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MSP430F133IRTDT

Texas Instruments

MSP430F133IRTDT by Texas Instruments

MSP430F133IRTDT by Texas Instruments is a 16-bit microcontroller with 8KB ROM, 256B RAM, and 8-channel 12-bit ADC. Ideal for industrial applications due to its low power mode, SPI, UART connectivity, and operating temperature range of -40°C to 85°C. Package style: Chip Carrier, Heat Sink/Slug with a max clock frequency of 8MHz.

Median Price

$4.370

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,150 parts In-Stock

1+ parts

$4.416

100+ parts

$3.600

1k+ parts

$2.400

10k+ parts

-

2,150

$4.416

$3.600

$2.400

-

Rochester

USA . 249 parts In-Stock

1+ parts

-

100+ parts

$3.460

1k+ parts

$3.090

10k+ parts

$2.910

249

-

$3.460

$3.090

$2.910

DigiKey

USA . 249 parts In-Stock

1+ parts

-

100+ parts

$4.550

1k+ parts

-

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249

-

$4.550

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Verical

USA . 249 parts In-Stock

1+ parts

-

100+ parts

$4.325

1k+ parts

$3.862

10k+ parts

$3.638

249

-

$4.325

$3.862

$3.638

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 807 parts In-Stock

1+ parts

$3.164

100+ parts

-

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807

$3.164

-

-

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Vyrian

USA . 3,519 parts In-Stock

1+ parts

-

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3,519

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LIBRA Elektronik GmbH

Germany . 147 parts In-Stock

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147

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LWI Electronics Inc

India . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 647 parts In-Stock

1+ parts

$2.997

100+ parts

-

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-

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647

$2.997

-

-

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Parana Technologies

USA . 2,098 parts In-Stock

1+ parts

$15.399

100+ parts

-

1k+ parts

$15.785

10k+ parts

-

2,098

$15.399

-

$15.785

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DigiPath Technology Company

USA . 1,327 parts In-Stock

1+ parts

$16.956

100+ parts

$15.599

1k+ parts

-

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1,327

$16.956

$15.599

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ChromeModa Solutions

Germany . 6,290 parts In-Stock

1+ parts

$17.302

100+ parts

$14.188

1k+ parts

-

10k+ parts

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6,290

$17.302

$14.188

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IDEA Electronic Components Group

UK . 327 parts In-Stock

1+ parts

$17.302

100+ parts

$16.437

1k+ parts

$15.572

10k+ parts

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327

$17.302

$16.437

$15.572

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Microchip USA

USA . 2,184 parts In-Stock

1+ parts

$29.150

100+ parts

$28.970

1k+ parts

$28.880

10k+ parts

$28.790

2,184

$29.150

$28.970

$28.880

$28.790

Kepictronics

USA . 1,448 parts In-Stock

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1,448

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Perfect Parts

USA . 715 parts In-Stock

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715

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Overview

Discover the Texas Instruments MSP430F133IRTDT microcontroller, a cutting-edge solution in the world of embedded systems. With a focus on quality and reliability, Texas Instruments has created a versatile product suitable for a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers high performance and low power consumption, making it an ideal choice for engineers looking to optimize their designs. Trust in Texas Instruments to deliver value and innovation with the MSP430F133IRTDT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can work with a wide range of power sources, providing flexibility in design.

No. of I/O Lines: 48

The ample number of I/O lines allows for versatile connectivity and interfacing with external devices, making it suitable for a range of applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and efficiency in executing instructions, making it a powerful choice for embedded systems.

ADC Channels: YES

The presence of ADC channels enables analog to digital conversion, allowing the microcontroller to interface with analog sensors and devices.

Technical Specifications

Microcontrollers MSP430F133IRTDT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, UART, USART(2)"

Peripherals:

"COMPARATOR, POR, PWM, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F133IRTDT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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