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MSP430F149IRTDRG4

Texas Instruments

MSP430F149IRTDRG4 by Texas Instruments

MSP430F149IRTDRG4 by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 8 MHz. It features 2048 bytes of RAM, 61696 ROM words, and an 8-Ch 12-Bit ADC for industrial applications requiring low power consumption and high performance. With SPI, UART, and USART connectivity options, it's ideal for designs needing multiple peripherals like comparators, PWMs, timers, and watchdog timers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,753 parts In-Stock

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Digiode

USA . 2,409 parts In-Stock

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2,409

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Distributors (Availability)

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One Stop Electronics

USA . 1,382 parts In-Stock

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$1.000

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1,382

$1.000

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AZTECH Wire

Italy . 453 parts In-Stock

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$7.727

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453

$7.727

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Parana Technologies

USA . 2,063 parts In-Stock

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$17.575

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$17.773

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DigiPath Technology Company

USA . 1,107 parts In-Stock

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$19.352

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1,107

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ChromeModa Solutions

Germany . 6,882 parts In-Stock

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$19.747

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$16.193

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6,882

$19.747

$16.193

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IDEA Electronic Components Group

UK . 1,843 parts In-Stock

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$19.747

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$18.760

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$17.772

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Component Stockers USA

USA . 368 parts In-Stock

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$99.990

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Corphita

USA . 4,195 parts In-Stock

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Microchip USA

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F149IRTDRG4 microcontroller. Designed for high-quality performance, this versatile chip offers a wide range of applications in various industries. With its advanced technology and reliable manufacturer, Texas Instruments, this microcontroller provides unmatched value and benefits to customers. Whether you're looking to enhance your product with peripherals like comparators or PWM channels, this microcontroller has you covered. Experience the advantages of the MSP430 family and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and resources.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V allows for flexibility in power source options.

Package Shape: SQUARE

Square-shaped package design helps in efficient space utilization on the PCB.

Bit Size: 16

A 16-bit architecture provides enhanced processing capabilities and performance for the microcontroller.

No. of Terminals: 64

Having 64 terminals enables connectivity with a variety of external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style allows for efficient heat dissipation and compact design to fit in compact electronic devices.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8 V allows for operation in low-power environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

CPU Family: MSP430

Belonging to the MSP430 family indicates high-performance, low-power consumption, and versatility in applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature makes the microcontroller suitable for use in extreme cold conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good conductivity and solderability for reliable connections.

ADC Channels: YES

Having ADC channels allows for analog input signal conversion, enabling measurement and control of analog signals.

Terminal Position: QUAD

Quad terminal position facilitates easy and organized integration with external components on the PCB.

ROM Words: 61696

Large ROM size of 61696 words provides ample memory storage for program code and data.

Maximum Seated Height: 0.9 mm

Low seated height enables compact and slim device designs with reduced overall dimensions.

Width: 9 mm

Compact width of 9 mm allows for space-efficient placement on the PCB.

Peripherals: COMPARATOR, POR, PWM, TIMER(2), WDT

Having various peripherals such as comparators, PWM, timers, and watchdog timer enhances the functionality and versatility of the microcontroller.

Maximum Clock Frequency: 8 MHz

Support for a maximum clock frequency of 8 MHz enables rapid processing and execution of instructions.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering during PCB assembly processes.

Length: 9 mm

Compact length of 9 mm contributes to the overall small form factor of the microcontroller package.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture delivers high performance, efficiency, and speed in data processing.

RAM Bytes: 2048

With 2048 bytes of RAM, the microcontroller can efficiently handle data processing and temporary storage requirements.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance for the microcontroller.

Terminal Form: NO LEAD

No-lead terminal form simplifies PCB assembly processes and reduces the risk of solder joint failures.

Analog To Digital Convertors: 8-Ch 12-Bit

Having 8 analog to digital converters with 12-bit resolution enables precise and accurate conversion of analog signals.

Nominal Supply Voltage: 2.2 V

Nominal supply voltage of 2.2 V offers a balance between power efficiency and performance for the microcontroller.

PWM Channels: YES

PWM channels facilitate the generation of precise and controlled pulse-width modulated signals for various applications.

Connectivity: SPI, UART, USART(2)

Support for SPI, UART, and USART connectivity options enhances communication capabilities with external devices and systems.

ROM Programmability: FLASH

ROM programmability via FLASH technology allows for flexible and easy reprogramming of the microcontroller firmware.

Terminal Pitch: 0.5 mm

Compact terminal pitch of 0.5 mm enables high-density PCB design with close component placement for space-saving layouts.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates medium sensitivity to moisture, which is suitable for standard surface mount assembly processes.

Speed: 8 rpm

Operating speed of 8 rpm provides sufficient processing power for various applications and tasks.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 bits allows for efficient storage and execution of program instructions.

No. of I/O Lines: 48

Having 48 I/O lines enables versatile external interfacing and connectivity options for input/output operations.

Technical Specifications

Microcontrollers MSP430F149IRTDRG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE DURING FLASH MEMORY PROGRAMMING IS 2.7V-3.6V

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

61696

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

8 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART, USART(2)

Peripherals:

COMPARATOR, POR, PWM, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F149IRTDRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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