,059 parts In-Stock

1+ parts

$1.656

100+ parts

-

1k+ parts

-

10k+ parts

-

2,059

$1.656

-

-

-

TME

Poland . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.477

9,000

-

-

-

$1.477

Vyrian

USA . 3,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,285

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,489 parts In-Stock

1+ parts

$1.569

100+ parts

-

1k+ parts

-

10k+ parts

-

2,489

$1.569

-

-

-

AZTECH Wire

Italy . 407 parts In-Stock

1+ parts

$19.710

100+ parts

-

1k+ parts

-

10k+ parts

-

407

$19.710

-

-

-

Parana Technologies

USA . 2,267 parts In-Stock

1+ parts

$50.101

100+ parts

-

1k+ parts

-

10k+ parts

-

2,267

$50.101

-

-

-

ChromeModa Solutions

Germany . 3,940 parts In-Stock

1+ parts

$56.293

100+ parts

$46.160

1k+ parts

-

10k+ parts

-

3,940

$56.293

$46.160

-

-

IDEA Electronic Components Group

UK . 1,100 parts In-Stock

1+ parts

$56.293

100+ parts

$53.478

1k+ parts

$50.664

10k+ parts

-

1,100

$56.293

$53.478

$50.664

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,227

-

-

-

-

DigiPath Technology Company

USA . 635 parts In-Stock

1+ parts

-

100+ parts

$50.754

1k+ parts

-

10k+ parts

-

635

-

$50.754

-

-

Overview

Unlock the power of cutting-edge technology with the MSP430F2002TRSAR by Texas Instruments, a top-of-the-line microcontroller designed to revolutionize your projects. Crafted with precision and expertise, this product offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, its advanced features and low power consumption make it a must-have for any tech enthusiast. Elevate your creations and unleash your creativity with the MSP430F2002TRSAR - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the microcontroller easier to handle and less prone to damage during handling and operation.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for a wider range of applications and compatibility with different power sources.

Bit Size: 16

With a 16-bit size, the microcontroller can process larger amounts of data simultaneously, improving overall performance and efficiency.

ADC Channels: YES

Having Analog to Digital Converter channels enables the microcontroller to interface with analog sensors and signals, expanding its functionality.

Maximum Clock Frequency: 16 MHz

A high maximum clock frequency of 16 MHz allows the microcontroller to execute instructions quickly, enhancing overall processing speed.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller allows for efficient execution of instructions, making it suitable for real-time applications and low power consumption.

Connectivity: I2C, SPI, USI

Support for various connectivity options like I2C, SPI, and USI enables easy integration with other devices, enhancing communication capabilities.

ROM Programmability: FLASH

Using Flash memory for ROM programmability allows for easy and fast reprogramming of the microcontroller, making it versatile for different applications.

Low Power Mode: YES

The presence of a low power mode helps in conserving energy consumption, making the microcontroller suitable for battery-powered devices and applications requiring energy efficiency.

Technical Specifications

Microcontrollers MSP430F2002TRSAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F2002TRSAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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